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Database: 365,228(8 Aug 2026)
elevated-temperature-curing one-part systems scopethis part one-component adhesives bulk specimens part adhesives metallurgical equipment-types copper-infiltrated tungsten electrical vane
GB/T 22376.2-2008 in English

GB/T 22376.2-2008 in English

VALID

Adhesives - Methods of preparing bulk specimens - Part 2: Elevated-temperature-curing one-part systems

  • Issued on:2008-09-18
  • Implemented on:2009-05-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $70.00
$68.00
Standard No: GB/T 22376.2-2008
Document status: VALID
Title in English: Adhesives - Methods of preparing bulk specimens - Part 2: Elevated-temperature-curing one-part systems
Title in Chinese: 胶粘剂 本体试样的制备方法 第2部分:热固化单组份体系
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2008-09-18
Implemented on: 2009-05-01
Chinese Classification: G38-Basic standards and general methods for adhesives
Professional Classification: GB-National Standard
Related Keywords: elevated-temperature-curing one-part systems scopethis part
one-component adhesives
bulk specimens
part
adhesives
Related Topics: Adhesive
Preparation
Sample preparation
Monomer pool in English
Infrared solid sample preparation method
Sample curing
Integrated sample divider
method of melting solids
Solid Sampler
Preparation
Solid UV test sample preparation
Solid sample preparation
single component
There are several methods of sample preparation for solids
flow sample fixation method
group sample method
Infrared solid sample preparation method
Sample Preparation Methods for Infrared Solids
Adhesive curing degree
GB/T 22376.2
GB/T 22376.2-2008
curing heat
Colloidal metastable system
Colloid preparation method
Solid sample preparation methods include
Colloid preparation method + examples
The sample preparation methods for infrared solids include
The sample preparation method for infrared solids includes grinding method
Methods for preparing antibodies
Methods for preparing colloids
Solid hydrogen spectrum test sample preparation method
The most commonly used methods for infrared solid sample preparation are
Infrared solid sample preparation methods include
Adhesive flexibility analysis method
Solid UV sample preparation method
Preparation method of colloid
Preparation method of infrared solid sample
Advantages and Disadvantages of Colloidal Gold Preparation Methods
Preparation method of solid enzyme
Commonly used methods for preparing colloids

《GB/T 22376.2-2008胶粘剂 本体试样的制备方法 第2部分:热固化单组份体系》由TC185(全国胶粘剂标准化技术委员会)归口,主管部门为中国石油和化学工业联合会。
GB/T 22376《胶黏剂 本体试样的制备方法》分为二个部分,本部分为GB/T 22376的第2部分。GB/T 22376的本部分规定了胶黏剂本体试样的制备方法。所述的制备方法适用于热固化、单组分胶黏剂,如环氧树脂类。不适用于通过溶剂挥发或气体释放而固化的胶黏剂。


Scope

This part of GB/T 22376 specifies the preparation method of the adhesive body sample. The preparation method is suitable for thermal curing, one-component adhesives, such as epoxy resins. Not suitable for adhesives that cure by solvent evaporation or gas evolution.

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