GB/T 27581-2011 in English

VALID

Electromagnetic interference shielding film—Electroless copper plating solution—Method of determining concentration of Ni2+ and Cu2+

Issued on:2011-12-05
Implemented on:2012-03-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $120.00
$117.00

Standard No:	GB/T 27581-2011
Document status:	VALID
Title in English:	Electromagnetic interference shielding film—Electroless copper plating solution—Method of determining concentration of Ni2+ and Cu2+
Title in Chinese:	电磁屏蔽膜化学镀铜溶液镍离子和铜离子含量测定方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2011-12-05
Implemented on:	2012-03-01
ICS Classification:	71.080.99-Other organic chemicals
Chinese Classification:	G15-Organic chemicals in general
Professional Classification:	GB-National Standard
Related Keywords:	electromagnetic interference shielding film electroless copper electroless copper copper ion content copper ions solution method
Related Topics:	Product ion definition chemical solution Product ion, parent ion definition Ion membrane instrument Product ion parent ion definition Copper ions Precursor Ion Product Ion Definition Precursor ion copper solution chemical ion source Method for detecting product ions Definition of parent ion + product ion Nickel ions Quantitative ion Copper ion concentration liquid nickel content Copper ion determination Copper ions Copper ion concentration chemical ion source Copper ion concentration Determination method of uranium ion Copper ion detection Ion coating machine Quantifier ions are different ion content UV detection of copper ions ionic way Copper ion detection Nickel ions solution film Product ion quantification magnetic field ions How to determine the parent ion product ion Solution metal ion content solution ion Nickel ion determination Ion coater content metal ion solution copper ion solution na ion content Precursor ion quantification Copper ion concentration meter Determination method of ammonium ion content Copper ion + device copper ion method Copper ions in Copper ion UV How to Determine Product and Precursor Ions Negative Chemical Ion Source vs. Positive Chemical Ion Copper ion concentration meter Nickel content Liquid nickel Ion trap quantification magneton electron in-solution plasma method solution ion How to detect trace copper ions Ion trap quantification Copper ion Manganese ion Ultraviolet trace detection of copper ions maldi ionization method Product ion monitoring Quantitative copper ion Potential ion Ion coater How to determine the parent ion product ion copper chloride ion degree of ionization Ionic liquid membrane Liquid Phase Triple Quadrupole Precursor Product Ions membrane solution Precursor ion quantification ionizing electric field Precursor ion/product ion detection electron ionization ion content Definition of Precursor and Product Ions ion trap fluid Determination method of ammonium ion content Equipment for Determination of Ion Content Determination of copper content in solution more ionized Argon ion copper target electron ionization Argon ion+copper target Trace copper ion concentration ion content Copper shielding box plasma solution Copper shielding box Glycoside ionization Electromagnetic shielding film copper ion iron time membrane solution magneton solution Trace copper ion detection Trace copper ion detection How to determine precursor ion and product ion field ionization ion trap solution Magnesium ion content method Cadmium ion solution Ion content equipment ionic chemicals Cadmium ion solution copper ions in water Determination of nickel ions in water Determination of trace copper ions by UV copper ion solution cuso How to use ions solution copper ion ionization UV copper ion content Copper ion content in water Instruments for Measuring Ion Content Copper ion content Ionic solution method ion trap ion capacity resolution solution Nickel ion solution Copper ion content Ion content method Determination of barium ion content Ion Chromatography Copper Ion ionic method Copper ion determination method Water copper ion content Instrument ion coating machine Calcium ion content determination method ionization measurement Determination of nickel ions in solution Nickel ion UV metal ion solution Copper ion UV detection Total Ion Determination Method copper ion copper copper potential Quantitative transition q1 copper iron ion Determination method of content of ammonium ion Various ionization methods Solution ion analysis method Determination method of copper ion Ammonia cupric ion Copper ion Nickel ion ion trap magnetic field normal ionization Copper oxide copper content determination method ion solvation Ionic Hydrazine Ionic Quantity Calcium ion content determination method maldi ionization Atomization of copper ions intron approach Determination method of copper content Copper content in copper solution Detection of trace amounts of copper ions Calcium ion content method UV Metal Ion Solution GBT27581 GB/T 27581-2011 Determination of copper ions in water Cobalt ion dissolution Product ion definition Cadmium ion content ion Ion measuring pen Ion separation method Odd electron ions and even electron ions SPE ion membrane Ferrous ion titration masking agent Method for measuring copper ion standard curve Method for determination of copper content in copper plating solutions PAN Molecular ionization method method of ionizing molecules Copper ion valence state analysis ficoll separation liquid method The significance of measuring copper ions How to test copper ions Nickel ion determination Determination method of ammonium ion content Copper-nickel separation method Nickel ion test Copper ion content in drinking water Metal ion content detection method Chloride ion to copper Testing standards for copper ion content in tin blocks Blood copper ion detection method Liquid chromatography method for determination of sodium ion content in solutions Electroplating film thickness measurement method Detection method of nickel sulfate liquid ions Food copper ion detection method Measurement method of electroplating film thickness Divalent copper ion concentration detection method Method for determination of copper ion content in copper sulfate solution Copper ion assay Copper ion content in water by country Storage method separation membrane Storage method separation membrane Thunder magnetic ion measurement method for lead ions Electromagnetic shielding for electronic products Copper ion content of rotor cooling water Electrochemical method to test ionic conductivity Method for detecting phosphorus content in copper-containing solutions Ionic intermediate membrane quality What are the separation methods for copper nickel chloride? Commonly used membrane separation methods Copper ion titration method Titration test method for copper ions in solution Chemical identification method of cadmium ions Ion dissolution testing Cobalt ion detection standard in solution Ion plating company Determination of sodium ions by electrochemical method Thunder magnetic ion measurement method for chloride ions Copper ion standard curve Comparing electron impact ionization and soft ionization methods Water quality copper ion determination method Copper ion iron ion calibration Separation membrane leachable detection National standard detection method for copper ions Ion detection electrochemical method Spray tin copper ion content national standard Method for determination of arsenic ions in solution Nickel ion content detection Determination of divalent copper ions Material copper ion content Copper plating Test methods for ion dissolution Quantitative methods for ionic liquids National standard emission of copper ions Formic acid ion content determination method Detection methods of ion channels in botany Method for determining molecular ion peak Methods for regulating ions inside and outside the membrane Ionization methods are hard ionization and soft ionization

《GB/T 27581-2011电磁屏蔽膜化学镀铜溶液镍离子和铜离子含量测定方法》由TC431（全国光学功能薄膜材料标准化技术委员会）归口，主管部门为中国石油和化学工业联合会。

Scope

Warning: Some chemical reagents used in this test method are toxic and corrosive, and some experimental processes may lead to dangerous situations. Operators should take appropriate safety and health measures. This standard specifies the determination method of nickel ion and copper ion content in electroless copper plating solution for electromagnetic shielding film. This standard is applicable to the test of nickel ion and copper ion content in electroless copper plating solution for electromagnetic shielding film. Measuring range: the concentration of nickel ions in the electroless copper plating solution is calculated as NiSO₄.6H₂O, and is 0.20g/L～2.00g/L; the concentration of copper ions in the electroless copper plating solution is measured as CuSO₂ Subscript 4>.5H₂O is calculated as 5.0g/L～60.0g/L.

More samples: NB/T 47013.2-2015 QC/T 942-2021 JJG 21-2008

Sample only — not a preview of GB/T 27581-2011

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