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lead-free solders special solders leaded solders solders high-quality interconnections quantum secure communication systems self-heating intra-provincial transportation quarantine terms
GB/T 31476-2015 in English

GB/T 31476-2015 in English

VALID

Requirements for solders for high-quality interconnections in electronics assembly

  • Issued on:2015-05-15
  • Implemented on:2016-01-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $250.00
$243.00
Standard No: GB/T 31476-2015
Document status: VALID
Title in English: Requirements for solders for high-quality interconnections in electronics assembly
Title in Chinese: 电子装联高质量内部互连用焊料
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2015-05-15
Implemented on: 2016-01-01
Professional Classification: GB-National Standard
Related Keywords: lead-free solders
special solders
leaded solders
solders
high-quality interconnections
Related Topics: high quality
solder
Electronic assembly
Assembly material
Assembly material
Continuous use
electronic solder
GB/T 31476
internal quantum yield
GBT31476
GB/T 31476-2015
GC-MS internal standard
Military electronic assembly

《GB/T 31476-2015电子装联高质量内部互连用焊料》由TC47(全国印制电路标准化技术委员会)归口,主管部门为工业和信息化部(电子)。
本标准规定了电子装联高质量内部互连用焊料的分类、技术要求、试验方法、检验规则和产品的标志、包装、运输、储存。
本标准适用于电子产品组装中钎焊连接用的焊料,包括含铅焊料、无铅焊料和特殊焊料。


Scope

This standard specifies the classification, technical requirements, test methods, inspection rules and marking, packaging, transportation and storage of solders for high-quality internal interconnection of electronic assemblies. This standard applies to solders used for soldering connections in the assembly of electronic products, including leaded solders, lead-free solders and special solders.

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