electronic solder

electronic solder, Total:53 items.

The international standard classification for "electronic solder" includes: Materials for aerospace construction in general .

The Chinese standard classification for "electronic solder" includes: Electronic components .

National Metrological Verification Regulations of the People's Republic of China

JJG(电子) 02009-1995 Verification Regulations for Analog Electronic Voltmeter
JJG(电子) 11005-1988 18.6MHz and above frequency band electronic oscillator trial verification regulations
JJG(电子) 12022-1989 VS13 type black and white TV electronic test card generator verification regulations

Professional Standard - Electron

SJ/T 11391-2009 Solder Powder for Electronic Soldering Applications

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 41275.21-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21：Guidelines for transition to lead-free electronics
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2：Mitigation of deleterious effects of tin

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 31476-2015 Requirements for solders for high-quality interconnections in electronics assembly

National Metrological Technical Specifications of the People's Republic of China

JJF(电子) 19-1982 Verification method of GS-5A electronic tube tester
JJF(电子) 01-1982 Verification method of general electronic counter

IPC - Association Connecting Electronics Industries

IPC J-STD-006C-2013 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC J-STD-006B CHINESE CD-2006 Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IPC J-STD-006B JAPANESE-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC J-STD-006B JAPANESE CD-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC J-STD-006C CD-2013 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC J-STD-006B AMD 1 & 2-2009 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC J-STD-006C CHINESE-2013 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC J-STD-006C AMD 1-2017 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
IPC J-STD-006B AMD 1-2008 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
IPC J-STD-006B RUSSIAN-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: October 2008)
IPC J-STD-006-1995 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: August 1996)
IPC J-STD-006B CD-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications (Incorporates Amendment 1: October 2008@ Amendment 2: October 2009)

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC J-STD-006B-2006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

IN-BIS

IS 11516-1985 Specification for soft solders for electronic applications

US-ACEI

IPC J-STD-006A-2001 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Korean Agency for Technology and Standards (KATS)

KS C IEC 61190-1-3:2021 Attachment materials for electronic assembly — Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
KS C IEC 61190-1-3-2006(2016) Attachment materials for electronic assembly－Part 1－3：Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

KR-KS

KS C IEC 61190-1-3-2021 Attachment materials for electronic assembly — Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

International Electrotechnical Commission (IEC)

IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61190-1-3:2007/AMD1:2010 Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

SCC

DANSK DS/EN 61190-1-3/A1:2007 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
CEI EN 61190-1-3:2008 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
DANSK DS/EN IEC 61190-1-3:2018 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
DANSK DS/EN 61190-1-3:2007 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
CEI EN IEC 61190-1-3:2018 Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
CEI EN 61190-1-3/A1:2008 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
05/30133287 DC IEC 61190-1-3 ED 2. Attachment materials for electronic assembly. Part 1-3. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
DIN EN 61190-1-3 E:2015 Draft Document - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)

German Institute for Standardization

DIN EN IEC 61190-1-3:2018-09 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018 / Note: DIN...
DIN EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007

Spanish Association for Standardization (UNE)

UNE-EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)

GSO

OS GSO IEC 61190-1-3:2014 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
GSO IEC 61190-1-3:2014 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

British Standards Institution (BSI)

BS EN IEC 61190-1-3:2018 Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
BS EN 61190-1-3:2002 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Danish Standards Foundation

DS/EN 61190-1-3/A1:2010 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
DS/EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Lithuanian Standards Office

LST EN 61190-1-3-2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007)
LST EN 61190-1-3-2007/A1-2010 Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007/A1:2010)

RU-GOST R

GOST R 59681-2021 Assembly and installation of electronic modules. Solders, soldering fluxes, solder pastes. The type, composition, properties and applications

ECIA - Electronic Components Industry Association

486-1982 Solder Wicking Test Procedure for Sockets@ Plug-In Electronic Components