GB/T 32988-2016 in English
VALIDSynthetic quartz crystal wafer for optical low pass filter(OLPF)
- Issued on:2016-10-13
- Implemented on:2017-09-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$214.00
《GB/T 32988-2016人造石英光学低通滤波器晶片》由TC461（全国人工晶体标准化技术委员会）归口，主管部门为中国建筑材料联合会。
Introduction
GB/T32988-2016 Standard Overview
GB/T32988-2016 "Artificial Quartz Optical Low-Pass Filter Wafer" standard was officially implemented on September 1, 2017. The standard is managed by the National Technical Committee for Standardization of Artificial Crystals, and the main drafting units include Shuoguang Special Crystal Technology Co., Ltd. and Zhejiang Crystal Optoelectronics Technology Co., Ltd. This standard specifies the terminology, classification requirements, technical indicators and test methods of artificial quartz optical low-pass filter wafers in detail.
Core Terms and Definitions
| Term Name | Definition | Application Scenarios |
|---|---|---|
| Optical Low-Pass Filter Wafer | An optical substrate that allows light signal components below a specific frequency to pass through and suppresses signal components above that frequency. | Applied in optoelectronic systems, such as camera modules. |
| FQA | The central area of the wafer surface, excluding the area at a specific distance X from the edge. | Used to evaluate the core performance indicators of the wafer. |
| Inclusions | Visible foreign matter in the crystal, commonly conopyroxene. | Critical defects that affect the optical performance of the wafer. |
Standard Grading and Technical Requirements
Wafers are divided into two levels according to stripe defects. The specific requirements are as follows:
| Grade | Stripe shape | Effective area ratio (%) |
|---|---|---|
| Grade A | No stripe or ≤2 stripes | ≤5% |
| Grade B | No stripe or ≤1 stripe | ≤5% |
Test Methods and Quality Control
Key Indicator Test Steps
- Inclusion and crack detection: Use an LED light source with a brightness of not less than 1000lm combined with a 10x magnifying glass to observe abnormal bright or dark spots inside the wafer by reflected light method and transmitted light method.
- Strip detection: Use a vein detector to test the extinction coefficient by circular polarization light method to determine the shape and quantity level of the stripes.
- Dimension and angle measurement: Use a measuring tool or X-ray orienter with an accuracy of not less than 0.02mm for testing.
Implementation suggestions
To ensure compliance with GB/T32988-2016 standards, it is recommended to take the following measures:
- Establish a complete quality control system to ensure that each batch of products passes full inspection and random inspection.
- Equipped with advanced testing equipment, such as vein detectors and image mapping instruments, to meet the needs of precision testing.
- Strengthen staff training, especially the understanding and operation of complex testing methods.
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