GB/T 33016-2016 in English
VALIDTest methods for bongding sheet for multilayer printed boards
- Issued on:2016-10-13
- Implemented on:2017-11-01
- File Format:PDF
- Delivery:Via email within 5 business days
$515.00
《GB/T 33016-2016多层印制板用粘结片试验方法》由TC47（全国印制电路标准化技术委员会）归口，主管部门为工业和信息化部（电子）。
Introduction
Analysis of the core content of the standard
| Test items | Key points of the method | Technical indicators |
|---|---|---|
| Resin content | Ignition method/weighing method, temperature control (550±50)℃ | Accuracy±0.1% |
| Flammability | Vertical combustion method, FV-0~FV-2 classification | Afterflame time≤30s |
| Dielectric properties | Q-meter method/parallel plate method, frequency 1MHz | Dielectric constant ≤ 4.8 |
Key technical requirements
Dimensional inspection requires a thickness measurement accuracy of 0.01mm, and verticality is double-verified by the square ruler method and the diagonal method. The resin flow test must be carried out under 171±3℃ press conditions.
Chemical resistance The test includes dual assessments of dichloromethane immersion (30min) and 3% sodium hydroxide solution (40℃), and the mass change must be ≤2mg.
Implementation Recommendations
1. For adhesive sheets for high-frequency circuits, focus on dielectric constant (Chapter 9.5) and loss factor (≤0.02)
2. Halogen-free materials must meet the halogen content (Chapter 9.12): chlorine ≤900ppm, bromine ≤900ppm, total ≤1500ppm
3. For thermal performance testing, it is recommended to conduct Tg (≥150℃) and Td (≥320℃) tests simultaneously
Standard Evolution Analysis
Compared with JIS 6521:1996, this standard adds thermal delamination time (Chapter 9.11) and Z-axis thermal expansion coefficient (Chapter 9.9) test items, which are more suitable for the needs of high-density interconnect boards. Compared with IPC-TM-650, the resin flow test pressure is adjusted from 1.38MPa to the manufacturer's recommended value, which is more flexible.
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