GB/T 39163-2020 in English
VALIDTest methods of the bonding strength for target-backing plate assemblies
- Issued on:2020-11-19
- Implemented on:2021-10-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$194.00
《GB/T 39163-2020靶材与背板结合强度测试方法》由TC243（全国有色金属标准化技术委员会）归口，TC243SC2（全国有色金属标准化技术委员会重金属分会）执行，主管部门为中国有色金属工业协会。
Introduction
Analysis of the core content of the standard
This standard systematically specifies two types of test methods for the bonding strength between the target material and the backing plate: tensile test (ring face butt joint) and shear test (flat plate overlap). The test scope covers 8 bonding methods such as brazing, diffusion welding, and explosion welding, and is suitable for the quality assessment of coating materials in the field of microelectronics.
Comparison of key technical parameters
| Test type | Combination area calculation | Strength formula | Specimen size requirement (mm) |
|---|---|---|---|
| Tensile test | S=π(Dt-Db) | Rm=Fm/S | Target blank outer diameter 40-60, backing plate inner diameter 15-25 |
| Shear test | S=ΔL×Wt | τm=Fm/S | Joint surface length 20-50, total width 20-50 |
Key points of sample preparation
Selection of sampling stage:Sampling is required in the three stages of new product development, batch production, and residual targets. The sampling frequency of the product stage needs to be determined by negotiation between the supply and demand parties.
Processing precautions:Non-contact processing methods such as water jet or wire EDM should be used. During mechanical processing, deformation loads should be avoided on the joint surface. For shear specimens, the joint connection in the non-test area must be completely removed.
Test implementation specifications
- Testing machine accuracy requirements: Level 1 or higher (according to GB/T16825.1)
- Temperature control:
- Room temperature test: 10-35℃, precision test 23±5℃
- High temperature test: ＞35℃ requires a heating furnace, and the temperature gradient complies with GB/T228.2
- Loading requirements: maintain a constant rate and avoid eccentric loads
Standard application suggestions
1. Material research and development stage: It is recommended to establish a special test plan for new bonding processes (such as nanosilver welding) and appropriately increase the sampling density (interval 30mm)
2. Quality control link: This standard can be combined with SEM observation to analyze the fracture surface morphology to optimize welding parameters
3. Data comparison and analysis: It is recommended to establish a historical database to track the strength change trend under different process parameters
Loading PDF document...
Error loading PDF. Please make sure the file is valid and try again.
