Sign In |Help & Support
ALL SECTORS
  • ALL SECTORS
  • GB(National Standard)
  • CB(Shipping)
  • CECS(Engineering Construction)
  • CJ(Urban Construction)
  • CY(News and Publication)
  • DB(Provincial Standard)
  • DL(Electricity & Power)
  • DZ(Geology & Mineralogy)
  • FZ(Spinning & Textile)
  • GA(Public Security)
  • HB(Aviation)
  • HG(Chemical Industry)
  • HJ(Environmental Protection)
  • JB(Machinery)
  • JC(Building Materials)
  • JG(Building & Construction)
  • JJ(Metering)
  • JT(Highway & Transportation)
  • LY(Forestry)
  • MT(Coal)
  • NB(Energy)
  • NY(Agriculture)
  • QB(Light Industry)
  • QC(Automobile & Vehicle)
  • QJ(Aerospace)
  • SH(Petrochemical)
  • SJ(Electronics)
  • SL(Water Resources)
  • SN(Commodity Inspection)
  • SY(Oil & Gas)
  • TB(Railway & Train)
  • YB(Ferrous Metallurgy)
  • YC(Tobacco)
  • YD(Telecommunication)
  • YY(Medical Device)
Database: 365,228(8 Aug 2026)
high voltage silicon rectifier stacks glass passivation package detail specification specification detail self-adhering polymer clear-text encoding standard technical dimensions standard requirements comparison
SJ 2759-1987 in English

SJ 2759-1987 in English

ABOLISHED

Detail specification for glass passivation package high voltage silicon rectifier stacks, Type 2CZ21~29

  • Issued on:1987-02-10
  • Implemented on:1987-10-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $180.00
$175.00
Standard No: SJ 2759-1987
Document status: ABOLISHED
Title in English: Detail specification for glass passivation package high voltage silicon rectifier stacks, Type 2CZ21~29
Title in Chinese: 2CL21~29型玻璃钝化封装高压硅堆详细规范
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 1987-02-10
Implemented on: 1987-10-01
Chinese Classification: F01-Technical management
Professional Classification: SJ-Electronics
Related Keywords: high voltage silicon rectifier stacks
glass passivation package
detail specification
specification
detail
Related Topics: passivation
Silicon Passivated Cadmium
encapsulation
Sample only — not a preview of SJ 2759-1987
Page: 1 / 0
100%

Loading PDF document...

Error loading PDF. Please make sure the file is valid and try again.

We also recommend

  • SJ 2658-1986 in English

    SJ 2658-1986 in English

    Method of measurement for semiconductor infrared diodes

    1986-01-21
  • SJ 2247-1982 in English

    SJ 2247-1982 in English

    Outlines dimension for semiconductor optoelectronic devices

    1982-12-24
  • SJ 1225-1977 in English

    SJ 1225-1977 in English

    Detail specification for germanium detector diodes,Type 2AP11~2AP17

    1977-12-26
  • SJ/T 11086-1996 in English

    SJ/T 11086-1996 in English

    Specification of gap sparker for type FD08, FD12 and FD15

    1996-11-20
  • SJ/Z 9021.3-1987 in English

    SJ/Z 9021.3-1987 in English

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

    1987-09-14
  • SJ 20320-1993 in English

    SJ 20320-1993 in English

    Capacitors, fixed, electrolytic (non-solid electrolyte), tantalum, established reliability, Style CAK39, Detail specification for

    1993-05-11
  • SJ/T 10482-1994 in English

    SJ/T 10482-1994 in English

    Test method for characterizing semiconductor deep levels by transient capacitance techniques

    1994-04-11
  • SJ 767-1974 in English

    SJ 767-1974 in English

    Detail specification for silicon NPN epitaxial planar low-frequency high power transistors,Type 3DD53 and 3DD54

    1974-10-01
  • SJ 1405-1978 in English

    SJ 1405-1978 in English

    Detail specification for silicon NPN high-frequency high power transistors,Type 3DA1

    1979-07-01