SJ/T 11216-1999 in English

VALID

Technology requirement for infrared hot air reflow soldering

Issued on:1999-08-26
Implemented on:1999-12-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $160.00
$156.00

Standard No:	SJ/T 11216-1999
Document status:	VALID
Title in English:	Technology requirement for infrared hot air reflow soldering
Title in Chinese:	红外／热风再流焊接技术要求
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1999-08-26
Implemented on:	1999-12-01
Chinese Classification:	L04-Basic standards and general methods
Professional Classification:	SJ-Electronics
Related Keywords:	infrared hot air hot air reflow soldering air hot
Related Topics:	infrared Thermogravimetric infrared TGA IR Infrared is Infrared+is TGA-IR TGA+IR Thermogravimetric infrared Infrared+ TGA + IR Infrared is Infrared Testing Requirements thermogravimetric infrared, Infrared sample preparation requirements near-infrared flow cytometry Infrared a TGA IR+ Infrared test sample preparation requirements is infrared hydrazone infrared Infrared Testing Requirements TGA+IR+ Requirements for Infrared Sample Preparation Infrared sample preparation requirements Infrared sample preparation requirements Infrared English Catheter welding technical requirements is infrared Infrared English ccc is no longer required no infrared no infrared infrared version Infrared + English Infrared sample preparation requirements no infrared+ Thermogravimetric Infrared System Infrared, English IR indirect conversion Infrared sample preparation technology Welding Technology Welding Technology double reheat technology Infrared Detection Requirements infrared current Infrared test sample preparation requirements Overseas technical exchange Electronics + Infrared + as infrared sj/t11209-1999 Infrared Surface Technology hot air Requirements for infrared Infrared and heat Infrared a Vigorous Infrared Heat as infrared Infrared reconfirmation Secondary reheat technology sj t 11213-1999 sj1999 st60 infrared technical indicators Infrared thermometer quality standards and technical requirements

Scope

This standard specifies the basic technical requirements for reflow soldering of surface assembly components (SMA) using infrared, hot air or a combination of infrared and hot air heating sources and using tin-lead solder paste, post-soldering quality inspection and temperature curve testing methods. This standard applies to infrared, hot air or infrared hot air combined reflow soldering of rigid single-sided and double-sided printed board assemblies assembled using surface mount components.

More samples: QC/T 942-2021 YD/T 3934-2021 DL/T 5154-2012

Sample only — not a preview of SJ/T 11216-1999

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