YD/T 4664-2024 in English
VALID5G universal module technical requirements (second phase)
- Issued on:2024-03-29
- Implemented on:2024-07-01
- File Format:PDF
- Delivery:Via email within 5 business days
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| Standard No: | YD/T 4664-2024 |
| Document status: | VALID |
| Title in English: | 5G universal module technical requirements (second phase) |
| Title in Chinese: | 5G通用模组技术要求（第二阶段） |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 5 business days |
| Issued on: | 2024-03-29 |
| Implemented on: | 2024-07-01 |
| ICS Classification: | 01.040.33-Telecommunications. Audio and video engineering (Vocabularies) |
| Chinese Classification: | M37-Mobile communication equipment |
| Professional Classification: | YD-Telecommunication |
| Related Keywords: | technical requirements
universal module module technology slb3642-bbap module storage temperature requirements |
Introduction
Analysis of standard technical framework
As an important milestone in the evolution of 5G module technology, this specification strengthens the uRLLC and network slicing capabilities based on the R16 version. The main technical architecture includes:
| Dimension | Phase I | Phase II Enhancement |
|---|---|---|
| Communication Mode | SA/NSA Dual Mode | Support EN-DC Dynamic Switching |
| Slicing Capability | Basic NSSAI Support | URSP Rule Dynamic Update |
| Latency Index | 10ms Level | 1ms Level (uRLLC) |
Core Capability Requirements
4.3 Multi-mode and Multi-band Support
The module must support at least:
- 5G frequency bands: n41/n78/n79 and other sub-6GHz frequency bands
- LTE fallback: B1/B3/B5 and other mainstream frequency bands
- EN-DC: Carrier aggregation bandwidth can reach 200MHz
Typical case: In the industrial Internet of Things scenario, the SLB3642-BBAP module achieves a 40% increase in uplink rate
Key Hardware Technologies
9.2 Packaging Specifications
| Model | Size(mm) | Thickness(mm) | Applicable Scenarios |
|---|---|---|---|
| SMB3052 | 30×52±0.15 | ≤3.6±0.08 | Consumer Electronics |
| SLA4470 | 44×70±0.20 | ≤3.55±0.20 | Automotive Pre-installation |
Note: Industrial-grade modules must meet the storage temperature requirements of -40℃~85℃
Implementation Suggestions
- Automotive applications are preferredSLA series package, its anti-vibration performance has passed AEC-Q100 certification
- It is recommended to enable the PDCP retransmission function in URLLC scenarios to improve reliability to 99.999%
- The antenna design must comply with the ANT_1~ANT_11 pin impedance matching requirements in Appendix A
Sample only — not a preview of YD/T 4664-2024
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