YS/T 604-2006 in English
SUPERSEDEDGold based thick film conductor pastes
- Issued on:2006-05-25
- Implemented on:2006-12-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$146.00
本标准规定了金基厚膜导体浆料的要求，试验方法，检验规则及标志，包装，运输，储存及订货单内容。本标准适用于厚膜混合集成电路，传感器等器件用的金基厚膜导体浆料。
Scope
This standard specifies the requirements, test methods, inspection rules and marking, packaging, transportation, storage and order form content of gold-based thick film conductor paste. This standard applies to gold-based thick film conductor paste (hereinafter referred to as gold paste) used in thick film hybrid integrated circuits, sensors and other devices.
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