Intergeneric
Intergeneric, Total:49 items.
The international standard classification for "Intergeneric" includes: Environmental protection , Other iron and steel products , Iron and steel products in general , Powder metallurgy .
The Chinese standard classification for "Intergeneric" includes: Environmental protection equipment , High temperature alloy , Powder metallurgy material and product , Building hardware , Water supply and draining instrument and equipment .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 35250-2017 Intermetallic compound film filter
- GB/T 14992-2025 Superalloys and intermetallic compounds—Designation and chemical composition
- GB/T 14992-2005 Classification and designation for superalloys and high temperature intermetallic materials
Professional Standard - Non-ferrous Metal
- YS/T 1267-2018 Sintered CuAI intermetallic c ound flexible film
- YS/T 1480-2021 Nickel aluminum intermetallic compound sintered porous material tubular filter element
- YS/T 1135-2016 Tubular filter element for sintered Ti-Al porous intermetallic compound
- YS/T 1272-2018 FeAI intermetallic compound porous membrane material
- YS/T 1134-2016 Iron and aluminum intermetallic compound sintering porous filter element
- YS/T 1249-2018 Titanium-aluminum intermetallic compound porous membrane material
Professional Standard - Light Industry
- QB/T 1560-2017 Accessories of bathroom
- QB/T 1560-2006 Accessories of bathroom
- QB/T 1560-1992 Accessories of bathroom
Group Standards of the People's Republic of China
- T/CBMF 26*T/CBCSA 4-2018 Bathroom accessories
- T/CBCSA 4-2018 Bathroom accessories
American Society for Testing and Materials (ASTM)
- ASTM D1780-99 Standard Practice for Conducting Creep Tests of Metal-to-Metal Adhesives
- ASTM D1062-96e1 Standard Test Method for Cleavage Strength of Metal-to-Metal Adhesive Bonds
- ASTM D1062-08 Standard Test Method for Cleavage Strength of Metal-to-Metal Adhesive Bonds
- ASTM D1062-08(2015) Standard Test Method for Cleavage Strength of Metal-to-Metal Adhesive Bonds
- ASTM D1780-05(2012) Standard Practice for Conducting Creep Tests of Metal-to-Metal Adhesives
- ASTM D1780-05 Standard Practice for Conducting Creep Tests of Metal-to-Metal Adhesives
American National Standards Institute (ANSI)
- ANSI/UL 1242-2007 Electrical Metal Intermediate Conduit - Steel (proposal dated 6-8-07)
- ANSI C80.6-2005 Electrical Intermediate Metal Conduit (EIMC)
German Institute for Standardization
- DIN IEC 62374-1 E:2008 Draft Document - Time Dependent Dielectric Breakdown Test (TDDB) for Inter-metal layers (IEC 47/1946/CD:2007)
- DIN EN 62374-1:2011-06 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011
Aerospace Industries Association/ANSI Aerospace Standards
- AIA/NAS NAS 47-1986 Spacer, Sleeve, Nonmetallic, Epoxy and Phenolic, Screw and Bolt (Rev. 1)
- AIA/NAS NAS 500-1992 Nut Spacer, Plate - Countersunk (Rev. 8)
- AIA/NAS NAS 463-2000 Nut Spacer, Plate - Plain Revision 8; BEST AVAILABLE COPY
Danish Standards Foundation
- DANSK DS/EN 62374-1/AC:2011 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
- DANSK DS/EN 62374-1:2011 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
- DS/EN 62374-1:2011 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
- DS/EN 62374-1/AC:2011 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Comitato Elettrotecnico Italiano
- CEI EN 62374-1:2012 Semiconductor devices Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
European Telecommunications Standards Institute (ETSI)
- ETSI TS 101 861-2001 Time Stamping Profile V1.1.1
Spanish Association for Standardization (UNE)
- UNE-EN 62374-1:2010 Semiconductor devices -- Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (Endorsed by AENOR in March of 2011.)
The Directorate General of Specifications and Metrology (DGSM)
- OS GSO IEC 62374-1:2013 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
British Standards Institution (BSI)
- BS EN ISO 9974-3:2000 Connections for general use and fluid power - Ports and stud ends with ISO 261 threads with elastomeric or metal-to-metal sealing - Stud ends with metal-to-metal sealing (type B)
- BS EN 2243-2:2005 Aerospace series - Non-metallic materials - Structural adhesives - Test method - Peel metal-metal
The Society for Protective Coatings (SSPC)
- SSPC PA 1-2024 Shop, Field, and Maintenance Coating of Metals
American Society of Mechanical Engineers (ASME)
- ASME SEC VIII D1 NMA APP Y-2002 Appendix Y Flat Face Flanges with Metal-to-Metal Contact Outside the Bolt Circle
Association for Materials Protection and Performance (AMPP)
- AMPP Paper 17627-2022 Study and screening procedure for intermetallic phase precipitation in super duplex stainless steel
Society of Automotive Engineers (SAE)
- SAE MA2152/1-1991 Clamp, Center Mount, Bare Metal, Aluminum, Metric
United States Navy
- NAVY QPL-MMM-A-132-9 (4)-1991 ADHESIVES, HEAT RESISTANT, AIRFRAME STRUCTURAL: METAL TO METAL
- NAVY QPL-MMM-A-132-9-1988 ADHESIVES, HEAT RESISTANT, AIRFRAME STRUCTURAL: METAL TO METAL
- NAVY QPL-MMM-A-132-10 NOTICE 2-2005 ADHESIVES, HEAT RESISTANT, AIRFRAME STRUCTURAL: METAL TO METAL
Finnish Standards Institute
- SFS 2901-1974 MUOKATUT KUPARIMETALLIT.TILAT JA NIIDEN TOTEAMINEN
National Electrical Manufacturers Association(NEMA)
- NEMA C80.6-2018 Electrical Intermediate Metal Conduit
Japanese Industrial Standards Committee (JISC)
- JIS H 7601-1:2002 Method of tensile test for intermetallic compounds -- Part 1: Room temperature tensile test
Lithuanian Standards Office
- LST EN 62374-1-2011/AC-2011 Semiconductor devices -- Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010)
- LST EN 62374-1-2011 Semiconductor devices -- Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010)
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