Sign In |Help & Support
ALL SECTORS
  • ALL SECTORS
  • GB(National Standard)
  • CB(Shipping)
  • CECS(Engineering Construction)
  • CJ(Urban Construction)
  • CY(News and Publication)
  • DB(Provincial Standard)
  • DL(Electricity & Power)
  • DZ(Geology & Mineralogy)
  • FZ(Spinning & Textile)
  • GA(Public Security)
  • HB(Aviation)
  • HG(Chemical Industry)
  • HJ(Environmental Protection)
  • JB(Machinery)
  • JC(Building Materials)
  • JG(Building & Construction)
  • JJ(Metering)
  • JT(Highway & Transportation)
  • LY(Forestry)
  • MT(Coal)
  • NB(Energy)
  • NY(Agriculture)
  • QB(Light Industry)
  • QC(Automobile & Vehicle)
  • QJ(Aerospace)
  • SH(Petrochemical)
  • SJ(Electronics)
  • SL(Water Resources)
  • SN(Commodity Inspection)
  • SY(Oil & Gas)
  • TB(Railway & Train)
  • YB(Ferrous Metallurgy)
  • YC(Tobacco)
  • YD(Telecommunication)
  • YY(Medical Device)
Database: 365,228(8 Aug 2026)

Optoelectronic Technology

Optoelectronic Technology, Total:28 items.

The international standard classification for "Optoelectronic Technology" includes: Fibre optic systems in general , Fiber and cables , Lamps and related equipment , Photographic equipment. Projectors , Fiber optic interconnecting devices , Other standards related to nuclear energy .

The Chinese standard classification for "Optoelectronic Technology" includes: Optical communication equipment , Electric lighting in general , Camera and photograph instrument , Broadcasting and television network structure , Technical management , Accelerator for agriculture and industry .


General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 13582-1992 Generic specification for electronic lighting control equipments
  • GB/T 10072-2003 Specifications of electronic flash equipments for photograph
  • GB/T 24366-2009 Technical requirements of optoelectronic detector module for communication
  • GB/T 28511.2-2012 Integrated optical path devices based on planar lightwave circuit—Part 2:DWDM filter based on AWG technology

Professional Standard - Post and Telecommunication

  • YD/T 1419.3-2006 Technical Conditions of Triplexer Optical Assembly for Access Network Part 3 : General Characteristics of Triplexer Optical Assembly for GPON ONU
  • YD/T 2552-2013 Technical specification of 10Gb/s DWDM XFPsmall form factor pluggable optical transceiver module
  • YD/T 2005-2009 The technical specifications of optical transceivers for fiber channel
  • YD/T 2000.2-2009 Integrated optical path devices based on planar lightwave circuit Part 2 :DWDM filter based on AWG technology
  • YD/T 2553-2013 Technical specification of 6Gb/s SFP+ optical transeiver module for base station interconnecting
  • YD/T 2288.2-2011 Technical Specification of Optical Sub-assembly for Small Form Factor Pluggable Transceiver Module (SFP) - Part 2: Coaxial Receiver Optical Sub-assembly (ROSA)
  • YD/T 1812.2-2009 Technical Specifications and Test Method of 10Gbit/s TOSA and ROSA Part 2:10Gbit/s Cooled TOSA
  • YD/T 1812.1-2008 Technical Specification and Testing Method of 10Gbit/s TOSA and ROSA Part1:10Gbit/s Uncooled TOSA
  • YD/T 2288.1-2011 Technical Specification of Optical Sub-assembly for Small Form Factor Pluggable Transceiver Module (SFP) - Part 1: Coaxial Transmitter Optical Sub-assembly (TOSA)
  • YD/T 2006-2009 Technical requirements and test methods of VMUX
  • YD/T 1183-2013 Technical condition of optical receiver module for optical fiber analong transmission
  • YD/T 2799.5-2023 Technical specification of integrated intradyne coherent receiver- Part 5: 800Gb/s
  • YD/T 1526.2-2007 Technical Specifications of Single Fiber Bi-Directional Triplexer Optical Transceiver for Access Network Part 2:Single Fiber Bi-Directional Triplexer Optical Transceiver for EPON ONU

Professional Standard - Radio Television Film

  • GY/T 184-2002 Specifications and methods of measurement on analog optical fiber amplifiers used in CATV system

Professional Standard - Electron

  • SJ/T 11400-2009 Semiconductor optoelectronic devices - Blank detail specification for lower-power light-emitting diodes
  • SJ/T 10584-1994 Terms of photomasking technology for microelectronics
  • SJ/T 10312-1992 General specification of electron beam exposure system

工业和信息化部

  • YD/T 2799.4-2021 Technical requi rment of LTE digital cellular mobile te lecommuni cation network of enhanced MTC core network equi pment

Professional Standard - Machinery

  • JB/T 9351-1999 General specifications of pachaging for electron optical instrument

Group Standards of the People's Republic of China

  • T/CNS 11-2019 Specification of electron beam curing of varnish for paper packaging

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

  • IPC 0040-2003 Optoelectronics Assembly and Packaging Technology

American Society for Testing and Materials (ASTM)

  • ASTM E995-16 Standard Guide for Background Subtraction Techniques in Auger Electron Spectroscopy and X-Ray Photoelectron Spectroscopy
  • ASTM E995-97 Standard Guide for Background Subtraction Techniques in Auger Electron and X-ray Photoelectron Spectroscopy

ANSI - American National Standards Institute

  • INCITS TR-31-2002 INCITS Technical Report for Information Technology - Fibre Channel - Avionics Environment (FC-AE)