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Component pind

Component pind, Total:118 items.

The international standard classification for "Component pind" includes: Aircraft and space vehicles in general , Graphical symbols for use on electrical and electronics engineering drawings, diagrams, , Aerospace electric equipment and systems , Electronic components in general , Metrology and measurement in general , Structure and structure elements .

The Chinese standard classification for "Component pind" includes: Basic standards and general methods , Basic standards and general methods , Electronic components , Technical management , Technical Management , Basic standards and general methods , Material and component for instrument and meter , Sensitive component and sensor .


Professional Standard - Aerospace

  • QJ 10002-2008 Screening Guide for Aerospace Components
  • QJ 2863-1996 Requirements and Method for Particles Impact Noise Detection (PIND) for Aerospace
  • QJ 3058-1998 Management Requirements for Device Evaluation
  • QJ 1693-1989 Anti-static requirements for electronic components
  • QJ 2733-1995 Graphic Symbol for Microwave Device
  • QJ 3065.2-1998 Management Requirements for Electronic Device Procurement
  • QJ 3065.1-1998 Selection and Application Management Requirements for Components?
  • QJ 2782-1995 Terminology for Microwave Components
  • QJ 10003-2008 Screening Guide for Imported Components

Military Standard of the People's Republic of China-General Armament Department

Professional Standard - Electron

  • SJ/T 10554-1994 Letter symbols for sensor
  • SJ 2422-1983 Tined copper wire for electronic components
  • SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
  • SJ/Z 9034-1987 Packaging of components for automatic assembly Part 1: Tape packaging of components with axial lead
  • SJ/T 10718-1996 Examples for preparation of design documents of electronic equipment
  • SJ/T 10225-1991 Graphic base of electronic Components-graphic of electro-mechanical components

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence

  • GJB/Z 35-1993 Derating criteria for electrical,electronic and electromechanical parts

未注明发布机构

  • JIS C 0806-3:2024 Packaging of components for automatic handling-Part 3: Packaging of surface mount components on continuous tapes

British Standards Institution (BSI)

  • BS EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)
  • DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
  • BS EN 2591-605:2002 Elements of electrical and optical connection - Test methods - Optical elements - Return loss
  • BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices

Korean Agency for Technology and Standards (KATS)

GSO

  • OS GSO IEC 60749-16:2014 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
  • BH GSO IEC 60749-16:2016 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
  • GSO IEC 60749-16:2014 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

AENOR

  • UNE-EN 60749-16:2003 Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)

Danish Standards Foundation

  • DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)

International Electrotechnical Commission (IEC)

  • IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
  • IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
  • IEC TS 62627-09:2016 Fibre optic interconnecting devices and passive components - Vocabulary for passive optical devices

German Institute for Standardization

  • DIN EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
  • DIN EN 60749-16:2003-09 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
  • DIN 58356-12:2000 Filter elements - Membrane filter elements - Part 12: Integrity test of hydrophobic membrane filters with water
  • DIN 15349:2003 Introductory element - Main element - Complementary element
  • DIN EN 12806:2003 Automotive liquefied petroleum gas components - Other than containers; German version EN 12806:2003
  • DIN EN 61291 Bb.1:1999 Fibre optics - Parameters of amplifier components (Technical Report IEC 61292-1:1998)

Association Francaise de Normalisation

  • NF EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: particle impact noise detection (PIND)
  • NF C93-601/AM1:1976 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. CRYSTAL HOLDERS.
  • NF C93-611:1975 Components for electronic equipment. Piezoelectric devices. Quartz crystal units for oscillators.
  • NF C93-265/A1:1984 Composants électroniques. Potentiomètres bobines de précision.
  • NF C93-265/A2:1984 Electronic components. Precision coil potentiometers
  • NF UTE C93-265/A1:1975 ELECTRONIC COMPONENTS. PRECISION COIL POTENTIOMETERS
  • NF C96-001:1984 Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 1 : general.
  • NF C93-612:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. PIEZOELECTRIC FILTERS. GENERAL REQUIREMENTS.
  • NF C96-011:1989 Electronic Components Semiconductor devices Part 11:Sectional specification for discrete devices
  • NF C96-005-5*NF EN 60747-5-5:2012 Semiconductor devices - Discrete devices - Part 5-5 : optoelectronic devices - Photocouplers

SCC

European Committee for Electrotechnical Standardization(CENELEC)

  • EN 60749-16:2003 Semiconductor devices Mechanical and climatic test methods Part 16: Particle impact noise detection (PIND)

Lithuanian Standards Office

  • LST EN 60749-16-2003 Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003)

Japanese Industrial Standards Committee (JISC)

  • JIS C 0805:1989 Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)
  • JIS C 5001:1987 General rules for electronic components
  • JIS C 5002:1968 Environmental requirements for electronic components
  • JIS W 2922:1996 Aircraft -- Hydraulic components -- Marking to indicate fluid for which component is approved
  • JIS B 7612-2:2008 Load Cells for Weighing Instruments -- Part 2: Digital Load Cells
  • JIS K 3804:1990 Size of membrane filter elements

RU-GOST R

SAE - SAE International

Society of Automotive Engineers (SAE)

KR-KS

CZ-CSN

Canadian Standards Association (CSA)

United States Navy

PL-PKN

HU-MSZT

U.S. Military Regulations and Norms

Defense Logistics Agency

Underwriters Laboratories (UL)

  • UL 1020-1994 Thermal cutoffs for use in electrical appliances and components

AIA/NAS - Aerospace Industries Association of America Inc.

  • NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
  • NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
  • NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
  • NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
  • NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link

European Committee for Standardization (CEN)

  • EN 12806:2003 Automative liquefied petroleum gas components - Other than containers

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

  • JEDEC JESD51-1995 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)

Aerospace Industries Association

  • AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link

ECIA - Electronic Components Industry Association

  • 396-1971 Resistors@ Fixed Film Microelement

SE-SIS

  • SIS SS-ISO 4399:1985 Fluid power systems and components — Connectors and associated components — Nominal pressures