Component pind
Component pind, Total:118 items.
The international standard classification for "Component pind" includes: Aircraft and space vehicles in general , Graphical symbols for use on electrical and electronics engineering drawings, diagrams, , Aerospace electric equipment and systems , Electronic components in general , Metrology and measurement in general , Structure and structure elements .
The Chinese standard classification for "Component pind" includes: Basic standards and general methods , Basic standards and general methods , Electronic components , Technical management , Technical Management , Basic standards and general methods , Material and component for instrument and meter , Sensitive component and sensor .
Professional Standard - Aerospace
- QJ 10002-2008 Screening Guide for Aerospace Components
- QJ 2863-1996 Requirements and Method for Particles Impact Noise Detection (PIND) for Aerospace
- QJ 3058-1998 Management Requirements for Device Evaluation
- QJ 1693-1989 Anti-static requirements for electronic components
- QJ 2733-1995 Graphic Symbol for Microwave Device
- QJ 3065.2-1998 Management Requirements for Electronic Device Procurement
- QJ 3065.1-1998 Selection and Application Management Requirements for Components?
- QJ 2782-1995 Terminology for Microwave Components
- QJ 10003-2008 Screening Guide for Imported Components
Military Standard of the People's Republic of China-General Armament Department
- GJB 1437-1992 Electronic component leads
- GJB/Z 83-1996 Selection Guide for Aerospace Electronic Components Microwave Components
Professional Standard - Electron
- SJ/T 10554-1994 Letter symbols for sensor
- SJ 2422-1983 Tined copper wire for electronic components
- SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
- SJ/Z 9034-1987 Packaging of components for automatic assembly Part 1: Tape packaging of components with axial lead
- SJ/T 10718-1996 Examples for preparation of design documents of electronic equipment
- SJ/T 10225-1991 Graphic base of electronic Components-graphic of electro-mechanical components
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 29074-2012 Requirements for qualification of space components
- GB/T 4475-1995 Terms of sensor
- GB/T 13965-2010 Instrument components - Vocabulary
- GB/T 13965-1992 Instrument components-vocabulary
Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence
- GJB/Z 35-1993 Derating criteria for electrical,electronic and electromechanical parts
未注明发布机构
- JIS C 0806-3:2024 Packaging of components for automatic handling-Part 3: Packaging of surface mount components on continuous tapes
British Standards Institution (BSI)
- BS EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)
- DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
- BS EN 2591-605:2002 Elements of electrical and optical connection - Test methods - Optical elements - Return loss
- BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
Korean Agency for Technology and Standards (KATS)
- KS C IEC 60749-16-2006(2016) Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
- KS C IEC 60749-16-2006(2021) Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
- KS C IEC 60749-16:2006 Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
- KS C IEC 60749-16-2021 Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
- KS C 5529-1987 Piezoelectric Element unit
- KS C 5109-1986 General Rules for Electronic Components
- KS C 5109-1988(2018) General rules for electronic components
- KS C 5109-1988 General Rules for Electronic Components
- KS C 6018-1971(2017) Environmental Requirements for Electronic Components
- KS C 6018-1982 Environmental Requirements for Electronic Components
- KS C 6018-1971 Environmental Requirements for Electronic Components
- KS C 6013-1982 Testing method of endurance(electrical) for electronic component
GSO
- OS GSO IEC 60749-16:2014 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
- BH GSO IEC 60749-16:2016 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
- GSO IEC 60749-16:2014 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
AENOR
- UNE-EN 60749-16:2003 Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
Danish Standards Foundation
- DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)
International Electrotechnical Commission (IEC)
- IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
- IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
- IEC TS 62627-09:2016 Fibre optic interconnecting devices and passive components - Vocabulary for passive optical devices
German Institute for Standardization
- DIN EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
- DIN EN 60749-16:2003-09 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
- DIN 58356-12:2000 Filter elements - Membrane filter elements - Part 12: Integrity test of hydrophobic membrane filters with water
- DIN 15349:2003 Introductory element - Main element - Complementary element
- DIN EN 12806:2003 Automotive liquefied petroleum gas components - Other than containers; German version EN 12806:2003
- DIN EN 61291 Bb.1:1999 Fibre optics - Parameters of amplifier components (Technical Report IEC 61292-1:1998)
Association Francaise de Normalisation
- NF EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: particle impact noise detection (PIND)
- NF C93-601/AM1:1976 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. CRYSTAL HOLDERS.
- NF C93-611:1975 Components for electronic equipment. Piezoelectric devices. Quartz crystal units for oscillators.
- NF C93-265/A1:1984 Composants électroniques. Potentiomètres bobines de précision.
- NF C93-265/A2:1984 Electronic components. Precision coil potentiometers
- NF UTE C93-265/A1:1975 ELECTRONIC COMPONENTS. PRECISION COIL POTENTIOMETERS
- NF C96-001:1984 Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 1 : general.
- NF C93-612:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. PIEZOELECTRIC FILTERS. GENERAL REQUIREMENTS.
- NF C96-011:1989 Electronic Components Semiconductor devices Part 11:Sectional specification for discrete devices
- NF C96-005-5*NF EN 60747-5-5:2012 Semiconductor devices - Discrete devices - Part 5-5 : optoelectronic devices - Photocouplers
SCC
- CEI EN 60749-16:2005 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
- DANSK DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)
- CSA C22.2 No.72-M1984-1984(R2008) Heater Elements
- MIL MIL-I-85352/3-1980 INFLATOR ASSEMBLY GAGE ELEMENTS
- BS DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
- MIL MIL-E-50748-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737477 (,A, TRIGGER)
- MIL MIL-E-50745-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
- BS PD IEC/TR 61292-1:2009 Optical amplifiers-Parameters of amplifier components
- BS IEC 61292-1:1998 Fibre optics-Parameters of amplifier components
- CSA C254.0-1976 Coupe-circuit à fusibles et éléments de remplacement
- MIL MIL-F-24402/3-1990 FILTER HOUSINGS, HYDRAULIC, THREE ELEMENTS
- MIL MIL-F-24402/1-1990 FILTER HOUSINGS, HYDRAULIC, SINGLE ELEMENT
- MIL MIL-DTL-24402/1A-2014 Filter Housings, Hydraulic, Single-Element
- MIL MIL-DTL-24402/3A-2014 Filter Housings, Hydraulic, Three Elements
European Committee for Electrotechnical Standardization(CENELEC)
- EN 60749-16:2003 Semiconductor devices Mechanical and climatic test methods Part 16: Particle impact noise detection (PIND)
Lithuanian Standards Office
- LST EN 60749-16-2003 Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003)
Japanese Industrial Standards Committee (JISC)
- JIS C 0805:1989 Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)
- JIS C 5001:1987 General rules for electronic components
- JIS C 5002:1968 Environmental requirements for electronic components
- JIS W 2922:1996 Aircraft -- Hydraulic components -- Marking to indicate fluid for which component is approved
- JIS B 7612-2:2008 Load Cells for Weighing Instruments -- Part 2: Digital Load Cells
- JIS K 3804:1990 Size of membrane filter elements
RU-GOST R
- GOST 25486-1982 Electronic components. Marking
SAE - SAE International
- SAE AS236-1948 Adapter@ Thermo-Sensitive Element
Society of Automotive Engineers (SAE)
- SAE AS236-2008 ADAPTER, THERMO-SENSITIVE ELEMENT
- SAE AS234-1948 THERMO-SENSITIVE ELEMENT (RESISTANCE BULB TYPE)
- SAE AS85352/3A-2013 INFLATOR ASSEMBLY GAGE ELEMENTS
- SAE AIR888B-1997 Fine Wire Mesh for Filter Elements
KR-KS
- KS C 5109-1988(2023) General rules for electronic components
- KS C 5109-1988(2018)(英文版) General rules for electronic components
CZ-CSN
- CSN ON 35 0741-1963 Automatic machine components (indicators)
- CSN ISO 3323:1993 Aircraft. Hydraulic components. Marking to indicate fluid for which component is approved
Canadian Standards Association (CSA)
- CSA C22.2 NO.72-2010 Heater elements (Third Edition)
United States Navy
- NAVY MIL-I-82877 NOTICE 1-1999 IGNITION ELEMENT, PVU-15/B
- NAVY MIL-I-82877-1992 IGNITION ELEMENT, PVU-15/B
PL-PKN
- PN T01020 ArkusZ06-1973 Electronic contact components Simple joint elements Terms and definitions
- PN M34650-1991 Elements of ribbed cast-iron heaters for water
- PN M54901-02-1988 Jet water meter connection elements Lengtheners
HU-MSZT
- MNOSZ 6411-1951 Appliance elements main parts
- MSZ 11297-1966 Thermal resistance element thermal sensor protection accessories
U.S. Military Regulations and Norms
- ARMY MIL-E-50748 VALID NOTICE 2-2013 Electronic Component Assembly, 11737477 ("A" Trigger)
- ARMY MIL-E-50745-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
- ARMY MIL-E-50745 NOTICE 1-1996 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
Defense Logistics Agency
- DLA MIL-STD-1276 G VALID NOTICE 1-2010 Leads for Electronic Component Parts
Underwriters Laboratories (UL)
- UL 1020-1994 Thermal cutoffs for use in electrical appliances and components
AIA/NAS - Aerospace Industries Association of America Inc.
- NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
- NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
- NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
- NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
- NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
European Committee for Standardization (CEN)
- EN 12806:2003 Automative liquefied petroleum gas components - Other than containers
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- JEDEC JESD51-1995 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
Aerospace Industries Association
- AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
ECIA - Electronic Components Industry Association
- 396-1971 Resistors@ Fixed Film Microelement
SE-SIS
- SIS SS-ISO 4399:1985 Fluid power systems and components — Connectors and associated components — Nominal pressures
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