electronic componentsppm

electronic componentsppm, Total:418 items.

The international standard classification for "electronic componentsppm" includes: Character sets and information coding , Aerospace electric equipment and systems , Semiconductor devices , IT applications in transport and trade , Electronic components in general , Aircraft and space vehicles in general .

The Chinese standard classification for "electronic componentsppm" includes: Technical Management , Technical management , Computer application , Electronic components , Semiconductor discrete devices in general , Special electronic technology material , Commerce, Trade and Contract , Electronic element in general , Connector , Basic standards and general methods , Other production equipment , Microcircuit in general , Technology and technological equipment , Aircraft and its accessories in general .

Professional Standard - Electron

SJ 2888-1988 Detail specification for electronic components - Fixed inductors for use in electronic equipment, Type LGA0410 Assessment level A
SJ 2422-1983 Tined copper wire for electronic components
SJ/T 10221-1991 Guide for manufacture quality control of generic electronic components
SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
SJ/T 11125-1997 Encapsulation materials of epoxy series for use in electronic components
SJ/T 10991-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CW574CS voltage regulators for electronic tuners
SJ/T 10225-1991 Graphic base of electronic Components-graphic of electro-mechanical components
SJ/T 10150-1991 Graphic base of electronic components graphics for resistor capacitor and inductor
SJ/T 10036-1991 Detail specification for electronic components Electronic tube of type FU-605 (Applicable for certification)
SJ 20716-1998 Specification for Copper-beryllium alloy wire and bor for use in electronic components
SJ/T 11078-1996 Detail specification for electronic components - Electronic tube of type FC-306 (Applicable for certification)
SJ/T 10718-1996 Examples for preparation of design documents of electronic equipment
SJ 2890-1988 Detail specification for electronic components - Fixed inductors for use in electronic equipment, Type LGA0909 Assessment level A
SJ 20715-1998 Specification for Copper-beryllium alloy plate and strip for use in electronic components
SJ 2889-1988 Detail specification for electronic components-Fixed inductors for use in electronic equipment,Type LGA0606 Assessment level A
SJ 2887-1988 Detail specification for electronic components-Fixed inductors for use in electronic equipment,Type LGA0307 Assessment level A
SJ/T 2421-1996 Tinned copper clad wire for electronic components
SJ/T 11091-1996 General specification for lead-tinned for electronic components
SJ/T 11084-1996 Detailed specifications for electronic components - FU-100F electronic tubes (Applicable for certification)
SJ 3181-1989 Graphic base of electronic elements - IC Graphic
SJ/T 10630-1995 Antistatic requirments for manufacturing electronic element and device
SJ/T 11124-1997 Encapsulation materials of expoy series powder for use in electronic components
SJ/T 10035-1991 Detail specification for electronic components Electronic tube of type FC-620F (Applicable for certification)
SJ/T 10611-1994 Detail specification of electronic components Type CD17 fixed aluminium electrolyte capacitors
SJ/T 11083-1996 Detailed specifications for electronic components - FU-250F electronic tubes (Applicable for certification)

Military Standard of the People's Republic of China-General Armament Department

GJB 3014-1997 Statistical process control system for electronic components
GJB 6777-2009 Testing method of single event effects in Cf radiation source for military electronic devices
GJB 8118-2013 Classification and code for military electronic component
GJB 7243-2011 Screening technical requirement for military electronic components
GJB/Z 112-1998 Selection Guide for Aerospace Electronic Components Capacitors
GJB 2607-1996 Specification for tinned nickel wire for electronic components
GJB 546-1988 Reliability Guarantee Outline for Electronic Components
GJB 1437-1992 Electronic component leads
GJB/Z 62.3-1994 Military electrical connector series plug-in electronic component socket
GJB 3243A-2021 Requirements for surface mount of components and devices
GJB 2445-1995 General specification for lead terminal sockets of electronic components
GJB/Z 83-1996 Selection Guide for Aerospace Electronic Components Microwave Components
GJB/Z 49.1A-2013 Military electronic components series type spectrum optical cable
GJB 546B-2011 Quality assurance program for electronic parts
GJB/Z 55-1994 Selection Guide for Aerospace Electronic Components Semiconductor Discrete Devices
GJB/Z 48.1A-2011 Series programmes for military electronic components and devices Optical fibres
GJB 3404-1998 Electronic component selection and management requirements
GJB 9397-2018 Test method for neutron radiation effects of military electronic components
GJB 1218-1991 General specification for sockets and accessories for plug-in electronic components

Professional Standard - Aerospace

QJ 1317-1987 Electronic component failure classification and code
QJ 3267-2006 Technical requirements for tinning process of electronic components
QJ 1317A-2005 Classification and Coding for Electronic Components Failure
QJ 3171-2003 Lead forming technical requirements for space electron element
QJ 1693-1989 Anti-static requirements for electronic components
QJ 3152-2002 Management Requirements for New Electronic Components of Aerospace Application
QJ 2671-1994 Quality Management Requirements for Imported Electronic Devices
QJ 3057-1998 Assurance Requirements for Aerospace Electrical, Electronic and ElectroMechanical (EEE) Devices
QJ/Z 147-1985 Detailed Rules for Enamel Tin Process of Electronic Components
QJ 2145-1991 Regulations on Quality and Reliability Management of Electronic Components

Professional Standard - Non-ferrous Metal

YS/T 1096-2024 Cadmium copper alloys rod and bar for electrical purpose

Group Standards of the People's Republic of China

T/ZEIIA 02-2020 Test method of electronic paste for electronic components
T/SZECC 003-2025 Service Specifications for Electronic Components Agents
T/KSZZ 025-2025 Epoxy adhesive for bonding electronic components
T/CPSS 1013-2021 Technology specification for derating of electronic components of switching power supply
T/SDWL 0004-2024 Technical requirements for circulating packaging of electrostatic sensitive devices
T/CEIA 001-2023 Generic Requirements for Land Pattern Design of Electronic Measuring Instruments
T/SLEIA 0002-2024 Test standards for low-frequency noise characteristics of electronic components
T/CIE 116-2021 Fault tree analysis method and procedure of electronic components
T/SZECC 002-2025 Electronic component trading specifications

Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence

GJB 546A-1996 Quality Assurance Program for Electronic Components
GJB/Z 128-2000 Guideline for selection and application of spaceborne electronic parts Relays
GJB 2118-1994 Marking of military electrical and electronic components
GJB 3243-1998 Surface Mounting Requirements for Electronic Components

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 32054-2015 Electronic commerce trading product information description―Electronic components
GB/Z 31478-2015 Process management for avionics―Preparation of an electronic components management plan
GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1：General
GB/T 11279-1989 Guide to the application of environmental tests to electronic components
GB/T 28858-2012 Encapsulating material of phenolic for electronic components
GB/T 13947-1992 specification for electronic components plastic packaging equipments
GB 9539-1988 Detail specification for flat cable connectors,Type DC2
GB/T 28859-2012 Encapsulating material of powdered epoxy for electronic components
GB/T 5593-1996 Structure ceramic materials usec in electronic components
GB/T 5593-2015 Structure ceramic materials used in electronic component and device
GB/T 1772-1979 Determination of failure rate of electronic elements and components

Professional Standard - Chemical Industry

HG/T 2003-1991 Electronic component paint
HG/T 6101-2022 Top and bottom adhesive tapes for electronic components packaging

Professional Standard - Machinery

JB/T 6175-2020 The lead forming process specifcation for the electronic componcnts
JB/T 6175-1992 Process Specification for Forming of Instrumentation Electronic Component Lead Wire

未注明发布机构

JIS C 5003-1974 errata General Test Procedure of Failure Rate for Electronic Components ERRATUM

Professional Standard - Aviation

HB 7262.2-1995 Aviation Product Electric Fitting Process - Welding of Electronic Devices
HB 7262.1-1995 Aviation Product Electric Fitting Process - Installation of Electronic Devices

Professional Standard - Military and Civilian Products

WJ 2652-2005 Technical requirement for screening of electronic elements for fuses

Shaanxi Provincial Standard of the People's Republic of China

DB6101/T 3138-2022 Electronic component testing and screening service regulations

Professional Standard - Energy

NB/T 20418-2017 Electronic records metadata for nuclear power industry

Professional Standard - Nuclear Industry

EJ/T 1224-2008 Electronic record metadata for nuclear power industry

British Standards Institution (BSI)

BS CECC 00800:1988 Harmonized system of quality assessment for electronic components - Code of practice for the use of the ppm approach in association with the CECC system
BS DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
BS EN 271:1995(2000) Electrical and Electronic Components - Soldering Technologies
BS EN IEC 62435-6:2018 Electronic components. Long-term storage of electronic semiconductor devices - Packaged or finished devices
BS EN IEC 62435-4:2018 Electronic components. Long-term storage of electronic semiconductor devices. Storage
BS 2011-2J:1967 The enviromental testing of electronic components and electronic equipment. Salt mist
BS 2011-2KA:1963 The enviromental testing of electronic components and electronic equipment. Salt mist
BS QC 720100:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for optoelectronic devices
BS 2011-2EA:1967 The enviromental testing of electronic components and electronic equipment. Shock
BS 2011-2Q:1967 The enviromental testing of electronic components and electronic equipment. Sealing
BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
BS EN IEC 62435-9:2021 Electronic components. Long-term storage of electronic semiconductor devices. Special cases
BS EN 100012:1996 Harmonized system of quality assessment for electronic components - Basic specification - X-ray inspection of electronic components
BS 2011-2EB:1967 The enviromental testing of electronic components and electronic equipment. Bump
BS EN 130800:2001(2003) Harmonized system of quality assessment for electronic components assessment for electronic components — Sectional specification : Tantalum surface mounting capacitors
BS IEC 61163-2:1998 Reliability stress screening-Electronic components
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
BS 2011-2QL:1967 The enviromental testing of electronic components and electronic equipment. Container sealing bomb pressure test
BS 2011-2QG:1967 The enviromental testing of electronic components and electronic equipment. Sealing, driving rain
BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data
BS 9930-03.0:1988 Harmonized system of quality assessment for electronic components. Fixed capacitors for use in electronic components-Sectional specification. Aluminium electrolytic capacitors with solid or non-solid electrolyte
BS CECC 00804:1996 Harmonized system of quality assessment for electronic components - Interpretation of 'EN ISO 9000:1994': Reliability aspects for electronic components
19/30390555 DC BS EN 62435-8. Long-term storage of electronic components. Part 8. Passive electronic devices
18/30379487 DC BS EN 62435-8. Long-term storage of electronic components. Part 8. Passive electronic devices
BS 2011-2QC:1967 The enviromental testing of electronic components and electronic equipment. Container sealing, gas leakage
BS 2011-2QE:1967 The enviromental testing of electronic components and electronic equipment. Container sealing penetration of liquid
BS EN 120000:1996 Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices
BS EN 16602-60:2015 Space product assurance. Electrical, electronic and electromechanical (EEE) components
PAS 62435-2005 Electronic components Long-duration storage of electronic components Guidance for implementation (Edition 1.0)
BS EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices. - Part 2: Deterioration mechanisms
BS EN 16602-30-11:2014 Space product assurance. Derating. EEE components
BS EN 144000:1994 Electronic Components Quality Assessment Harmonization System General Specification: Directly Heated Positive Temperature Coefficient Thermistors Typically Made From Modified Ferro-Electric Materials
BS 9940-0:1983 Harmonized system of quality assessment for electronic components. Fixed resistors for use in electronic equipment-Generic specification

Korean Agency for Technology and Standards (KATS)

KS C 5109-1988(2018) General rules for electronic components
KS C 5109-1986 General Rules for Electronic Components
KS C 5109-1988 General Rules for Electronic Components
KS C 5109-1988(2023) General rules for electronic components
KS C 5109-1988(2018)(英文版) General rules for electronic components
KS C 6018-1971(2017) Environmental Requirements for Electronic Components
KS C 6018-1971 Environmental Requirements for Electronic Components
KS C 6018-1982 Environmental Requirements for Electronic Components
KS C 6013-1982(2017) Testing method of endurance(electrical) for electronic component
KS C 6013-1982 Testing method of endurance(electrical) for electronic component
KS C 6032-1981 General test procedure of failure rate for electronic components
KS C 6012-1982 Testing method of sealing(immersion cyclic) for electronic components
KS C 6012-1960 Testing method of sealing(immersion cyclic) for electronic components
KS C 6430-2004 General rules for reliability assured electronic components
KS C 6021-1977 Endurance(mechanical) testing method for electronic components
KS C 6021-1982 Endurance(mechanical) testing method for electronic components
KS C IEC PAS 62162:2002 Field－induced charged－device model test method for electrostatic discharge withstand thresholds of microelectronic components

Gosstandart of Russia

GOST 25486-1982 Electronic components. Marking
GOST 24385-1980 Electronic components. The rules marking of packing

Japanese Industrial Standards Committee (JISC)

JIS C 5001:1987 General rules for electronic components
JIS C 0805:1989 Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)
JIS C 5002:1968 Environmental requirements for electronic components
JIS C 5021:1978 Cold testing procedures for electronic components
JIS C 5028:1975 Salt mist testing method for electronic components
JIS C 5022:1978 Dry heat testing procedures for electronic components
JIS C 5029:1975 Low air pressure testing method for electronic components
JIS C 0801:1964 Color code for electronic parts
JIS C 5036:1975 Endurance (electrical) testing method for electronic components
JIS C 5031:1975 Sealing testing methods for electronic components
JIS C 5030:1978 Change of temperature testing procedures for electronic components
JIS C 5024:1978 Damp heat (cyclic) testing procedures for electronic components
JIS C 5023:1978 Damp heat (steady state) testing procedures for electronic componets
JIS C 5027:1975 Storage (low temperature) testing method for electronic components
JIS C 5037:1975 Endurance (mechanical) testing method for electronic components
JIS C 5003:1974 General test procedure of failure rate for electronic components

Association Francaise de Normalisation

NF C93-601/AM1:1976 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. CRYSTAL HOLDERS.
NF C93-265/A1:1984 Composants électroniques. Potentiomètres bobines de précision.
NF UTE C93-265/A1:1975 ELECTRONIC COMPONENTS. PRECISION COIL POTENTIOMETERS
NF C93-265/A2:1984 Electronic components. Precision coil potentiometers
NF EN IEC 62435-8:2020 Electronic components - Long-term storage of semiconductor electronic devices - Part 8: passive electronic devices
NF C93-171:1985 Components for electronic equipment. Trimmer capacitors.
NF C83-240/A1:1987 Electronic Components surface mounting resistors
NF C83-220/A4:1989 Electronic Components Fixed precision resistors
NF C93-612:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. PIEZOELECTRIC FILTERS. GENERAL REQUIREMENTS.
NF C96-435-8*NF EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8 : passive electronic devices
NF EN IEC 62435-7:2021 Electronic components - Long-term storage of semiconductor electronic devices - Part 7: microelectromechanical devices
NF C93-611:1975 Components for electronic equipment. Piezoelectric devices. Quartz crystal units for oscillators.
NF C90-512:1983 Components for electronic equipment. Measurement of the dimensions of electronic components.
UTE C93-715U*UTE C93-715:1994 Electronic components. Guidelines for artwork.
NF C96-435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7 : micro-electromechanical devices
NF C83-282/A1:1988 Electronic Components Surge suppression varistors
UTE C80-804U*UTE C80-804:1995 Electronic components. Guidance document. Interpretation of "EN 29000". Reliability aspects for electronic components. (specification CECC 00 804).
NF C93-110:1971 Components for electronic equipment. Fixed aluminium electronic capacitors. General requirements.
UTE C93-415U*UTE C93-415:1985 Electronic components - Electromechanical components - Sensitive switches
FD C96-029:2023 Electronic components - Long duration storage of electronic components and subassemblies - Implementation guide
NF UTE C96-029:2011 Electronic components - Long-term storage of electronic components - Implementation guide
UTE C96-029U*UTE C96-029:2011 Electronic components - Long duration storage of electronic components - Guide for implementation
NF C96-001:1984 Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 1 : general.
NF EN 62435-5:2017 Electronic components - Long-term storage of semiconductor electronic devices - Part 5 - chip devices and wafers
NF C93-010:1968 Components for electronic equipment. Preferred number series for resistors and capacitors.
NF EN IEC 62435-6:2018 Electronic components - Long-term storage of semiconductor electronic devices Part 6: encapsulated or finished devices
NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
UTE C93-002U*UTE C93-002:1966 Electronic components. General. Inspection by attributes.
NF EN 62435-1:2017 Electronic components - Long-term storage of semiconductor electronic devices - Part 1: general
NF EN IEC 62435-3:2020 Electronic components - Long-term storage of semiconductor electronic devices - Part 3: data
NF C96-435-4*NF EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4 : storage
NF C93-012:1974 Components for electronic equipment. Preferred diameters of wire terminations of capacitors and resistors.
UTE C93-751U*UTE C93-751:1985 Electronic components. Base materials for printed circuits. Detail specifications.
NF C83-281:1979 Electronic Components L.V. Varistors for telephony applications
UTE C93-422 L14:1985 ELECTRONIC COMPONENTS - CONNECTING DEVICES - CIRCULAR MULTIPOLE CONNECTORS - BOOK 14
NF EN IEC 62435-4:2018 Electronic components - Long-term storage of semiconductor electronic devices - Part 4: storage
NF C96-011:1989 Electronic Components Semiconductor devices Part 11:Sectional specification for discrete devices
NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
NF C96-435-3*NF EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3 : data
NF C96-435-1*NF EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: general
UTE C96-027:2011 Obsolescence of electronic components - Requirements for end-of-life management of electronic components for suppliers
UTE C93-680U*UTE C93-680:1989 Electronic components. Signal organs. Indicator lights. Detail specifications.
UTE C93-723U*UTE C93-723:1979 Electronic components. Printed wiring. Rework of printed boards.
UTE C93-551U*UTE C93-551:1977 Electronic components. Semi rigid coaxial cables. Detail requirements.
UTE C93-552U*UTE C93-552:1995 Electronic components. Coaxial cables for installation of transmission equipments.
UTE C93-717U*UTE C93-717:1994 Electronic components. Characteristics and control of thermal drains.
UTE C93-719U*UTE C93-719:1994 Electronic components. Specification for interconnection multiwire printed boards.
NF C90-540:1986 Electronic components. General. Tinned wires for components for soft soldering.
NF C96-002:1984 ELECTRONIC COMPONENTS. SEMICONDUCTOR DEVICES. DISCRETE DEVICES AND INTEGRATED CIRCUITS. PART 2 : RECTIFIER DIODES.
NF C93-332:1980 Electronic components. Transformers and inductors for telecommunication and professional electronic equipment. General requirements.
UTE C93-591U*UTE C93-591:1994 Electronic components. Semi-flexible waveguides with flanges.
NF C93-800:1991 SEMICONDUCTOR DEVICES. GENERIC SPECIFICATION FOR OPTICAL FIBRE SENSOR.
NF L90-200-60*NF EN 16602-60:2016 Space product assurance - Electrical, electronic and electromechanical (EEE) components
NF C93-110/AM3:1975 COMPONENTS FOR ELECTRONIC EQUIPMENT. FIXED ALUMINIUM ELECTROLYTIC CAPACITORS. GENERAL REQUIREMENTS.
NF C96-435-2*NF EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2 : deterioration mechanisms
NF C96-435-9*NF EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9 : special cases
NF EN IEC 62435-9:2021 Electronic components - Long-term storage of semiconductor electronic devices - Part 9: special cases
NF EN 62435-2:2017 Electronic components - Long-term storage of semiconductor electronic devices - Part 2: deterioration mechanisms
NF C93-132/A1:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. FIXED CERAMIC CAPACITORS (TYPE II). GENERAL REQUIREMENTS.
NF EN 62421:2014 Techniques d'assemblage des composants électroniques - Modules électroniques
NF C93-132:1978 Components for electronic equipment. Fixed ceramic capacitors (type ii). General requirements.
NF C93-422:1977 Electronic components. Connecting devices. Circular multipole connectors.
UTE C93-703U*UTE C93-703:1989 Electronic components. Guide for the design and use of printed boards.

Defense Logistics Agency

DLA MIL-STD-1276 G VALID NOTICE 1-2010 Leads for Electronic Component Parts
DLA QPL-83505-29-2006 SOCKETS (LEAD, ELECTRONIC COMPONENTS), GENERAL SPECIFICATION FOR
DLA DSCC-DWG-88041 REV A-2002 SOCKET, ADAPTER, FOR DISCRETE ELECTRONIC COMPONENTS, GENERAL DRAWING FOR
DLA DESC-DWG-85136 REV D-1993 HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY

German Institute for Standardization

DIN EN IEC 62435-9:2023-09*VDE 0884-135-9:2023-09 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-7:2022-10*VDE 0884-135-7:2022-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-4:2019-05*VDE 0884-135-4:2019-05 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-6:2019-04*VDE 0884-135-6:2019-04 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62435-2:2017-10*VDE 0884-135-2:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-3:2022-05*VDE 0884-135-3:2022-05 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62435-5:2017-10*VDE 0884-135-5:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62435-1:2017-10*VDE 0884-135-1:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-8:2022-11*VDE 0884-135-8:2022-11 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-8:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020); German version EN IEC 62435-8:2020
DIN EN IEC 62435-7:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020); German version EN IEC 62435-7:2021
DIN EN 62435-1 E:2013-10 Electronic components Long-term storage of electronic semiconductor devices Part 1: General requirements
DIN EN IEC 62435-9:2022-09 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases (IEC 62435-9:2021); German version EN IEC 62435-9:2021 / Note: Date of issue 2022-08-05
DIN EN 62435-2 E:2013-10 Electronic components Long-term storage of electronic semiconductor devices Part 2: Damage mechanisms
DIN EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017); German version EN 62435-5:2017
DIN EN IEC 62435-6:2019 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices (IEC 62435-6:2018); German version EN IEC 62435-6:2018
DIN 45922-1:1984 Harmonized system of quality assessment for electronic components; generic specification: potentiometers

International Electrotechnical Commission (IEC)

IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
IEC 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
QC 080000-2005 IEC quality assessment system for electronic components (IECQ) - Electrical and electronic components and products hazardous substance free standard and requirements
IECQ QC001003-1998 IEC Quality Assessment System for Electronic Components (IECQ) — Guidance documents
IEC 60319:1978 Presentation of reliability data on electronic components (or parts)
IECQ OD 3402-2-2018 IECQ OPERATIONAL DOCUMENT – Part: 3402-2 – IECQ ECMP Assessment, Evidence of Compliance Summary and Assessment Reporting Form SAE EIA-STD4899 revision C Implementation Audit
IEC 62435-7:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
QC 001003-1998 IEC quality assessment system for electronic components (IECQ) - Guidance documents
QC 001004-2006 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
QC 001004-2004 IEC Quality Assessment System for Electronic Components - Specifications list
IECQ OD 3803-2020 IEC Quality Assessment System for Electronic Components (IECQ System) Operational Document

U.S. Military Regulations and Norms

ARMY MIL-E-50748 VALID NOTICE 2-2013 Electronic Component Assembly, 11737477 ("A" Trigger)
ARMY MIL-E-50745-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
ARMY MIL-E-50745 NOTICE 1-1996 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
ARMY MIL-E-50745 VALID NOTICE 2-2013 Electronic Component Assembly, 11737807 (Pre-Regulator)
ARMY MIL-E-45962 (1)-1977 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
ARMY MIL-E-50748-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737477 ("A" TRIGGER)
ARMY MIL-E-45962-1976 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
ARMY MIL-E-45962 REINST NOTICE 2-1996 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
ARMY MIL-E-50748 NOTICE 1-1997 ELECTRONIC COMPONENT ASSEMBLY, 11737477 ("A" TRIGGER)
ARMY MIL-E-45925 (2)-1976 ELECTRONIC COMPONENTS ASSEMBLY, (11688148)
ARMY MIL-E-45962 NOTICE 3-1997 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
ARMY MIL-E-45925-1975 ELECTRONIC COMPONENTS ASSEMBLY, (11688148)
ARMY MIL-E-50739-1973 ELECTRONIC COMPONENT ASSEMBLY, 11738818 (CHARGE CONTROL)
ARMY MIL-E-50738 NOTICE 1-1997 MILITARY SPECIFICATION ELECTRONIC COMPONENT ASSEMBLY, 11738850 (POWER CONTROL)
ARMY MIL-E-50739 NOTICE 1-1997 ELECTRONIC COMPONENT ASSEMBLY, 11738818 (CHARGE CONTROL)
ARMY MIL-E-50738-1973 ELECTRONIC COMPONENT ASSEMBLY, 11738850 (POWER CONTROL)

Military Standards (MIL-STD)

MIL MIL-E-50748-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737477 (,A, TRIGGER)
MIL MIL-E-50745-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
MIL MIL-STD-1276H-2013 Leads for Electronic Component Parts
MIL MIL-STD-1276J-2018 Leads for Electronic Component Parts
MIL MIL-E-45962-1976 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
MIL MIL-E-50739-1973 ELECTRONIC COMPONENT ASSEMBLY, 11738818 (CHARGE CONTROL)

GCC Standardization Organization

GSO IEC 62435-8:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
GSO IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
GSO IEC 62435-1:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
GSO IEC/PAS 62435:2014 Electronic components - Long-duration storage of electronic components - Guidance for implementation
GSO IEC 62435-4:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
GSO IEC 62435-2:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

Danish Standards Foundation

DANSK DS/EN IEC 62435-8:2020 Electronic components – Long-term storage of electronic semiconductor devices – Part 8: Passive electronic devices
DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
DANSK DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
DANSK DS/EN IEC 62435-6:2018 Electronic components – Long-term storage of electronic semiconductor devices – Part 6: Packaged or finished devices
DS/EN IEC 62435-9:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 9: Special cases
DANSK DS/EN 62435-5:2017 Electronic components – Long-term storage of electronic semiconductor devices – Part 5: Die and wafer devices
DANSK DS/EN IEC 62435-3:2020 Electronic components – Long-term storage of electronic semiconductor devices – Part 3: Data
DANSK DS/EN 62435-1:2017 Electronic components – Long-term storage of electronic semiconductor devices – Part 1: General
DANSK DS/EN IEC 62435-4:2018 Electronic components – Long-term storage of electronic semiconductor devices – Part 4: Storage
DS/IECQ 080000 (IECQ HSPM):2006 IEC Quality Assessment System for Electronic Components (IECQ) - Electrical and Electronic Components and Products Harzardous Substance Process Management System Requirements (HSPM)
DANSK DS/EN 62435-2:2017 Electronic components – Long-term storage of electronic semiconductor devices – Part 2: Deterioration mechanisms
DANSK DS/EN IEC 62435-9:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 9: Special cases

Comitato Elettrotecnico Italiano

CEI EN IEC 62435-8:2021 Electronic components - Long-term storage of electronic semiconductor devices Part 8: Passive electronic devices
CEI EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices Part 7: Micro-electromechanical devices
CEI EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices Part 5: Die and wafer device
CEI EN IEC 62435-6:2019 Electronic components - Long-term storage of electronic semiconductor devices Part 6: Packaged or finished devices
CEI EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices Part 1: General
CEI EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices Part 4: Storage
CEI EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices Part 3: Data
CEI EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices Part 2: Deterioration mechanisms
CEI EN IEC 62435-9:2022 Electronic components - Long-term storage of electronic semiconductor devices Part 9: Special cases

CU-NC

NC 59-04-09-1984 National Electrotechnical Vocabulary. Electronic Elements and Components. Resistors
NC 59-04-08-1985 National Electrotechnical Vocabulery. Electronic Components and Calis Electromechanic Components for Electronic Eouloment. General Conceots
NC 59-04-04-1986 National Electrotechnical Vocabulary. Electronic Elements and Components. Electronic Tubes

Kingdom of Bahrain Testing and Metrology Directorate

BH GSO IEC 62435-8:2023 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
BH GSO IEC 62435-5:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
BH GSO IEC 62435-4:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
BH GSO IEC 62435-1:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
BH GSO IEC 62435-2:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

Spanish Association for Standardization (UNE)

UNE-EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (Endorsed by Asociación Española de Normalización in October of 2020.)
UNE-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN 9145:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
UNE-EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)
UNE-EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage (Endorsed by Asociación Española de Normalización in September of 2018.)
UNE-EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration Mechanisms (Endorsed by Asociación Española de Normalización in June of 2017.)

Swedish Institute for Standards

SS-EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
SS-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
SS-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
SS-EN IEC 62435-6:2019 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
SS-EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
SS-EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
EN 100012:1995 Basic Specification: X-Ray Inspection of Electronic Components

AIA/NAS - Aerospace Industries Association of America Inc.

NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
NAS4122-2013 HEAT SINK@ ELECTRICAL-ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ EXTRUDED (REV 1)
NAS4124-2012 HEAT SINK@ ELECTRICAL/ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ DUAL LINK (Rev 1)
NAS4120-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Encapsulating Type@ TO-5
NAS4118-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ RETAINER CLIP TYPE (Rev 1)
NAS4123-1995 Heat Sink@ Electrical-Electronic Component@ Semiconductor Devices@ for Dual Inline Packages (DIP)
NAS4121-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ FORMED (Rev 1)

Aerospace Industries Association

AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
AIA NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
AIA NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
AIA NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999

PH-BPS

PNS IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
PNS IEC 62435-3:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
PNS IEC 62435-1:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General

Lithuanian Standards Office

LST EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020)
LST EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020)
LST EN 100012-2001 Basic specification: X-ray inspection of electronic components

PL-PKN

PN-EN IEC 62435-8-2021-04 E Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020)
PN T01020 ArkusZ06-1973 Electronic contact components Simple joint elements Terms and definitions
PN-EN IEC 62435-7-2021-08 E Electronic components -- Long-term storage of electronic semiconductor devices -- Part 7: Micro-electromechanical devices (IEC 62435-7:2020)
PN T01020 ArkusZ03-1973 Electronic contact components Switching devices Terms and definitions
PN-EN IEC 62435-3-2020-11 E Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (IEC 62435-3:2020)
PN T84000-1990 Electronic component Dimensions of spindle ends for manually operated electronic components
PN T80001-1974 Electronic components Mica capacitors General re?uirements and tests
PN T01020 ArkusZ04-1973 Electronic contact components Connectors Terms and definitions
PN T80001-1988 Electronit components Mica capacitors General requirements and tests
PN T04603-1990 Electronic components Variable capacitors Terms and methods ot' tests
PN T80006-1988 Electronic components Aluminium electrolytic polar capacitors General requirements and tests
PN T04602-12-1990 Electronic components Fixed capacitors Basic environmental testing procedures
PN T04601-11-1991 Electronic components. Fixed resistors. Basic environmetal testing procedures

IECQ - IEC: Quality Assessment System for Electronic Components

QC 300301/ KR 0006-1990 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0002-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0004-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0003-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0001-1984 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0005-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 400601/ JP 0001-1988 Detail Specification for Electronic Components Fixed Chip Resistors
PQC 39/SU 0009-1990 Detail Specification for Electronic Components Generator Tube GU-88A
QC 300301/ SU 0001-1990 Electronic Components Fixed Aluminium Electrolytic Capacitors with Non-Solid Electrolyte Type K50-53
QC 300301/ CN 0004-1989 Electronic Components Fixed Aluminium Electrolytic Capacitors@ Type CD291@ CD292 and CD293 Assessment Level E
PQC 39/SU 0007-1990 Detail Specification for Electronic Components Receiving Picture Tube I6LK8B
PQC 39/SU 0002-1987 Detail Specification for Electronic Components Receiving Picture Tube 31LK4B

Aerospace Industries Association/ANSI Aerospace Standards

AIA/NAS NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
AIA/NAS NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
AIA/NAS NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
AIA/NAS NAS4118-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, RETAINER CLIP TYPE (Rev 1)
AIA/NAS NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
AIA/NAS NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
AIA/NAS NAS4120-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
AIA/NAS NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
AIA/NAS NAS4123-2012 HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
AIA/NAS NAS4121-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED (Rev 1)

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC AJ-820 SECTION 4.0-1997 Electronic Circuit Components
IPC TM-650 2.6.22-1995 Acoustic Microscopy for Plastic Encapsulated Electronic Components

BE-NBN

NBN C 93-001-1977 Passive electronic components. Normal value set for resistors and capacitors

IN-BIS

IS 12825-1989 Piezoelectric ceramic components for electronic buzzers—Specification

The Directorate General of Specifications and Metrology (DGSM)

OS GSO IEC/PAS 62435:2014 Electronic components - Long-duration storage of electronic components - Guidance for implementation

Institute of Electrical and Electronics Engineers (IEEE)

IEEE 1499-1998 Interface for hardware description models of electronic components
IEEE Std 1499-1998 IEEE Standard Interface for Hardware Description Models of Electronic Components

American Society for Testing and Materials (ASTM)

ASTM F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

Society of Automotive Engineers (SAE)

SAE EIA-601A-2015 General Procedure for Capability Approval of Electronic Components
SAE GEIASTD0008 Derating of Electronic Components
SAE AS12500 Corrosion Prevention and Deterioration Control in Electronic Components and Assemblies

Government Electronic & Information Technology Association

GEIA-STD-4899A-2007 Standard for Preparing an Electronic Components Management Plan
GEIA 601-A-1998 General Procedure for Capability Approval of Electronic Components

CZ-CSN

CSN 35 8050-1980 Electronic components. Testing

American National Standards Institute （ANSI)

ANSI/GEIA STD-0008-2012 Derating of Electronic Components
ANSI/EIA 4899:2002 Standard for Preparing an Electronic Components Management Plan

JP-JEITA

JEITA RCR 1001A-2007 Safety application guide on components for use in clectronic and electrical equipments

RO-ASRO

STAS 10003-1975 PASSIVE ELECTRON COMPONENTS Method of mcasumnent of nun linearily of resistors

PT-IPQ

NP 3092/1-1985 Electronic component. Varistor type. General specifications
NP 3130/1-1985 Electronic component. Thermal resistors, general specifications

Association for Electrical, Electronic & Information Technologies (VDE)

VDE 0884-135-5-2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (IEC 62435-5:2017); German version EN 62435-5:2017