SJ/T 2421-1996 in English

VALID

Tinned copper clad wire for electronic components

Issued on:1996-07-22
Implemented on:1996-11-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $160.00
$156.00

Standard No:	SJ/T 2421-1996
Document status:	VALID
Title in English:	Tinned copper clad wire for electronic components
Title in Chinese:	电子器件用镀锡铜包钢线
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1996-07-22
Implemented on:	1996-11-01
Professional Classification:	SJ-Electronics
Related Keywords:	copper clad wire electronic components scopethis standard copper-clad steel wire electronic components core wire
Related Topics:	tinned Electrical components Tinned copper wire for electronic components sj/t11036-1996 sj/t 11036-1996 SJ/T+11036-+1996 Tin plating agent sj/t 11042-1996 sj/t11064-1996 sj/t10737-1996 sj/t 10899-1996 sj/t 11102-1996 Electrical components tin copper tin english electronic device Electronic components SJ+T+11145+1996 sj/t 11037-1996 sj/t10934-1996 Electronic components eia electronic componentsppm Tinned copper clad steel wire Industrial Electronic Components Electronic Component Component Standards sj/t 11033-1996 sj/t 11020-1996 sj/t11020-1996 Tin plate Environmental tin wire tinned wire Low temperature for electronic components Electronic Component tin Tinned wire standard ED1451 Electronic component coating Electronic component tin layer thickness JEDEC Tinned copper wire storage Tin layer thickness detection of electronic components Reference standards for electroplated copper-clad aluminum Tinned core wire Universal storage of electronic components Tinned nickel wire for electronic components Tinned Copper Resistivity Standard Copper-clad steel wire industry Electronic components industry standards copper clad steel wire What is the standard for tinned copper-clad steel wire? copper clad steel Tin wire Electronic component packaging requirements Power copper bar electroplating Tinned wire soldering Tinned copper storage Electroplating Tin International UV resistance requirements for electronic components Electroplated polytin Tinned copper wire solder joints Tinned copper clad steel group Documents citing standards for tinned copper-clad steel Electronic components climbing tin Electronic component packaging specification document Device tin industry sj/t 11064-1996 sj/t 10742-1996 sj/t 10920-1996 Electroplating copper

Scope

This standard specifies the grade, marking, requirements, test methods, inspection rules, packaging, marking, transportation and storage of tinned copper-clad steel wire. This standard applies to the manufacture of lead wires for electronic components. It uses low carbon steel as the core wire and is copper-coated and drawn. Products made by electroplating or hot-dipping tin (tin-based alloy).

More samples: NB/T 47013.2-2015 QC/T 942-2021 JJG 21-2008

Sample only — not a preview of SJ/T 2421-1996

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