Electronic Component
Electronic Component, Total:243 items.
The international standard classification for "Electronic Component" includes: Character sets and information coding , Aerospace electric equipment and systems , Electronic components in general , IT applications in transport and trade , Plug-and-socket devices. Connectors , Aircraft and space vehicles in general , Semiconductor devices .
The Chinese standard classification for "Electronic Component" includes: Computer application , Electronic components , Technical Management , Technical management , Special electronic technology material , Electronic element in general , Commerce, Trade and Contract , Connector , Other production equipment , Connecting piece for installation and wiring , Basic standards and general methods , Microcircuit in general , Capacitor , Semiconductor discrete devices in general , Aircraft and its accessories in general , Technology and technological equipment .
Military Standard of the People's Republic of China-General Armament Department
- GJB 8897-2017 Failure analysis requirements and methods for military electronic components
- GJB/Z 83-1996 Selection Guide for Aerospace Electronic Components Microwave Components
- GJB 7243-2011 Screening technical requirement for military electronic components
- GJB 1218-1991 General specification for sockets and accessories for plug-in electronic components
- GJB 546B-2011 Quality assurance program for electronic parts
- GJB/Z 112-1998 Selection Guide for Aerospace Electronic Components Capacitors
- GJB 4027A-2006 Methods of destructive physical analysis for military electronic components
- GJB/Z 48.1A-2011 Series programmes for military electronic components and devices Optical fibres
- GJB 978-1990 General specifications for single-row and double-row plug-in electronic component sockets
- GJB 9397-2018 Test method for neutron radiation effects of military electronic components
- GJB 3404-1998 Electronic component selection and management requirements
- GJB 3243A-2021 Requirements for surface mount of components and devices
- GJB 2445-1995 General specification for lead terminal sockets of electronic components
- GJB 6777-2009 Testing method of single event effects in
Cf radiation source for military electronic devices - GJB/Z 56-1994 Guide to Selection of Electronic Components for Aerospace Use Semiconductor Integrated Circuits
- GJB 8118-2013 Classification and code for military electronic component
- GJB 546-1988 Reliability Guarantee Outline for Electronic Components
- GJB 4027-2000 Destructive physical analysis method of military electronic components
- GJB 3014-1997 Statistical process control system for electronic components
- GJB/Z 62.3-1994 Military electrical connector series plug-in electronic component socket
- GJB/Z 55-1994 Selection Guide for Aerospace Electronic Components Semiconductor Discrete Devices
- GJB 978A-1997 General specifications for single-row and double-row plug-in electronic component sockets
- GJB 4027B-2021 Destructive physical analysis method of military electronic components
- GJB 2607-1996 Specification for tinned nickel wire for electronic components
- GJB 4681-1995*GJBz 20253-1995 Specifications for the selection and inspection of electronic components for military radar and electronic countermeasures equipment
- GJB/Z 49.1A-2013 Military electronic components series type spectrum optical cable
- GJB 2823-1997 Evaluation method for average factory quality level of electronic component products
- GJB 1437-1992 Electronic component leads
Professional Standard - Aerospace
- QJ/Z 147-1985 Detailed Rules for Enamel Tin Process of Electronic Components
- QJ 2663-1994 Collection Card and Filling Requirements for Failure Data of Aerospace Electronic Devices
- QJ 1317A-2005 Classification and Coding for Electronic Components Failure
- QJ 2145-1991 Regulations on Quality and Reliability Management of Electronic Components
- QJ 3267-2006 Technical requirements for tinning process of electronic components
- QJ 1317-1987 Electronic component failure classification and code
- QJ 2671-1994 Quality Management Requirements for Imported Electronic Devices
- QJ 2227-1992 Requirements for storage and overdue re-inspection of aerospace electronic components
- QJ 1693-1989 Anti-static requirements for electronic components
- QJ 3152-2002 Management Requirements for New Electronic Components of Aerospace Application
Professional Standard - Electron
- SJ 2422-1983 Tined copper wire for electronic components
- SJ/T 10150-1991 Graphic base of electronic components graphics for resistor capacitor and inductor
- SJ/T 10221-1991 Guide for manufacture quality control of generic electronic components
- SJ/T 11083-1996 Detailed specifications for electronic components - FU-250F electronic tubes (Applicable for certification)
- SJ/T 10035-1991 Detail specification for electronic components Electronic tube of type FC-620F (Applicable for certification)
- SJ/T 10225-1991 Graphic base of electronic Components-graphic of electro-mechanical components
- SJ/T 11084-1996 Detailed specifications for electronic components - FU-100F electronic tubes (Applicable for certification)
- SJ/T 11078-1996 Detail specification for electronic components - Electronic tube of type FC-306 (Applicable for certification)
- SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
- SJ 3181-1989 Graphic base of electronic elements - IC Graphic
- SJ 2897-1988 Detail specification for electronic components - Preset potentiometers for Type WI19 Assessment level E
- SJ 20716-1998 Specification for Copper-beryllium alloy wire and bor for use in electronic components
- SJ/T 10630-1995 Antistatic requirments for manufacturing electronic element and device
- SJ/T 11125-1997 Encapsulation materials of epoxy series for use in electronic components
- SJ 2683-1986 Detailed specifications for electronic components, Type WH112 Preset potentiometers Assessment level E
- SJ/T 10863-1996 Detailed specifications for electronic components - 47SX101Y22-DC05 color picture tubes (Applicable for certification)
- SJ 2909-1988 Detail specification for electronic components - Preset potentiometers for Type WH112A Assessment level E
- SJ/T 10971-1996 Detailed specifications for electronic components - 3DD204 silicon NPN case-rated transistors for low frequency amplification (Applicable for certification)
- SJ/T 11124-1997 Encapsulation materials of expoy series powder for use in electronic components
- SJ 2910-1988 Detail specification for electronic components--Preset potentiometers for Type WHW97 Assessment level E
- SJ 2894-1988 Detail specification for electronic components-Preset potentiometers for Type WS23 Assessment level E
- SJ/T 10248-1991 Detail specification for electronic components-Photo tube of type GD-24 (Applicable for certification)
- SJ/T 10991-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CW574CS voltage regulators for electronic tuners
- SJ/T 2421-1996 Tinned copper clad wire for electronic components
- SJ/T 11091-1996 General specification for lead-tinned for electronic components
- SJ 20036-1992 Specification for Barium sodium polassium glass for military electronic devices and components
- SJ 20715-1998 Specification for Copper-beryllium alloy plate and strip for use in electronic components
- SJ/T 10611-1994 Detail specification of electronic components Type CD17 fixed aluminium electrolyte capacitors
- SJ/T 10718-1996 Examples for preparation of design documents of electronic equipment
- SJ 2896-1988 Detail specification for electronic components - Preset potentiometers for Type WI02A Assessment level E
- SJ/T 10036-1991 Detail specification for electronic components Electronic tube of type FU-605 (Applicable for certification)
Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence
- GJB/Z 128-2000 Guideline for selection and application of spaceborne electronic parts Relays
- GJB 3243-1998 Surface Mounting Requirements for Electronic Components
- GJB 546A-1996 Quality Assurance Program for Electronic Components
- GJB 2118-1994 Marking of military electrical and electronic components
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 15176-1994 Generic specification for sockets and accessoies for electronic plug-in devices
- GB 9539-1988 Detail specification for flat cable connectors,Type DC2
- GB/T 1772-1979 Determination of failure rate of electronic elements and components
- GB/T 13947-1992 specification for electronic components plastic packaging equipments
- GB/T 5593-2015 Structure ceramic materials used in electronic component and device
- GB/T 11279-1989 Guide to the application of environmental tests to electronic components
- GB/Z 31478-2015 Process management for avionics―Preparation of an electronic components management plan
- GB/T 28858-2012 Encapsulating material of phenolic for electronic components
- GB 9583-1988 Detail specification for electronic components-Fixed tantalum capacitors with solid electrolyte for Type CA
- GB/T 42706.2-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 2:Deterioration mechanisms
- GB/T 28859-2012 Encapsulating material of powdered epoxy for electronic components
- GB/T 5593-1996 Structure ceramic materials usec in electronic components
- GB/T 32054-2015 Electronic commerce trading product information description―Electronic components
- GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1:General
工业和信息化部
- JB/T 6175-2020 The lead forming process specifcation for the electronic componcnts
- SJ/T 11769-2020 General requirements for low-frequency noise parameters measurement method of electronic components and devices
- HG/T 6101-2022 Top and bottom adhesive tapes for electronic components packaging
Group Standards of the People's Republic of China
- T/CIE 116-2021 Fault tree analysis method and procedure of electronic components
- T/CPSS 1013-2021 Technology specification for derating of electronic components of switching power supply
- T/ZEIIA 02-2020 Test method of electronic paste for electronic components
- T/ZPP 042-2023 Overall technical conditions of electronic component reliability test equipment
- T/SLEIA 0002-2024 Test standards for low-frequency noise characteristics of electronic components
- T/SDWL 0004-2024 Technical requirements for circulating packaging of electrostatic sensitive devices
Professional Standard - Military and Civilian Products
- WJ 2652-2005 Technical requirement for screening of electronic elements for fuses
Shaanxi Provincial Standard of the People's Republic of China
- DB6101/T 3138-2022 Electronic component testing and screening service regulations
Professional Standard - Aviation
- HB 8424-2014 Leak test method for sealing of aviation components
- HB 7262.6-1995 Aviation Product Electric Fitting Process - Bonding Fixation of Electronic Devices
- HB 7262.1-1995 Aviation Product Electric Fitting Process - Installation of Electronic Devices
- HB 7262.2-1995 Aviation Product Electric Fitting Process - Welding of Electronic Devices
Professional Standard - Machinery
- JB/T 6175-1992 Process Specification for Forming of Instrumentation Electronic Component Lead Wire
RU-GOST R
- GOST 25486-1982 Electronic components. Marking
- GOST 24385-1980 Electronic components. The rules marking of packing
KR-KS
- KS C 5109-1988(2023) General rules for electronic components
- KS C 5109-1988(2018)(英文版) General rules for electronic components
Korean Agency for Technology and Standards (KATS)
- KS C 5109-1986 General Rules for Electronic Components
- KS C 5109-1988(2018) General rules for electronic components
- KS C 5109-1988 General Rules for Electronic Components
- KS C 6018-1971 Environmental Requirements for Electronic Components
- KS C 6018-1982 Environmental Requirements for Electronic Components
- KS C 6018-1971(2017) Environmental Requirements for Electronic Components
- KS C 6013-1982 Testing method of endurance(electrical) for electronic component
- KS C 6012-1960 Testing method of sealing(immersion cyclic) for electronic components
- KS C 6032-1981 General test procedure of failure rate for electronic components
- KS C 6012-1982 Testing method of sealing(immersion cyclic) for electronic components
- KS C 6021-1977 Endurance(mechanical) testing method for electronic components
- KS C 6021-1982 Endurance(mechanical) testing method for electronic components
- KS C 6430-2004 General rules for reliability assured electronic components
- KS C 6012-1982(2017) Testing method of sealing(immersion cyclic) for electronic components
Japanese Industrial Standards Committee (JISC)
- JIS C 5001:1987 General rules for electronic components
- JIS C 5022:1978 Dry heat testing procedures for electronic components
- JIS C 5002:1968 Environmental requirements for electronic components
- JIS C 5028:1975 Salt mist testing method for electronic components
- JIS C 5021:1978 Cold testing procedures for electronic components
- JIS C 5029:1975 Low air pressure testing method for electronic components
- JIS C 5030:1978 Change of temperature testing procedures for electronic components
- JIS C 5031:1975 Sealing testing methods for electronic components
- JIS C 5024:1978 Damp heat (cyclic) testing procedures for electronic components
- JIS C 5027:1975 Storage (low temperature) testing method for electronic components
- JIS C 5023:1978 Damp heat (steady state) testing procedures for electronic componets
- JIS C 5036:1975 Endurance (electrical) testing method for electronic components
- JIS C 0805:1989 Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)
- JIS C 5037:1975 Endurance (mechanical) testing method for electronic components
- JIS C 5003:1974 General test procedure of failure rate for electronic components
- JIS C 5032:1975 Sealing (immersion cyclic) testing method for electronic components
Defense Logistics Agency
- DLA MIL-STD-1276 G VALID NOTICE 1-2010 Leads for Electronic Component Parts
- DLA QPL-83505-29-2006 SOCKETS (LEAD, ELECTRONIC COMPONENTS), GENERAL SPECIFICATION FOR
Association Francaise de Normalisation
- NF C93-265/A1:1984 Composants électroniques. Potentiomètres bobines de précision.
- NF C93-265/A2:1984 Electronic components. Precision coil potentiometers
- NF UTE C93-265/A1:1975 ELECTRONIC COMPONENTS. PRECISION COIL POTENTIOMETERS
- UTE C93-715U*UTE C93-715:1994 Electronic components. Guidelines for artwork.
- UTE C93-002U*UTE C93-002:1966 Electronic components. General. Inspection by attributes.
- UTE C93-723U*UTE C93-723:1979 Electronic components. Printed wiring. Rework of printed boards.
- UTE C93-717U*UTE C93-717:1994 Electronic components. Characteristics and control of thermal drains.
- UTE C93-591U*UTE C93-591:1994 Electronic components. Semi-flexible waveguides with flanges.
- UTE C93-751U*UTE C93-751:1985 Electronic components. Base materials for printed circuits. Detail specifications.
- UTE C93-719U*UTE C93-719:1994 Electronic components. Specification for interconnection multiwire printed boards.
- UTE C93-680U*UTE C93-680:1989 Electronic components. Signal organs. Indicator lights. Detail specifications.
- UTE C93-551U*UTE C93-551:1977 Electronic components. Semi rigid coaxial cables. Detail requirements.
- UTE C93-552U*UTE C93-552:1995 Electronic components. Coaxial cables for installation of transmission equipments.
- UTE C93-703U*UTE C93-703:1989 Electronic components. Guide for the design and use of printed boards.
- UTE C93-720U*UTE C93-720:1995 Electronic components. Inspection of printed boards for microwave applications.
- UTE C90-132U*UTE C90-132:2001 Electronic components. Coaxial cables used in cabled distribution systems
- UTE C93-426U*UTE C93-426:1977 Electronic components. Connecting devices. Multipole rectangular connectors without shell.
- UTE C93-422 L15U*UTE C93-422 L15:1985 ELECTRONIC COMPONENTS. CONNECTING DEVICES. CIRCULAR MULTIPOLE CONNECTORS. BOOK 15.
- NF C83-113:1981 Harmonized system of quality assessment for electronci components. Sectional specification. Tantalum chip capacitors.
- NF C83-100:1981 Harmonized system of quality assessment for electronic components. Generic specification. Fixed capacitors.
- UTE C93-422U*UTE C93-422:1977 Electronic components. Connecting devices. Circular multipole connectors. Detail requirements.
- UTE C93-422/A1U*UTE C93-422/A1:1978 ELECTRONIC COMPONENTS. CONNECTING DEVICES. CIRCULAR MULTIPOLE CONNECTORS. DETAIL REQUIREMENTS.
- NF C83-250:1982 Harmonized system of quality assessment for electronic components. Generic specification. Potentiometers.
- UTE C80-804U*UTE C80-804:1995 Electronic components. Guidance document. Interpretation of "EN 29000". Reliability aspects for electronic components. (specification CECC 00 804).
CU-NC
- NC 59-04-09-1984 National Electrotechnical Vocabulary. Electronic Elements and Components. Resistors
SCC
- BS IEC 61163-2:1998 Reliability stress screening-Electronic components
- BS DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
- BS 2011-2J:1967 The enviromental testing of electronic components and electronic equipment. Salt mist
- BS 2011-2KA:1963 The enviromental testing of electronic components and electronic equipment. Salt mist
- BS 2011-2Q:1967 The enviromental testing of electronic components and electronic equipment. Sealing
- BS 2011-2EA:1967 The enviromental testing of electronic components and electronic equipment. Shock
- BS 2011-2EB:1967 The enviromental testing of electronic components and electronic equipment. Bump
- BS 2011-2QG:1967 The enviromental testing of electronic components and electronic equipment. Sealing, driving rain
- BS 2011-2QL:1967 The enviromental testing of electronic components and electronic equipment. Container sealing bomb pressure test
- BS 2011-2QC:1967 The enviromental testing of electronic components and electronic equipment. Container sealing, gas leakage
- BS 2011-2QE:1967 The enviromental testing of electronic components and electronic equipment. Container sealing penetration of liquid
British Standards Institution (BSI)
- DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
- BS CECC 00804:1996 Harmonized system of quality assessment for electronic components - Interpretation of 'EN ISO 9000:1994': Reliability aspects for electronic components
- BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
- BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
- BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data
- BS EN IEC 62435-6:2018 Electronic components. Long-term storage of electronic semiconductor devices - Packaged or finished devices
- BS QC 001002:1991 Rules of procedure of the IEC quality assessment system for electronic components (IECQ)
- BS CECC 41000:1977 Harmonized system of quality assessment for electronic components: generic specification for potentiometers
- BS QC 720100:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for optoelectronic devices
- BS EN 175200:1997 Harmonized system of quality assessment for electronic components - Sectional specification: circular connectors
- BS EN 100012:1996 Harmonized system of quality assessment for electronic components - Basic specification - X-ray inspection of electronic components
- BS CECC 96000:1987 Harmonized system of quality assessment for electronic components. Generic specification: electromechanical switches
Government Electronic & Information Technology Association
- GEIA-STD-4899A-2007 Standard for Preparing an Electronic Components Management Plan
- GEIA 601-A-1998 General Procedure for Capability Approval of Electronic Components
Society of Automotive Engineers (SAE)
- SAE EIA-601A-2015 General Procedure for Capability Approval of Electronic Components
Institute of Electrical and Electronics Engineers (IEEE)
- IEEE 1499-1998 Interface for hardware description models of electronic components
- IEEE Std 1499-1998 IEEE Standard Interface for Hardware Description Models of Electronic Components
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- IPC TM-650 2.6.22-1995 Acoustic Microscopy for Plastic Encapsulated Electronic Components
IECQ - IEC: Quality Assessment System for Electronic Components
- PQC 39/SU 0009-1990 Detail Specification for Electronic Components Generator Tube GU-88A
- QC 300301/ KR 0006-1990 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
- QC 300301/ KR 0003-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
- QC 300301/ KR 0002-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
- QC 300301/ KR 0001-1984 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
- QC 300301/ KR 0005-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
- QC 300301/ KR 0004-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
- PQC 39/SU 0007-1990 Detail Specification for Electronic Components Receiving Picture Tube I6LK8B
- PQC 39/SU 0002-1987 Detail Specification for Electronic Components Receiving Picture Tube 31LK4B
- QC 300301/ CN 0004-1989 Electronic Components Fixed Aluminium Electrolytic Capacitors@ Type CD291@ CD292 and CD293 Assessment Level E
- QC 001006-1999 IECQ Quality Assessment System for Electronic Components (IECQ) Register of Participating Countries
- QC 300301/ SU 0001-1990 Electronic Components Fixed Aluminium Electrolytic Capacitors with Non-Solid Electrolyte Type K50-53
American National Standards Institute (ANSI)
- ANSI/EIA 4899:2002 Standard for Preparing an Electronic Components Management Plan
- ANSI/EIA 186-14E:1985 Passive Electronic Component Parts - Test Method 14, Panel Seal Test
International Electrotechnical Commission (IEC)
- QC 080000-2005 IEC quality assessment system for electronic components (IECQ) - Electrical and electronic components and products hazardous substance free standard and requirements
- IEC 60319:1978 Presentation of reliability data on electronic components (or parts)
- QC 001004-2006 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
- QC 001004-2004 IEC Quality Assessment System for Electronic Components - Specifications list
- QC 001003-1998 IEC quality assessment system for electronic components (IECQ) - Guidance documents
- QC 001001-1986 Basic rules of the IEC quality assessment system for electronic components (IECQ)
- QC 001004-2003 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
- IEC 60319:1999 Presentation and specification of reliability data for electronic components
- QC 001004-2002 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
- QC 001001-1998 IEC quality assessment system for electronic components (IECQ) - Basic rules
- QC 001004-1999 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
- QC 001002-1986 Rules of procedure of the IEC quality assessment system for electronic components (IECQ)
- IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
- IECQ 01-2003 IEC Quality assessment system for Electronic Components (IECQ) - Basic rules
- IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
- IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
- QC 001001-2002 IEC Quality Assessment System for Electronic Components (IECQ) - Basic Rules
- QC 200000-1996 Process assessment schedules for requirements under the IEC Quality Assessment System for Electronic Components (IECQ) for approval of specialist contractor's processes and/or products within the electronic components industry
- QC 001006-2005 IECQ Quality Assessment System for Electronic Components (IECQ-CECC) - Register of participating countries
- IECQ-CECC 01-2003 IEC Quality Assessment System for Electronic Components (IECQ-CECC) - Basic Rules
- QC 001006-1998 IEC quality assessment system for electronic components (IECQ) - Register of participating countries
Danish Standards Foundation
- DS/IECQ 080000 (IECQ HSPM):2006 IEC Quality Assessment System for Electronic Components (IECQ) - Electrical and Electronic Components and Products Harzardous Substance Process Management System Requirements (HSPM)
- DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
- DS/EN IEC 62435-9:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 9: Special cases
European Committee for Electrotechnical Standardization(CENELEC)
- EN 100012:1995 Basic Specification: X-Ray Inspection of Electronic Components
Lithuanian Standards Office
- LST EN 100012-2001 Basic specification: X-ray inspection of electronic components
BE-NBN
- NBN C 93-001-1977 Passive electronic components. Normal value set for resistors and capacitors
Indonesia Standards
- SNI 04-6972-2003 Presentation and specification of reliability data for electronic components
German Institute for Standardization
- DIN 45922-1:1984 Harmonized system of quality assessment for electronic components; generic specification: potentiometers
- DIN 45910-15:1983 Harmonized system of quality assessment for electronic components; sectional specification: tantalum chip capacitors
- DIN IEC 60319:2003 Presentation and specification of reliability data for electronic components (IEC 60319:1999)
- DIN EN 62090:2003 Product package labels for electronic components using bar code and two-dimensional symbologies (IEC 62090:2002); German version EN 62090:2003
IEC - International Electrotechnical Commission
- TS 62239-2008 Process management for avionics – Preparation of an electronic components management plan (Edition 2.0)
GOSTR
- GOST R 58857-2020 Rocket and space technology. Base of electron components. General provisions
Electronic Components, Assemblies and Materials Association
- ECA ECCB-954-2005 Electrical and Electronic Components and Products Hazardous Substance Free Standard and Requirements
ECIA - Electronic Components Industry Association
- ECCB-954-2005 Electrical and Electronic Components and Products Hazardous Substance Free Standard and Requirements
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