Sign In |Help & Support
ALL SECTORS
  • ALL SECTORS
  • GB(National Standard)
  • CB(Shipping)
  • CECS(Engineering Construction)
  • CJ(Urban Construction)
  • CY(News and Publication)
  • DB(Provincial Standard)
  • DL(Electricity & Power)
  • DZ(Geology & Mineralogy)
  • FZ(Spinning & Textile)
  • GA(Public Security)
  • HB(Aviation)
  • HG(Chemical Industry)
  • HJ(Environmental Protection)
  • JB(Machinery)
  • JC(Building Materials)
  • JG(Building & Construction)
  • JJ(Metering)
  • JT(Highway & Transportation)
  • LY(Forestry)
  • MT(Coal)
  • NB(Energy)
  • NY(Agriculture)
  • QB(Light Industry)
  • QC(Automobile & Vehicle)
  • QJ(Aerospace)
  • SH(Petrochemical)
  • SJ(Electronics)
  • SL(Water Resources)
  • SN(Commodity Inspection)
  • SY(Oil & Gas)
  • TB(Railway & Train)
  • YB(Ferrous Metallurgy)
  • YC(Tobacco)
  • YD(Telecommunication)
  • YY(Medical Device)
Database: 365,228(8 Aug 2026)

Electronic Component

Electronic Component, Total:243 items.

The international standard classification for "Electronic Component" includes: Character sets and information coding , Aerospace electric equipment and systems , Electronic components in general , IT applications in transport and trade , Plug-and-socket devices. Connectors , Aircraft and space vehicles in general , Semiconductor devices .

The Chinese standard classification for "Electronic Component" includes: Computer application , Electronic components , Technical Management , Technical management , Special electronic technology material , Electronic element in general , Commerce, Trade and Contract , Connector , Other production equipment , Connecting piece for installation and wiring , Basic standards and general methods , Microcircuit in general , Capacitor , Semiconductor discrete devices in general , Aircraft and its accessories in general , Technology and technological equipment .


Military Standard of the People's Republic of China-General Armament Department

  • GJB 8897-2017 Failure analysis requirements and methods for military electronic components
  • GJB/Z 83-1996 Selection Guide for Aerospace Electronic Components Microwave Components
  • GJB 7243-2011 Screening technical requirement for military electronic components
  • GJB 1218-1991 General specification for sockets and accessories for plug-in electronic components
  • GJB 546B-2011 Quality assurance program for electronic parts
  • GJB/Z 112-1998 Selection Guide for Aerospace Electronic Components Capacitors
  • GJB 4027A-2006 Methods of destructive physical analysis for military electronic components
  • GJB/Z 48.1A-2011 Series programmes for military electronic components and devices Optical fibres
  • GJB 978-1990 General specifications for single-row and double-row plug-in electronic component sockets
  • GJB 9397-2018 Test method for neutron radiation effects of military electronic components
  • GJB 3404-1998 Electronic component selection and management requirements
  • GJB 3243A-2021 Requirements for surface mount of components and devices
  • GJB 2445-1995 General specification for lead terminal sockets of electronic components
  • GJB 6777-2009 Testing method of single event effects in Cf radiation source for military electronic devices
  • GJB/Z 56-1994 Guide to Selection of Electronic Components for Aerospace Use Semiconductor Integrated Circuits
  • GJB 8118-2013 Classification and code for military electronic component
  • GJB 546-1988 Reliability Guarantee Outline for Electronic Components
  • GJB 4027-2000 Destructive physical analysis method of military electronic components
  • GJB 3014-1997 Statistical process control system for electronic components
  • GJB/Z 62.3-1994 Military electrical connector series plug-in electronic component socket
  • GJB/Z 55-1994 Selection Guide for Aerospace Electronic Components Semiconductor Discrete Devices
  • GJB 978A-1997 General specifications for single-row and double-row plug-in electronic component sockets
  • GJB 4027B-2021 Destructive physical analysis method of military electronic components
  • GJB 2607-1996 Specification for tinned nickel wire for electronic components
  • GJB 4681-1995*GJBz 20253-1995 Specifications for the selection and inspection of electronic components for military radar and electronic countermeasures equipment
  • GJB/Z 49.1A-2013 Military electronic components series type spectrum optical cable
  • GJB 2823-1997 Evaluation method for average factory quality level of electronic component products
  • GJB 1437-1992 Electronic component leads

Professional Standard - Aerospace

  • QJ/Z 147-1985 Detailed Rules for Enamel Tin Process of Electronic Components
  • QJ 2663-1994 Collection Card and Filling Requirements for Failure Data of Aerospace Electronic Devices
  • QJ 1317A-2005 Classification and Coding for Electronic Components Failure
  • QJ 2145-1991 Regulations on Quality and Reliability Management of Electronic Components
  • QJ 3267-2006 Technical requirements for tinning process of electronic components
  • QJ 1317-1987 Electronic component failure classification and code
  • QJ 2671-1994 Quality Management Requirements for Imported Electronic Devices
  • QJ 2227-1992 Requirements for storage and overdue re-inspection of aerospace electronic components
  • QJ 1693-1989 Anti-static requirements for electronic components
  • QJ 3152-2002 Management Requirements for New Electronic Components of Aerospace Application

Professional Standard - Electron

  • SJ 2422-1983 Tined copper wire for electronic components
  • SJ/T 10150-1991 Graphic base of electronic components graphics for resistor capacitor and inductor
  • SJ/T 10221-1991 Guide for manufacture quality control of generic electronic components
  • SJ/T 11083-1996 Detailed specifications for electronic components - FU-250F electronic tubes (Applicable for certification)
  • SJ/T 10035-1991 Detail specification for electronic components Electronic tube of type FC-620F (Applicable for certification)
  • SJ/T 10225-1991 Graphic base of electronic Components-graphic of electro-mechanical components
  • SJ/T 11084-1996 Detailed specifications for electronic components - FU-100F electronic tubes (Applicable for certification)
  • SJ/T 11078-1996 Detail specification for electronic components - Electronic tube of type FC-306 (Applicable for certification)
  • SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
  • SJ 3181-1989 Graphic base of electronic elements - IC Graphic
  • SJ 2897-1988 Detail specification for electronic components - Preset potentiometers for Type WI19 Assessment level E
  • SJ 20716-1998 Specification for Copper-beryllium alloy wire and bor for use in electronic components
  • SJ/T 10630-1995 Antistatic requirments for manufacturing electronic element and device
  • SJ/T 11125-1997 Encapsulation materials of epoxy series for use in electronic components
  • SJ 2683-1986 Detailed specifications for electronic components, Type WH112 Preset potentiometers Assessment level E
  • SJ/T 10863-1996 Detailed specifications for electronic components - 47SX101Y22-DC05 color picture tubes (Applicable for certification)
  • SJ 2909-1988 Detail specification for electronic components - Preset potentiometers for Type WH112A Assessment level E
  • SJ/T 10971-1996 Detailed specifications for electronic components - 3DD204 silicon NPN case-rated transistors for low frequency amplification (Applicable for certification)
  • SJ/T 11124-1997 Encapsulation materials of expoy series powder for use in electronic components
  • SJ 2910-1988 Detail specification for electronic components--Preset potentiometers for Type WHW97 Assessment level E
  • SJ 2894-1988 Detail specification for electronic components-Preset potentiometers for Type WS23 Assessment level E
  • SJ/T 10248-1991 Detail specification for electronic components-Photo tube of type GD-24 (Applicable for certification)
  • SJ/T 10991-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CW574CS voltage regulators for electronic tuners
  • SJ/T 2421-1996 Tinned copper clad wire for electronic components
  • SJ/T 11091-1996 General specification for lead-tinned for electronic components
  • SJ 20036-1992 Specification for Barium sodium polassium glass for military electronic devices and components
  • SJ 20715-1998 Specification for Copper-beryllium alloy plate and strip for use in electronic components
  • SJ/T 10611-1994 Detail specification of electronic components Type CD17 fixed aluminium electrolyte capacitors
  • SJ/T 10718-1996 Examples for preparation of design documents of electronic equipment
  • SJ 2896-1988 Detail specification for electronic components - Preset potentiometers for Type WI02A Assessment level E
  • SJ/T 10036-1991 Detail specification for electronic components Electronic tube of type FU-605 (Applicable for certification)

Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence

  • GJB/Z 128-2000 Guideline for selection and application of spaceborne electronic parts Relays
  • GJB 3243-1998 Surface Mounting Requirements for Electronic Components
  • GJB 546A-1996 Quality Assurance Program for Electronic Components
  • GJB 2118-1994 Marking of military electrical and electronic components

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 15176-1994 Generic specification for sockets and accessoies for electronic plug-in devices
  • GB 9539-1988 Detail specification for flat cable connectors,Type DC2
  • GB/T 1772-1979 Determination of failure rate of electronic elements and components
  • GB/T 13947-1992 specification for electronic components plastic packaging equipments
  • GB/T 5593-2015 Structure ceramic materials used in electronic component and device
  • GB/T 11279-1989 Guide to the application of environmental tests to electronic components
  • GB/Z 31478-2015 Process management for avionics―Preparation of an electronic components management plan
  • GB/T 28858-2012 Encapsulating material of phenolic for electronic components
  • GB 9583-1988 Detail specification for electronic components-Fixed tantalum capacitors with solid electrolyte for Type CA
  • GB/T 42706.2-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 2:Deterioration mechanisms
  • GB/T 28859-2012 Encapsulating material of powdered epoxy for electronic components
  • GB/T 5593-1996 Structure ceramic materials usec in electronic components
  • GB/T 32054-2015 Electronic commerce trading product information description―Electronic components
  • GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1:General

工业和信息化部

  • JB/T 6175-2020 The lead forming process specifcation for the electronic componcnts
  • SJ/T 11769-2020 General requirements for low-frequency noise parameters measurement method of electronic components and devices
  • HG/T 6101-2022 Top and bottom adhesive tapes for electronic components packaging

Group Standards of the People's Republic of China

  • T/CIE 116-2021 Fault tree analysis method and procedure of electronic components
  • T/CPSS 1013-2021 Technology specification for derating of electronic components of switching power supply
  • T/ZEIIA 02-2020 Test method of electronic paste for electronic components
  • T/ZPP 042-2023 Overall technical conditions of electronic component reliability test equipment
  • T/SLEIA 0002-2024 Test standards for low-frequency noise characteristics of electronic components
  • T/SDWL 0004-2024 Technical requirements for circulating packaging of electrostatic sensitive devices

Professional Standard - Military and Civilian Products

  • WJ 2652-2005 Technical requirement for screening of electronic elements for fuses

Shaanxi Provincial Standard of the People's Republic of China

Professional Standard - Aviation

  • HB 8424-2014 Leak test method for sealing of aviation components
  • HB 7262.6-1995 Aviation Product Electric Fitting Process - Bonding Fixation of Electronic Devices
  • HB 7262.1-1995 Aviation Product Electric Fitting Process - Installation of Electronic Devices
  • HB 7262.2-1995 Aviation Product Electric Fitting Process - Welding of Electronic Devices

Professional Standard - Machinery

  • JB/T 6175-1992 Process Specification for Forming of Instrumentation Electronic Component Lead Wire

RU-GOST R

KR-KS

Korean Agency for Technology and Standards (KATS)

Japanese Industrial Standards Committee (JISC)

  • JIS C 5001:1987 General rules for electronic components
  • JIS C 5022:1978 Dry heat testing procedures for electronic components
  • JIS C 5002:1968 Environmental requirements for electronic components
  • JIS C 5028:1975 Salt mist testing method for electronic components
  • JIS C 5021:1978 Cold testing procedures for electronic components
  • JIS C 5029:1975 Low air pressure testing method for electronic components
  • JIS C 5030:1978 Change of temperature testing procedures for electronic components
  • JIS C 5031:1975 Sealing testing methods for electronic components
  • JIS C 5024:1978 Damp heat (cyclic) testing procedures for electronic components
  • JIS C 5027:1975 Storage (low temperature) testing method for electronic components
  • JIS C 5023:1978 Damp heat (steady state) testing procedures for electronic componets
  • JIS C 5036:1975 Endurance (electrical) testing method for electronic components
  • JIS C 0805:1989 Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)
  • JIS C 5037:1975 Endurance (mechanical) testing method for electronic components
  • JIS C 5003:1974 General test procedure of failure rate for electronic components
  • JIS C 5032:1975 Sealing (immersion cyclic) testing method for electronic components

Defense Logistics Agency

Association Francaise de Normalisation

CU-NC

  • NC 59-04-09-1984 National Electrotechnical Vocabulary. Electronic Elements and Components. Resistors

SCC

  • BS IEC 61163-2:1998 Reliability stress screening-Electronic components
  • BS DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
  • BS 2011-2J:1967 The enviromental testing of electronic components and electronic equipment. Salt mist
  • BS 2011-2KA:1963 The enviromental testing of electronic components and electronic equipment. Salt mist
  • BS 2011-2Q:1967 The enviromental testing of electronic components and electronic equipment. Sealing
  • BS 2011-2EA:1967 The enviromental testing of electronic components and electronic equipment. Shock
  • BS 2011-2EB:1967 The enviromental testing of electronic components and electronic equipment. Bump
  • BS 2011-2QG:1967 The enviromental testing of electronic components and electronic equipment. Sealing, driving rain
  • BS 2011-2QL:1967 The enviromental testing of electronic components and electronic equipment. Container sealing bomb pressure test
  • BS 2011-2QC:1967 The enviromental testing of electronic components and electronic equipment. Container sealing, gas leakage
  • BS 2011-2QE:1967 The enviromental testing of electronic components and electronic equipment. Container sealing penetration of liquid

British Standards Institution (BSI)

  • DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
  • BS CECC 00804:1996 Harmonized system of quality assessment for electronic components - Interpretation of 'EN ISO 9000:1994': Reliability aspects for electronic components
  • BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
  • BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
  • BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data
  • BS EN IEC 62435-6:2018 Electronic components. Long-term storage of electronic semiconductor devices - Packaged or finished devices
  • BS QC 001002:1991 Rules of procedure of the IEC quality assessment system for electronic components (IECQ)
  • BS CECC 41000:1977 Harmonized system of quality assessment for electronic components: generic specification for potentiometers
  • BS QC 720100:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for optoelectronic devices
  • BS EN 175200:1997 Harmonized system of quality assessment for electronic components - Sectional specification: circular connectors
  • BS EN 100012:1996 Harmonized system of quality assessment for electronic components - Basic specification - X-ray inspection of electronic components
  • BS CECC 96000:1987 Harmonized system of quality assessment for electronic components. Generic specification: electromechanical switches

Government Electronic & Information Technology Association

Society of Automotive Engineers (SAE)

  • SAE EIA-601A-2015 General Procedure for Capability Approval of Electronic Components

Institute of Electrical and Electronics Engineers (IEEE)

  • IEEE 1499-1998 Interface for hardware description models of electronic components
  • IEEE Std 1499-1998 IEEE Standard Interface for Hardware Description Models of Electronic Components

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IECQ - IEC: Quality Assessment System for Electronic Components

  • PQC 39/SU 0009-1990 Detail Specification for Electronic Components Generator Tube GU-88A
  • QC 300301/ KR 0006-1990 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
  • QC 300301/ KR 0003-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
  • QC 300301/ KR 0002-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
  • QC 300301/ KR 0001-1984 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
  • QC 300301/ KR 0005-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
  • QC 300301/ KR 0004-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
  • PQC 39/SU 0007-1990 Detail Specification for Electronic Components Receiving Picture Tube I6LK8B
  • PQC 39/SU 0002-1987 Detail Specification for Electronic Components Receiving Picture Tube 31LK4B
  • QC 300301/ CN 0004-1989 Electronic Components Fixed Aluminium Electrolytic Capacitors@ Type CD291@ CD292 and CD293 Assessment Level E
  • QC 001006-1999 IECQ Quality Assessment System for Electronic Components (IECQ) Register of Participating Countries
  • QC 300301/ SU 0001-1990 Electronic Components Fixed Aluminium Electrolytic Capacitors with Non-Solid Electrolyte Type K50-53

American National Standards Institute (ANSI)

International Electrotechnical Commission (IEC)

  • QC 080000-2005 IEC quality assessment system for electronic components (IECQ) - Electrical and electronic components and products hazardous substance free standard and requirements
  • IEC 60319:1978 Presentation of reliability data on electronic components (or parts)
  • QC 001004-2006 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
  • QC 001004-2004 IEC Quality Assessment System for Electronic Components - Specifications list
  • QC 001003-1998 IEC quality assessment system for electronic components (IECQ) - Guidance documents
  • QC 001001-1986 Basic rules of the IEC quality assessment system for electronic components (IECQ)
  • QC 001004-2003 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
  • IEC 60319:1999 Presentation and specification of reliability data for electronic components
  • QC 001004-2002 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
  • QC 001001-1998 IEC quality assessment system for electronic components (IECQ) - Basic rules
  • QC 001004-1999 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
  • QC 001002-1986 Rules of procedure of the IEC quality assessment system for electronic components (IECQ)
  • IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
  • IECQ 01-2003 IEC Quality assessment system for Electronic Components (IECQ) - Basic rules
  • IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
  • IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
  • QC 001001-2002 IEC Quality Assessment System for Electronic Components (IECQ) - Basic Rules
  • QC 200000-1996 Process assessment schedules for requirements under the IEC Quality Assessment System for Electronic Components (IECQ) for approval of specialist contractor's processes and/or products within the electronic components industry
  • QC 001006-2005 IECQ Quality Assessment System for Electronic Components (IECQ-CECC) - Register of participating countries
  • IECQ-CECC 01-2003 IEC Quality Assessment System for Electronic Components (IECQ-CECC) - Basic Rules
  • QC 001006-1998 IEC quality assessment system for electronic components (IECQ) - Register of participating countries

Danish Standards Foundation

  • DS/IECQ 080000 (IECQ HSPM):2006 IEC Quality Assessment System for Electronic Components (IECQ) - Electrical and Electronic Components and Products Harzardous Substance Process Management System Requirements (HSPM)
  • DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
  • DS/EN IEC 62435-9:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 9: Special cases

European Committee for Electrotechnical Standardization(CENELEC)

  • EN 100012:1995 Basic Specification: X-Ray Inspection of Electronic Components

Lithuanian Standards Office

BE-NBN

  • NBN C 93-001-1977 Passive electronic components. Normal value set for resistors and capacitors

Indonesia Standards

  • SNI 04-6972-2003 Presentation and specification of reliability data for electronic components

German Institute for Standardization

  • DIN 45922-1:1984 Harmonized system of quality assessment for electronic components; generic specification: potentiometers
  • DIN 45910-15:1983 Harmonized system of quality assessment for electronic components; sectional specification: tantalum chip capacitors
  • DIN IEC 60319:2003 Presentation and specification of reliability data for electronic components (IEC 60319:1999)
  • DIN EN 62090:2003 Product package labels for electronic components using bar code and two-dimensional symbologies (IEC 62090:2002); German version EN 62090:2003

IEC - International Electrotechnical Commission

  • TS 62239-2008 Process management for avionics – Preparation of an electronic components management plan (Edition 2.0)

GOSTR

  • GOST R 58857-2020 Rocket and space technology. Base of electron components. General provisions

Electronic Components, Assemblies and Materials Association

  • ECA ECCB-954-2005 Electrical and Electronic Components and Products Hazardous Substance Free Standard and Requirements

ECIA - Electronic Components Industry Association

  • ECCB-954-2005 Electrical and Electronic Components and Products Hazardous Substance Free Standard and Requirements