Low temperature for electronic components

Low temperature for electronic components, Total:392 items.

The international standard classification for "Low temperature for electronic components" includes: Thermistors , Fixed resistors , Character sets and information coding , Glass in general , Other standards related to insulation , IT applications in transport and trade , Electronic components in general , Refrigerating technology .

The Chinese standard classification for "Low temperature for electronic components" includes: Technical management , Technical Management , Sensitive component and sensor , Resistor , Technical management , Pressure vessel , Computer application , Special glass , Lightning arrester , Special electronic technology material , Commerce, Trade and Contract , Electronic element in general , Refrigeration equipment .

Group Standards of the People's Republic of China

T/SZECC 002-2025 Electronic component trading specifications
T/ZEIIA 02-2020 Test method of electronic paste for electronic components
T/SLEIA 0002-2024 Test standards for low-frequency noise characteristics of electronic components
T/CIECCPA 038-2023 Low-low temperature electrostatic precipitator
T/SZECC 003-2025 Service Specifications for Electronic Components Agents

Professional Standard - Electron

SJ 2672.4-1986 Detail specification for electronic components--Case-rated 175MHz low voltag bipolar power transistors,Type 3DA304
SJ 2682-1986 Detail specification for electronic components - Low-power potentiometers for Type WH15 - K2 Assessment level E
SJ/T 11769-2020 General requirements for low-frequency noise parameters measurement method of electronic components and devices
SJ 2672.9-1986 Detail specification for electronic components--Case-rated 175MHz low voltage bipolar power transistors,Type 3DA309
SJ/T 10799-2000 Detail specification for electronic component Directly heated negative temperature coefficient thermistor for style MF53-1 Assissment level E
SJ/T 10774-2017 Detail specification for electronic components.Fixed low- power non-wirewound resistors.Type RT14 carbon film fixed resistors.Assessment level E
SJ 2673.6-1986 Detail specification for electronic components--Case-rated 470MHz low voltage bipolar transistors,Type 3DA316
SJ 2672.3-1986 Detail specification for electronic components--Case-rated 175MHz low voltage bipolar power transistors,Type 3DA303
SJ/T 11113-1996 Detail specification for electronic components, low power non-wirewound fixed resistors RJ13 type metal film fixed resistors assessment level E
SJ/T 10268-1991 Detail specification for electronic components. Semiconductor integrated circuit-CF253 type low power operational amplifier
SJ/T 10775-2013 Detail Specification for Electronic Components Low Power Non-wirewound Fixed Resistor RJ14 Type Metal Film Fixed Resistor Assessment Level E
SJ/T 10150-1991 Graphic base of electronic components graphics for resistor capacitor and inductor
SJ/T 10872-1996 Detail specification for electronic components.Fixed low-power non-wirewound resistors.Type RJ 15 metal film fixed resistors.Assessment level E
SJ/T 10798-1996 Detail specification for electronic component.Directly heated negative temperature coefficient thermistor for style MF11.Assessment level E
SJ 2673.4-1986 Detail specification for electronic components--Case-rated 470MHz low voltage bipolar power transistors,Type 3DA314
SJ 2673.5-1986 Detail specification for electronic components--Case-rated 470MHz low voltage bipolar power transistors,Type 3DA315
SJ 2672.5-1986 Detail specification for electronic components--Case-rated 175MHz low voltage bipolar power transistors,Type 3DA305
SJ/T 10798-2000 Detail specification for electronic component Directly heated negative temperature coefficient thermistor for style MF11 Assissment level E
SJ/T 10799-1996 Detail specification for electronic component.Directly heated negative temperature coefficient thermistor for style MF53-1.Assessment level E
SJ 2674-1986 Detail specification for electronic components - Fixed low-power non-wirewound resistors - Fixed metal film resistors for Type RJ16 Assessment level E
SJ 2865-1988 Detail specification for electronic components - Fixed low-power non-wirewound resistors - Coating fuse resistors for Type RF10 Assessment level E
SJ 2672.2-1986 Detail specification for electronic components--Case-rated 175Mhz low voltage bipolar power transistors,Type 3DA302
SJ 2908-1988 Detail specification for electronic components-Low-power potentiometers for Type WH202A Assessment level E
SJ/T 2421-1996 Tinned copper clad wire for electronic components
SJ/T 10617-1995 Detail specification for electronic components-Fixed low-power non-wirewound fixed resistors - Type RT13 carbon film fixed resistors Assessment level E
SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
SJ/T 10718-1996 Examples for preparation of design documents of electronic equipment
SJ 2673.2-1986 Detail specification for electronic components--Case-rated 470MHz low voltage bipolar power transistors,Type 3DA312
SJ/T 10141-1991 Terms for cryelectronics
SJ/T 10775-2000 Detail specification for electronic components Fixed low-power non-wirewound resistors Type RJ 14 metal film fixed resistors Assessment level E
SJ 2673.3-1986 Detail specification for electronic components--Case-rated 470MHz low voltage bipolar power transistors,Type 3DA313
SJ 2895-1988 Detail specification for electronic components - Low-power potentiometers for Type WH138 Assessment level E
SJ/T 10991-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CW574CS voltage regulators for electronic tuners
SJ/T 11845.2-2022 Reliability evaluation method of electronic components based on low-frequency noise parameters Part 2: Optocoupler devices
SJ/T 10872-2000 Detail specification for electronic components Fixed low-power non-wirewound resistors Type RJ 15 metal film fixed resistors Assessment level E
SJ 2672.8-1986 Detail specification for electronic components--Case-rated 175MHz low voltage bipolar power transistors,Type 3DA308
SJ 2911-1988 Detail specification for electronic components - Preset Potentiometers for Type WH159 Assessment level E
SJ 2672.1-1986 Detail specification for electronic components--Case-rated 175MHz low voltage bipolar power transistors,Type 3DA301
SJ 2675-1986 Detail specification for electronic components - Fixed low-power non-wirewound resistors - Fixed metal film resistor, Type RJ17 Assessment level E
SJ 2791-1987 Detail specification for use in electronic components--Low-power potentiometers for Type WS Assessment level E
SJ/T 10630-1995 Antistatic requirments for manufacturing electronic element and device
SJ 2673.1-1986 Detail specification for electronic components--Case-rated 470MHz low voltage bipolar power transistors,Type 3DA311
SJ/T 11113-1999 Detail specification for electronic components-Fixed low-power non-wirewound resistors-Fixed carbon film resistors for Type RJ13 Assessment level E
SJ/T 10774-2000 Detail specification for electronic components Fixed low-power non-wirewound resistors Type RT 14 carbon film fixed resistors Assessment level E
SJ 2422-1983 Tined copper wire for electronic components
SJ 2792-1987 Detail specification for use in electronic components - Low-power potentiometers for Type 20-1 Assessment level E
SJ/T 10354-1993 Detail specification for low-power potentiometers for Type WHE121 Assessment level E
SJ/T 10775-1996 Detail Specification for Electronic Components Low Power Non-wirewound Fixed Resistor RJ14 Type Metal Film Fixed Resistor Assessment Level E
SJ/T 11113-2013 Detail specification for electronic components, low power non-wirewound fixed resistors RJ13 type metal film fixed resistors assessment level E
SJ/T 10774-1996 Detail specification for electronic components.Fixed low-power non-wirewound resistors.Type RT 14 carbon film fixed resistors.Assessment level E
SJ 2866-1988 Detail specification for electronic components-Fixed low-power non-wirewound resistors-Ceramic package fuse resistors for Type RF11 Assessment level E
SJ 2672.6-1986 Detail specification for electronic components--Case-rated 175MHz low voltage bipolar power transistors,Type 3DA306
SJ/T 10225-1991 Graphic base of electronic Components-graphic of electro-mechanical components
SJ 2893-1988 Detail specification for electronic components-Low-power potentiometers for Type WH19 Assessment level E
SJ/T 10617-2017 Detail specification for electronic components.Fixed low- power non-wirewound resistors.Type RT13 carbon film fixed resistors.Assessment level E

Military Standard of the People's Republic of China-General Armament Department

GJB 360.7-1987 Test methods for electronic and electrical components Temperature shock test
GJB 360.8-1987 Test methods for electronic and electrical components High temperature life test
GJB/Z 48.1A-2011 Series programmes for military electronic components and devices Optical fibres
GJB 3404-1998 Electronic component selection and management requirements
GJB 1437-1992 Electronic component leads
GJB/Z 83-1996 Selection Guide for Aerospace Electronic Components Microwave Components
GJB 360.30-1987 Test methods for electronic and electrical components Resistance-temperature characteristics test
GJB 3014-1997 Statistical process control system for electronic components
GJB 360.13-1987 Test methods for electronic and electrical components Low frequency vibration test
GJB/Z 49.1A-2013 Military electronic components series type spectrum optical cable
GJB 546B-2011 Quality assurance program for electronic parts
GJB/Z 112-1998 Selection Guide for Aerospace Electronic Components Capacitors
GJB 360.5-1987 Test methods for electronic and electrical components Low pressure test
GJB 546-1988 Reliability Guarantee Outline for Electronic Components
GJB 8118-2013 Classification and code for military electronic component
GJB 3243A-2021 Requirements for surface mount of components and devices
GJB 2607-1996 Specification for tinned nickel wire for electronic components

Professional Standard - Machinery

JB/T 14090-2020 Flue gas cooler of low-low temperature electrostatic precipitator
JB/T 13410-2018 Low temperature economizer-Specification
JB 4727-2000 Low - alloy steel forgings for low temperature pressure vessels
JB/T 12591-2016 Low-low temperature electrostatic precipitator
JB/T 13888-2020 Lip seal used in cryogenic valve

Professional Standard - Aerospace

QJ/Z 147-1985 Detailed Rules for Enamel Tin Process of Electronic Components
QJ 1693-1989 Anti-static requirements for electronic components
QJ 1317-1987 Electronic component failure classification and code
QJ 1317A-2005 Classification and Coding for Electronic Components Failure

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 5593-2015 Structure ceramic materials used in electronic component and device
GB/T 20108-2017 Low temperature unitary air conditioner
GB/T 28858-2012 Encapsulating material of phenolic for electronic components
GB/T 2900.12-2008 Electrotechnical terminology - surge arresters low-voltage surge protective devices and components
GB/T 41742-2022 Low temperature sealing glass for optoelectric devices
GB/T 32054-2015 Electronic commerce trading product information description―Electronic components
GB/T 1772-1979 Determination of failure rate of electronic elements and components
GB/T 20108-2006 Low temperature unitary air conditioners
GB/T 5593-1996 Structure ceramic materials usec in electronic components

Professional Standard - Non-ferrous Metal

YS/T 1096-2024 Cadmium copper alloys rod and bar for electrical purpose

Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence

GJB 546A-1996 Quality Assurance Program for Electronic Components
GJB 2118-1994 Marking of military electrical and electronic components
GJB/Z 128-2000 Guideline for selection and application of spaceborne electronic parts Relays
GJB 3243-1998 Surface Mounting Requirements for Electronic Components

未注明发布机构

SAE EIASTD4899D-2025 Requirements for an Electronic Components Management Plan

Professional Standard - Aquaculture

SC/T 7002.3-2016 Fishery electronic equipment environmental test and methods- Cold
SC/T 7002.3-1991 Environmental test conditions and methods for marine electronic equipment at low temperature

Professional Standard - Agriculture

SC/T 7002.3-1992 Environmental test conditions and methods for marine electronic equipment - low temperature

Professional Standard - Chemical Industry

HG/T 2003-1991 Electronic component paint

Japanese Industrial Standards Committee (JISC)

JIS C 5027:1975 Storage (low temperature) testing method for electronic components
JIS C 5029:1975 Low air pressure testing method for electronic components
JIS C 5030:1978 Change of temperature testing procedures for electronic components
JIS C 5001:1987 General rules for electronic components
JIS C 0805:1989 Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)
JIS C 5002:1968 Environmental requirements for electronic components
JIS C 5021:1978 Cold testing procedures for electronic components
JIS C 5028:1975 Salt mist testing method for electronic components
JIS C 5022:1978 Dry heat testing procedures for electronic components
JIS C 0801:1964 Color code for electronic parts
JIS C 5036:1975 Endurance (electrical) testing method for electronic components
JIS C 5031:1975 Sealing testing methods for electronic components

Association Francaise de Normalisation

NF C93-523:1988 Electronic components. Insulated wires for high temperature.
NF C93-450:1983 Electronic components. Electrical thermostatic switches for use in electronic equipments.
NF EN 13371:2002 Cryogenic Vessels - Fittings for Cryogenic Service
UTE C93-331/AM2U*UTE C93-331/AM2:1975 COMPONENTS FOR ELECTRONIC EQUIPMENT. MAGNETIC COMPONENTS AND FERRITE MATERIALS. INDUCTOR OF LOW SELF-INDUCTANCE VALUE.
NF C93-601/AM1:1976 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. CRYSTAL HOLDERS.
UTE C83-230:1984 Electronic components - Unwound fixed resistors with low dissipation - Collection of special sheets
NF C93-265/A1:1984 Electronic components. Precision coil potentiometers
NF C86-613:1981 Harmonised system of quality assessment for electronic components. Blank detail specification : case-rated bipolar transistors for low frequency application.
NF UTE C93-265/A1:1975 ELECTRONIC COMPONENTS. PRECISION COIL POTENTIOMETERS
NF C93-265/A2:1984 Electronic components. Precision coil potentiometers
NF C83-281:1978 Harmonized system of quality assessment for electronic components. Sectional specification. L.V. varistors for telephony applications.
NF C93-217/A3:1977 Components for Electronic Equipment Low power,precision wirewound fixed resistors
NF C86-614:1981 Harmonised system fo quality assessment for electronic components. Blank detail specification : bipolar transistors for switching applications.
NF C93-171:1985 Components for electronic equipment. Trimmer capacitors.
NF C83-220/A4:1989 Electronic Components Fixed precision resistors
NF C83-240/A1:1987 Electronic Components surface mounting resistors
NF EN IEC 62435-8:2020 Electronic components - Long-term storage of semiconductor electronic devices - Part 8: passive electronic devices
NF C93-612:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. PIEZOELECTRIC FILTERS. GENERAL REQUIREMENTS.
NF C96-435-8*NF EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8 : passive electronic devices
NF C93-611:1975 Components for electronic equipment. Piezoelectric devices. Quartz crystal units for oscillators.
NF EN IEC 62435-7:2021 Electronic components - Long-term storage of semiconductor electronic devices - Part 7: microelectromechanical devices
NF C90-512:1983 Components for electronic equipment. Measurement of the dimensions of electronic components.
UTE C93-715U*UTE C93-715:1994 Electronic components. Guidelines for artwork.
NF C57-325:1996 Photovoltaic devices. Part 5 : determination of the equivalent cell temperature (ect) of photovoltaic (pv) devices by the open-circuit voltage method.
NF C96-435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7 : micro-electromechanical devices
UTE C80-804U*UTE C80-804:1995 Electronic components. Guidance document. Interpretation of "EN 29000". Reliability aspects for electronic components. (specification CECC 00 804).
NF C83-282/A1:1988 Electronic Components Surge suppression varistors
NF C93-110:1971 Components for electronic equipment. Fixed aluminium electronic capacitors. General requirements.
UTE C93-331U*UTE C93-331:1973 Components for electronic equipment. Magnetic components and ferrite materials. Inductor of low self-inductance value. Relevant article sheets.
UTE C93-415U*UTE C93-415:1985 Electronic components - Electromechanical components - Sensitive switches
NF L54-002-107*NF EN 2591-6303:2002 Aerospace series - Elements of electrical and optical connection - Test methods - Part 6303 : optical elements - Cold/low pressure and damp heat
NF UTE C96-029:2011 Electronic components - Long-term storage of electronic components - Implementation guide
FD C96-029:2023 Electronic components - Long duration storage of electronic components and subassemblies - Implementation guide
UTE C96-029U*UTE C96-029:2011 Electronic components - Long duration storage of electronic components - Guide for implementation
NF C96-001:1984 Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 1 : general.
NF C93-271:1974 Components for electronic equipment. Directly heated negative temperature coefficient thermistors.
UTE C93-523U*UTE C93-523:1988 Electronic components. Wires for high temperatures. Collection of detail specifications within the scope of the french standard NF C 93-523.
NF C93-010:1968 Components for electronic equipment. Preferred number series for resistors and capacitors.
NF EN IEC 62435-6:2018 Electronic components - Long-term storage of semiconductor electronic devices Part 6: encapsulated or finished devices
NF EN 62435-5:2017 Electronic components - Long-term storage of semiconductor electronic devices - Part 5 - chip devices and wafers
NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
NF EN 1626:2008 Cryogenic containers - Valves for cryogenic use
NF C93-012:1974 Components for electronic equipment. Preferred diameters of wire terminations of capacitors and resistors.
NF EN 62435-1:2017 Electronic components - Long-term storage of semiconductor electronic devices - Part 1: general
NF EN IEC 62435-3:2020 Electronic components - Long-term storage of semiconductor electronic devices - Part 3: data

American Society for Testing and Materials (ASTM)

ASTM F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
ASTM F542-98 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
ASTM E1250-10 Standard Test Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt-60 Irradiators Used in Radiation-Hardness Testing of Silicon Electronic Devices
ASTM E1250-15(2020) Standard Test Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt-60 Irradiators Used in Radiation-Hardness Testing of Silicon Electronic Devices
ASTM F542-02 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

PL-PKN

PN T80240-1971 Electronic components Low frequency connectors General requirements and tests
PN-EN IEC 62435-8-2021-04 E Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020)
PN T01020 ArkusZ06-1973 Electronic contact components Simple joint elements Terms and definitions
PN-EN IEC 62435-7-2021-08 E Electronic components -- Long-term storage of electronic semiconductor devices -- Part 7: Micro-electromechanical devices (IEC 62435-7:2020)
PN T80051-1986 Electronic components Fixed low-power nonwirewound resistors General requirements and test
PN T01020 ArkusZ03-1973 Electronic contact components Switching devices Terms and definitions

Korean Agency for Technology and Standards (KATS)

KS C 6020-1992 Test methods of Low air pressure for electronic components
KS C 5109-1988(2018) General rules for electronic components
KS C 5109-1988(2023) General rules for electronic components
KS C 5109-1988(2018)(英文版) General rules for electronic components
KS C 5109-1988 General Rules for Electronic Components
KS C 5109-1986 General Rules for Electronic Components
KS C 6011-1992 Test methods for CHANGE OF TEMPERATURE of electronic components
KS C 6018-1971(2017) Environmental Requirements for Electronic Components
KS C 6018-1971 Environmental Requirements for Electronic Components
KS C 6018-1982 Environmental Requirements for Electronic Components
KS C 6013-1982(2017) Testing method of endurance(electrical) for electronic component
KS C 6013-1982 Testing method of endurance(electrical) for electronic component
KS C 6009-1992 Test methods for moisture resisrance of electronic components (Temperature/Humidity Cycling)
KS B ISO 24490-2022 Cryogenic vessels－Pumps for cryogenic service
KS C 0277-1997 Background information, Section 0ne -Cold and dry heat tests
KS C 6032-1981 General test procedure of failure rate for electronic components
KS C 6012-1982 Testing method of sealing(immersion cyclic) for electronic components
KS B ISO 24490-2017(2022) Cryogenic vessels－Pumps for cryogenic service
KS C 6012-1960 Testing method of sealing(immersion cyclic) for electronic components
KS B ISO 24490-2017 Cryogenic vessels－Pumps for cryogenic service
KS P 1963-2023 Low temperature plasma sterilizer — Performance evaluation

German Institute for Standardization

DIN EN 61643-312:2014-02*VDE 0845-5-12:2014-02 Components for low-voltage surge protective devices
DIN EN 61643-351:2020-04*VDE 0845-5-51:2020-04 Components for low-voltage surge protective devices
DIN EN 61643-311:2014-02*VDE 0845-5-11:2014-02 Components for low-voltage surge protective devices
DIN EN 1626:2009 Cryogenic vessels - Valves for cryogenic service; English version of DIN EN 1626:2009-01
DIN EN 1626:1999 Cryogenic vessels - Valves for cryogenic service; German version EN 1626:1999
DIN EN 62435-5:2017-10*VDE 0884-135-5:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-7:2022-10*VDE 0884-135-7:2022-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-4:2019-05*VDE 0884-135-4:2019-05 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-6:2019-04*VDE 0884-135-6:2019-04 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-3:2022-05*VDE 0884-135-3:2022-05 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62435-2:2017-10*VDE 0884-135-2:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-9:2023-09*VDE 0884-135-9:2023-09 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62435-1:2017-10*VDE 0884-135-1:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-8:2022-11*VDE 0884-135-8:2022-11 Electronic components – Long-term storage of electronic semiconductor devices
DIN 45922-13:1979-12 Harmonized system of quality assessment for electronic components; sectional specification: low power single turn rotary potentiometers
DIN EN IEC 62435-8:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020); German version EN IEC 62435-8:2020
DIN 43762:1986 Measurement and control; electrical temperature sensors; sensor units for resistance thermometers
DIN 43735:1986 Measurement and control; electrical temperature sensors; Sensor units for thermocouple thermometers
DIN EN 12434:2000 Cryogenic vessels - Cryogenic flexible hoses; German version EN 12434:2000
DIN EN IEC 62435-7:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020); German version EN IEC 62435-7:2021

GOST

GOST R 71646-2024 Cryoelectronic and thermoelectronic cooled products. Methods of measuring noise temperature in the range 4—100 К

CZ-CSN

CSN 35 4055 Cast.12-1984 Electromechanical components for electronic equipment. Temperature rise test
CSN 35 4005 Cast.24-1985 Electromechanical components for electronic equipment. Electrical load and temperature
CSN 35 4055 Cast.13-1984 Electromechanical components for electronic equipment. Current - temperature derating test

National Aeronautics and Space Administration (NASA)

NASA-TP-1369-1979 Transient shutdown analysis of low-temperature thermal diodes

Gosstandart of Russia

GOST 25486-1982 Electronic components. Marking
GOST 24385-1980 Electronic components. The rules marking of packing
GOST 20935-1991 Cryoelectronics. Terms and definitions

British Standards Institution (BSI)

BS DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
BS EN 271:1995(2000) Electrical and Electronic Components - Soldering Technologies
BS EN 140100:1997 Harmonized system of quality assessment for electronic components - Sectional specification: fixed low power non-wire wound resistors
BS 2011-2NA:1967 The enviromental testing of electronic components and electronic equipment. Rapid change of temperature thermal shock in air
BS EN IEC 62435-6:2018 Electronic components. Long-term storage of electronic semiconductor devices - Packaged or finished devices
BS EN ISO 21028-1:2016 Cryogenic vessels. Toughness requirements for materials at cryogenic temperature. Temperatures below -80 C
BS EN 2591-209:1996 Elements of electrical and optical connection - Test methods - Current temperature derating
BS CECC 42100:1978 Harmonized system of quality assessment for electronic components: sectional specification: low voltage varistors primarily for telephony applications
BS EN IEC 62435-4:2018 Electronic components. Long-term storage of electronic semiconductor devices. Storage
BS 2011-2J:1967 The enviromental testing of electronic components and electronic equipment. Salt mist
BS 2011-2NB:1967 The enviromental testing of electronic components and electronic equipment. Gradual change of temperature one chamber method
BS EN 140400:1997 Harmonized system of quality assessment for electronic components - Sectional specification:fixed low power surface mounting (SMD) resistors
BS EN 140400:2004 Harmonized system of quality assessment for electronic components. Sectional specification. Fixed low power surface mount (SMD) resistors
BS EN 140400:2003 Harmonized system of quality assessment for electronic components - Sectional specification:Fixed low power surface mount (SMD) resistors
BS 2011-2KA:1963 The enviromental testing of electronic components and electronic equipment. Salt mist
BS EN 2591-7301:2001 Elements of electrical and optical connection. Test methods - Electrical elements. Temperature endurance of couplers
BS QC 410300:1992 Harmonized system of quality assessment for electronic components - Potentiometers for use in electronic equipment - Sectional specification for single-turn rotary low-power wirewound and non-wirewound potentiometers
BS QC 720100:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for optoelectronic devices
BS ISO 21013-4:2012 Cryogenic vessels. Pilot operated pressure-relief devices. Pressure-relief accessories for cryogenic service
BS 2011-2EA:1967 The enviromental testing of electronic components and electronic equipment. Shock
PD IEC/TR 62240-1:2018 Process management for avionics. Electronic components capability in operation. Temperature uprating
BS PD IEC/TR 62240-1:2018 Process management for avionics. Electronic components capability in operation-Temperature uprating
BS PD IEC/TR 62240-1:2013 Process management for avionics. Electronic components capability in operation-Temperature uprating
BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
BS EN IEC 62435-9:2021 Electronic components. Long-term storage of electronic semiconductor devices. Special cases
BS 2011-2EB:1967 The enviromental testing of electronic components and electronic equipment. Bump
BS 2011-2Q:1967 The enviromental testing of electronic components and electronic equipment. Sealing
BS CECC 40100:1981 Harmonized system of quality assessment for electronic components: sectional specification: fixed low power non-wirewound resistors
BS E9111:1975 Harmonized system of quality assessment for electronic components. Sectional specification for fixed low power non-wirewound resistors
BS IEC 61163-2:1998 Reliability stress screening-Electronic components
BS EN 100012:1996 Harmonized system of quality assessment for electronic components - Basic specification - X-ray inspection of electronic components
BS EN 130800:2001(2003) Harmonized system of quality assessment for electronic components assessment for electronic components — Sectional specification : Tantalum surface mounting capacitors
BS EN 12434:2000(2008) Cryogenic vessels - Cryogenic flexible hoses
BS EN 12434:2000 Cryogenic vessels - Cryogenic flexible hoses
BS 9940-01.0:1983 Harmonized system of quality assessment for electronic components - Fixed resistors for use in electronic equipment - Sectional specification: fixed low power non-wirewound resistors
BS CECC 40400:1990 Harmonized system of quality assessment for electronic components: sectional specification: fixed low power surface mounting (chip) resistors
BS EN 2591:7301:2001 Elements of electrical and optical connection - Test methods - Electrical elements - Temperature endurance of couplers

Society of Automotive Engineers (SAE)

SAE AS234-1948 THERMO-SENSITIVE ELEMENT (RESISTANCE BULB TYPE)

IECQ - IEC: Quality Assessment System for Electronic Components

QC 400101/ JP 0002-1983 Detail Specification for Electronic Components Fixed Low-Power Non-Wirewound Resistors (Carbon Film Resistors)
QC 400101/ JP 0004-1986 Detail Specification for Electronic Components Fixed Low-Power Non-Wirewound Resistors (Metal Film Resistors)
QC 400101/ CS 0001-1990 Detail Specification for Electronic Components Fixed Low-Power Non-Wirewound Resistors (Metal Film Resistors) TR296
QC 400100/ SG 0001-1991 Detail Specification for Electronic Components Fixed Low-Power Non-Wirewound Resistors (Fixed Carbon Film Resistors)
QC 400101/ JP 0001-1983 Detail Specification for Electronic Components Fixed Low-Power Non-Wirewound Resistors (High Stability Metal Film Resistors)
QC 300301/ KR 0006-1990 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0002-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0001-1984 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0004-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0003-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0005-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 400101/ JP 0003-1984 Detail Specification for Electronic Components Fixed Low-Power Non-Wirewound Resistors (Fixed Metal Oxide Film Resistors)
QC 400101/ CN 0003-1989 Detail Specification for Electronic Components Fixed Low-Power Non-Wirewound Resistors Fixed Carbon Film Resistors@ Type RT13 Assessment Level E

Defense Logistics Agency

DLA MIL-STD-1276 G VALID NOTICE 1-2010 Leads for Electronic Component Parts
DLA MIL-S-83505/7 VALID NOTICE 3-2013 Sockets (Lead Electronic Components) (Type II, Printed Circuit) Low Insertion Force (LIF)
DLA QPL-83505-29-2006 SOCKETS (LEAD, ELECTRONIC COMPONENTS), GENERAL SPECIFICATION FOR

American National Standards Institute （ANSI)

ANSI/ASTM F542:2007 Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
ANSI/TIA-455-188-1991 Low-Temperature Testing of Fiber Optics Components
ANSI/EIA/CEA 364-59A:2006 Low Temperature Test Procedure for Electrical Connectors and Sockets

TIA - Telecommunications Industry Association

TIA/EIA-455-188-1991 FOTP-188 Low Temperature Testing of Fiber Optic Components
EIA/TIA-455-188-1991 FOTP-188 Low Temperature Testing of Fiber Optic Components

International Electrotechnical Commission (IEC)

IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices

U.S. Military Regulations and Norms

ARMY MIL-E-50745 NOTICE 1-1996 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
ARMY MIL-E-50748 VALID NOTICE 2-2013 Electronic Component Assembly, 11737477 ("A" Trigger)
ARMY MIL-E-50745-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
ARMY MIL-E-50745 VALID NOTICE 2-2013 Electronic Component Assembly, 11737807 (Pre-Regulator)
ARMY MIL-E-45962-1976 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
ARMY MIL-E-45962 NOTICE 3-1997 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
ARMY MIL-E-45962 (1)-1977 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
ARMY MIL-E-50748-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737477 ("A" TRIGGER)
ARMY MIL-E-45925-1975 ELECTRONIC COMPONENTS ASSEMBLY, (11688148)
ARMY MIL-E-45925 (2)-1976 ELECTRONIC COMPONENTS ASSEMBLY, (11688148)
ARMY MIL-E-45962 REINST NOTICE 2-1996 ELECTRONIC COMPONENTS ASSEMBLY (11691622)
ARMY MIL-E-50748 NOTICE 1-1997 ELECTRONIC COMPONENT ASSEMBLY, 11737477 ("A" TRIGGER)

Military Standards (MIL-STD)

MIL MIL-E-50745-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737807 (PRE REGULATOR)
MIL MIL-E-50748-1973 ELECTRONIC COMPONENT ASSEMBLY, 11737477 (,A, TRIGGER)
MIL MIL-S-83505/7-1994 SOCKETS (LEAD ELECTRONIC COMPONENTS) (TYPE II, PRINTED CIRCUIT) LOW INSERTION FORCE (LIF)

GCC Standardization Organization

GSO IEC 62435-8:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
GSO IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
GSO ISO 24490:2016 Cryogenic vessels -- Pumps for cryogenic service

International Organization for Standardization (ISO)

ISO 21014:2019/Amd 1:2022 Cryogenic vessels — Cryogenic insulation performance — Amendment 1
ISO 23208:2017/Amd 1:2020 Cryogenic vessels — Cleanliness for cryogenic service — Amendment 1: Cryogenic vessels — Cleanliness for cryogenic service — Amendment 1
ISO 21013-4:2012 Cryogenic vessels - Pilot operated pressure relief devices - Part 4: Pressure-relief accessories for cryogenic service

CU-NC

NC 59-04-09-1984 National Electrotechnical Vocabulary. Electronic Elements and Components. Resistors
NC 59-04-08-1985 National Electrotechnical Vocabulery. Electronic Components and Calis Electromechanic Components for Electronic Eouloment. General Conceots

Danish Standards Foundation

DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
DANSK DS/EN IEC 62435-8:2020 Electronic components – Long-term storage of electronic semiconductor devices – Part 8: Passive electronic devices
DANSK DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
DS/EN 12434/AC:2001 Cryogenic vessels - Cryogenic flexible hoses
DANSK DS/EN 12434:2000 Cryogenic vessels – Cryogenic flexible hoses
DANSK DS/EN 12434/AC:2000 Cryogenic vessels – Cryogenic flexible hoses
DS/EN 12434:2000 Cryogenic vessels - Cryogenic flexible hoses
DANSK DS/EN 13371:2002 Cryogenic vessels - Couplings for cryogenic service
DANSK DS/EN 62435-5:2017 Electronic components – Long-term storage of electronic semiconductor devices – Part 5: Die and wafer devices
DANSK DS/EN IEC 62435-6:2018 Electronic components – Long-term storage of electronic semiconductor devices – Part 6: Packaged or finished devices
DS/EN IEC 62435-9:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 9: Special cases
DS/EN 13275:2000 Cryogenic vessels - Pumps for cryogenic service
DANSK DS/EN IEC 62435-3:2020 Electronic components – Long-term storage of electronic semiconductor devices – Part 3: Data

Comitato Elettrotecnico Italiano

CEI EN IEC 62435-8:2021 Electronic components - Long-term storage of electronic semiconductor devices Part 8: Passive electronic devices
CEI EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices Part 7: Micro-electromechanical devices
CEI EN IEC 62435-6:2019 Electronic components - Long-term storage of electronic semiconductor devices Part 6: Packaged or finished devices
CEI EN 50042:2011 Low voltage industrial equipment - Terminal marking for electronic components and associated external contacts
CEI EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices Part 5: Die and wafer device

European Association of Aerospace Industries

AECMA PREN 2591-FC3-1993 Aerospace Series Elements of Electrical and Optical Connection Test Methods Part FC3 - Optical Elements Cold/ Low Pressure and Damp Heat Edition P 1
AECMA PREN 2591-C3-1992 Aerospace Series Elements of Electrical and Optical Connection Test Methods Part C3 - Cold/Low Pressure and Damp Heat Issue P 1

Kingdom of Bahrain Testing and Metrology Directorate

BH GSO IEC 62435-8:2023 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
BH GSO IEC 62435-5:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
BH GSO ISO 24490:2017 Cryogenic vessels -- Pumps for cryogenic service

Spanish Association for Standardization (UNE)

UNE-EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (Endorsed by Asociación Española de Normalización in October of 2020.)
UNE-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (Endorsed by Asociación Española de Normalización in April of 2021.)
AENOR UNE-EN 13275:2001 Cryogenic containers. Pumps for cryogenic use.
UNE-EN 12434:2001 Cryogenic vessels - Cryogenic flexible hoses.
UNE-EN 9145:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
UNE-EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices (Endorsed by Asociación Española de Normalización in December of 2018.)
UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)
UNE-EN ISO 24490:2016 Cryogenic vessels - Pumps for cryogenic service (ISO 24490:2016)
UNE-EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage (Endorsed by Asociación Española de Normalización in September of 2018.)

Swedish Institute for Standards

SS-EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
SS-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
SS-EN 12434:2000 Cryogenic vessels - Cryogenic flexible hoses
SS-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
SS-EN IEC 62435-6:2019 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
SS-EN 13275:2000 Cryogenic vessels - Pumps for cryogenic service

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
EN IEC 62435-6:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General

AIA/NAS - Aerospace Industries Association of America Inc.

NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
NAS4122-2013 HEAT SINK@ ELECTRICAL-ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ EXTRUDED (REV 1)

Lithuanian Standards Office

LST EN IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020)
LST EN 12434+AC-2003 Cryogenic vessels - Cryogenic flexible hoses
LST EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020)
LST EN 13275-2002 Cryogenic vessels - Pumps for cryogenic service

Aerospace Industries Association

AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
AIA NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
AIA NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type

PH-BPS

PNS IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

YU-JUS

JUS N.R4.415-1979 Etectromechanical components for electronic equipment. Test methods. Test 5a: Temperature rise
JUS N.R4.442-1978 Electromechanical components for electromc eguipment. Test methods. Test 1 lk: Low airpressure

PT-IPQ

NP 3093/1-1985 Electronic component. Low voltage varistors for use in telephone equipment, specifications for intermediate points
NP 3130/4-1985 Electronic component. Direct heating type negative temperature thermal resistor (disc type), detailed specifications
NP 3130/5-1985 Electronic component. Direct heating type negative temperature thermistor (bar type), detailed specifications

Bureau of Indian Standards

IS 18608-2024 Cryogenic Vessels-Valves for Cryogenic Vessels

European Committee for Standardization (CEN)

EN ISO 23208:2019/A1:2020 Cryogenic vessels - Cleanliness for cryogenic service - Amendment 1 (ISO 23208:2017/Amd 1:2020)
EN 13371:2001 Cryogenic vessels - Couplings for cryogenic service
prEN ISO 24490 rev Cryogenic vessels - Pumps for cryogenic service

Aerospace Industries Association/ANSI Aerospace Standards

AIA/NAS NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
AIA/NAS NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
AIA/NAS NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC AJ-820 SECTION 4.0-1997 Electronic Circuit Components

Standards Norway

NS-EN 12434:2000 Cryogenic vessels — Cryogenic flexible hoses

BE-NBN

NBN C 93-001-1977 Passive electronic components. Normal value set for resistors and capacitors

The Directorate General of Specifications and Metrology (DGSM)

OS GSO IEC/PAS 62435:2014 Electronic components - Long-duration storage of electronic components - Guidance for implementation
OS GSO ISO 24490:2016 Cryogenic vessels -- Pumps for cryogenic service