Electronic components

Electronic components, Total:199 items.

The international standard classification for "Electronic components" includes: Semiconductor devices , Character sets and information coding , Aerospace electric equipment and systems , Electronic components in general , IT applications in transport and trade , Plug-and-socket devices. Connectors , Aircraft and space vehicles in general .

The Chinese standard classification for "Electronic components" includes: Semiconductor discrete devices in general , Computer application , Electronic components , Technical Management , Special electronic technology material , Electronic element in general , Commerce, Trade and Contract , Connector , Other production equipment , Connecting piece for installation and wiring , Basic standards and general methods , Aircraft and its accessories in general , Technology and technological equipment .

Military Standard of the People's Republic of China-General Armament Department

GJB 9397-2018 Test method for neutron radiation effects of military electronic components
GJB 8897-2017 Failure analysis requirements and methods for military electronic components
GJB 8118-2013 Classification and code for military electronic component
GJB 2607-1996 Specification for tinned nickel wire for electronic components
GJB 4027B-2021 Destructive physical analysis method of military electronic components
GJB 1218-1991 General specification for sockets and accessories for plug-in electronic components
GJB/Z 48.1A-2011 Series programmes for military electronic components and devices Optical fibres
GJB 2445-1995 General specification for lead terminal sockets of electronic components
GJB/Z 112-1998 Selection Guide for Aerospace Electronic Components Capacitors
GJB 546B-2011 Quality assurance program for electronic parts
GJB/Z 49.1A-2013 Military electronic components series type spectrum optical cable
GJB 3404-1998 Electronic component selection and management requirements
GJB 3243A-2021 Requirements for surface mount of components and devices
GJB 3014-1997 Statistical process control system for electronic components
GJB 7243-2011 Screening technical requirement for military electronic components
GJB 546-1988 Reliability Guarantee Outline for Electronic Components
GJB/Z 55-1994 Selection Guide for Aerospace Electronic Components Semiconductor Discrete Devices
GJB 1437-1992 Electronic component leads
GJB 4027-2000 Destructive physical analysis method of military electronic components
GJB 6777-2009 Testing method of single event effects in Cf radiation source for military electronic devices
GJB/Z 83-1996 Selection Guide for Aerospace Electronic Components Microwave Components
GJB 4027A-2006 Methods of destructive physical analysis for military electronic components

Group Standards of the People's Republic of China

T/CPSS 1013-2021 Technology specification for derating of electronic components of switching power supply
T/SLEIA 0002-2024 Test standards for low-frequency noise characteristics of electronic components
T/ZEIIA 02-2020 Test method of electronic paste for electronic components
T/SDWL 0004-2024 Technical requirements for circulating packaging of electrostatic sensitive devices
T/CIE 116-2021 Fault tree analysis method and procedure of electronic components
T/ZPP 042-2023 Overall technical conditions of electronic component reliability test equipment

Professional Standard - Aerospace

QJ 3152-2002 Management Requirements for New Electronic Components of Aerospace Application
QJ 2671-1994 Quality Management Requirements for Imported Electronic Devices
QJ 2145-1991 Regulations on Quality and Reliability Management of Electronic Components
QJ 1317-1987 Electronic component failure classification and code
QJ 1317A-2005 Classification and Coding for Electronic Components Failure
QJ 3267-2006 Technical requirements for tinning process of electronic components
QJ 1693-1989 Anti-static requirements for electronic components
QJ/Z 147-1985 Detailed Rules for Enamel Tin Process of Electronic Components

Professional Standard - Electron

SJ 20036-1992 Specification for Barium sodium polassium glass for military electronic devices and components
SJ/T 10150-1991 Graphic base of electronic components graphics for resistor capacitor and inductor
SJ/T 10221-1991 Guide for manufacture quality control of generic electronic components
SJ 20715-1998 Specification for Copper-beryllium alloy plate and strip for use in electronic components
SJ/T 11084-1996 Detailed specifications for electronic components - FU-100F electronic tubes (Applicable for certification)
SJ/T 2421-1996 Tinned copper clad wire for electronic components
SJ/T 11125-1997 Encapsulation materials of epoxy series for use in electronic components
SJ/T 10630-1995 Antistatic requirments for manufacturing electronic element and device
SJ 20716-1998 Specification for Copper-beryllium alloy wire and bor for use in electronic components
SJ/T 11083-1996 Detailed specifications for electronic components - FU-250F electronic tubes (Applicable for certification)
SJ/T 11091-1996 General specification for lead-tinned for electronic components
SJ/T 11078-1996 Detail specification for electronic components - Electronic tube of type FC-306 (Applicable for certification)
SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
SJ/T 10718-1996 Examples for preparation of design documents of electronic equipment
SJ/T 10611-1994 Detail specification of electronic components Type CD17 fixed aluminium electrolyte capacitors
SJ 3181-1989 Graphic base of electronic elements - IC Graphic
SJ 2422-1983 Tined copper wire for electronic components
SJ/T 10225-1991 Graphic base of electronic Components-graphic of electro-mechanical components
SJ/T 11124-1997 Encapsulation materials of expoy series powder for use in electronic components
SJ/T 10035-1991 Detail specification for electronic components Electronic tube of type FC-620F (Applicable for certification)

Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence

GJB 546A-1996 Quality Assurance Program for Electronic Components
GJB 2118-1994 Marking of military electrical and electronic components
GJB/Z 128-2000 Guideline for selection and application of spaceborne electronic parts Relays
GJB 3243-1998 Surface Mounting Requirements for Electronic Components

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 28858-2012 Encapsulating material of phenolic for electronic components
GB/T 5593-1996 Structure ceramic materials usec in electronic components
GB/T 28859-2012 Encapsulating material of powdered epoxy for electronic components
GB/T 15176-1994 Generic specification for sockets and accessoies for electronic plug-in devices
GB/T 13947-1992 specification for electronic components plastic packaging equipments
GB/T 32054-2015 Electronic commerce trading product information description―Electronic components
GB 9539-1988 Detail specification for flat cable connectors,Type DC2
GB/T 11279-1989 Guide to the application of environmental tests to electronic components
GB/T 1772-1979 Determination of failure rate of electronic elements and components
GB/Z 31478-2015 Process management for avionics―Preparation of an electronic components management plan
GB/T 5593-2015 Structure ceramic materials used in electronic component and device

工业和信息化部

HG/T 6101-2022 Top and bottom adhesive tapes for electronic components packaging
JB/T 6175-2020 The lead forming process specifcation for the electronic componcnts

Professional Standard - Military and Civilian Products

WJ 2652-2005 Technical requirement for screening of electronic elements for fuses

Shaanxi Provincial Standard of the People's Republic of China

DB6101/T 3138-2022 Electronic component testing and screening service regulations

Professional Standard - Aviation

HB 7262.1-1995 Aviation Product Electric Fitting Process - Installation of Electronic Devices
HB 7262.2-1995 Aviation Product Electric Fitting Process - Welding of Electronic Devices
HB 8424-2014 Leak test method for sealing of aviation components

Professional Standard - Machinery

JB/T 6175-1992 Process Specification for Forming of Instrumentation Electronic Component Lead Wire

RU-GOST R

GOST 25486-1982 Electronic components. Marking
GOST 24385-1980 Electronic components. The rules marking of packing

Korean Agency for Technology and Standards (KATS)

KS C 5109-1986 General Rules for Electronic Components
KS C 5109-1988(2018) General rules for electronic components
KS C 5109-1988 General Rules for Electronic Components
KS C 6018-1971 Environmental Requirements for Electronic Components
KS C 6018-1982 Environmental Requirements for Electronic Components
KS C 6018-1971(2017) Environmental Requirements for Electronic Components
KS C 6013-1982 Testing method of endurance(electrical) for electronic component
KS C 6012-1960 Testing method of sealing(immersion cyclic) for electronic components
KS C 6032-1981 General test procedure of failure rate for electronic components
KS C 6012-1982 Testing method of sealing(immersion cyclic) for electronic components
KS C 6021-1977 Endurance(mechanical) testing method for electronic components
KS C 6021-1982 Endurance(mechanical) testing method for electronic components
KS C 6430-2004 General rules for reliability assured electronic components
KS C 6012-1982(2017) Testing method of sealing(immersion cyclic) for electronic components

KR-KS

KS C 5109-1988(2023) General rules for electronic components
KS C 5109-1988(2018)(英文版) General rules for electronic components

CU-NC

NC 59-04-09-1984 National Electrotechnical Vocabulary. Electronic Elements and Components. Resistors

Japanese Industrial Standards Committee (JISC)

JIS C 5001:1987 General rules for electronic components
JIS C 5002:1968 Environmental requirements for electronic components
JIS C 5022:1978 Dry heat testing procedures for electronic components
JIS C 5028:1975 Salt mist testing method for electronic components
JIS C 5021:1978 Cold testing procedures for electronic components
JIS C 5029:1975 Low air pressure testing method for electronic components
JIS C 5030:1978 Change of temperature testing procedures for electronic components
JIS C 5031:1975 Sealing testing methods for electronic components
JIS C 5024:1978 Damp heat (cyclic) testing procedures for electronic components
JIS C 0805:1989 Packaging of electronic components on continuous tapes (components with axial type and radial wire lead terminals)
JIS C 5027:1975 Storage (low temperature) testing method for electronic components
JIS C 5023:1978 Damp heat (steady state) testing procedures for electronic componets
JIS C 5036:1975 Endurance (electrical) testing method for electronic components
JIS C 5037:1975 Endurance (mechanical) testing method for electronic components
JIS C 5003:1974 General test procedure of failure rate for electronic components

Defense Logistics Agency

DLA MIL-STD-1276 G VALID NOTICE 1-2010 Leads for Electronic Component Parts
DLA QPL-83505-29-2006 SOCKETS (LEAD, ELECTRONIC COMPONENTS), GENERAL SPECIFICATION FOR
DLA DSCC-DWG-88041 REV A-2002 SOCKET, ADAPTER, FOR DISCRETE ELECTRONIC COMPONENTS, GENERAL DRAWING FOR
DLA DESC-DWG-85136 REV D-1993 HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY

Association Francaise de Normalisation

NF C93-601/AM1:1976 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. CRYSTAL HOLDERS.
UTE C93-680U*UTE C93-680:1989 Electronic components. Signal organs. Indicator lights. Detail specifications.
NF C93-265/A1:1984 Composants électroniques. Potentiomètres bobines de précision.
NF UTE C93-265/A1:1975 ELECTRONIC COMPONENTS. PRECISION COIL POTENTIOMETERS
NF C93-265/A2:1984 Electronic components. Precision coil potentiometers
UTE C93-715U*UTE C93-715:1994 Electronic components. Guidelines for artwork.
NF C93-612:1979 COMPONENTS FOR ELECTRONIC EQUIPMENT. PIEZOELECTRIC DEVICES. PIEZOELECTRIC FILTERS. GENERAL REQUIREMENTS.
UTE C93-002U*UTE C93-002:1966 Electronic components. General. Inspection by attributes.
UTE C93-751U*UTE C93-751:1985 Electronic components. Base materials for printed circuits. Detail specifications.
UTE C93-723U*UTE C93-723:1979 Electronic components. Printed wiring. Rework of printed boards.
UTE C93-717U*UTE C93-717:1994 Electronic components. Characteristics and control of thermal drains.
UTE C93-591U*UTE C93-591:1994 Electronic components. Semi-flexible waveguides with flanges.
UTE C93-719U*UTE C93-719:1994 Electronic components. Specification for interconnection multiwire printed boards.
UTE C93-551U*UTE C93-551:1977 Electronic components. Semi rigid coaxial cables. Detail requirements.
UTE C93-552U*UTE C93-552:1995 Electronic components. Coaxial cables for installation of transmission equipments.
NF C93-010:1968 Components for electronic equipment. Preferred number series for resistors and capacitors.
UTE C93-703U*UTE C93-703:1989 Electronic components. Guide for the design and use of printed boards.

BE-NBN

NBN C 93-001-1977 Passive electronic components. Normal value set for resistors and capacitors
NBN C 93-002-1977 Marking codes and tolerances for values of passive electronic components, resistors and capacitors
NBN C 93-002-1973 Passive electronic components. Marking rules and tolerances for resistor and capacitor values

British Standards Institution (BSI)

DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
BS CECC 00804:1996 Harmonized system of quality assessment for electronic components - Interpretation of 'EN ISO 9000:1994': Reliability aspects for electronic components
BS EN IEC 62435-6:2018 Electronic components. Long-term storage of electronic semiconductor devices - Packaged or finished devices
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data

SCC

BS DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
BS IEC 61163-2:1998 Reliability stress screening-Electronic components
BS 2011-2J:1967 The enviromental testing of electronic components and electronic equipment. Salt mist
BS 2011-2KA:1963 The enviromental testing of electronic components and electronic equipment. Salt mist
BS 2011-2Q:1967 The enviromental testing of electronic components and electronic equipment. Sealing
BS 2011-2EA:1967 The enviromental testing of electronic components and electronic equipment. Shock
BS 2011-2EB:1967 The enviromental testing of electronic components and electronic equipment. Bump
BS 2011-2QG:1967 The enviromental testing of electronic components and electronic equipment. Sealing, driving rain

Electronic Components, Assemblies and Materials Association

ECA ECCB-954-2005 Electrical and Electronic Components and Products Hazardous Substance Free Standard and Requirements

ECIA - Electronic Components Industry Association

ECCB-954-2005 Electrical and Electronic Components and Products Hazardous Substance Free Standard and Requirements

Government Electronic & Information Technology Association

GEIA-STD-4899A-2007 Standard for Preparing an Electronic Components Management Plan
GEIA 601-A-1998 General Procedure for Capability Approval of Electronic Components

Society of Automotive Engineers (SAE)

SAE EIA-601A-2015 General Procedure for Capability Approval of Electronic Components

Institute of Electrical and Electronics Engineers (IEEE)

IEEE 1499-1998 Interface for hardware description models of electronic components
IEEE Std 1499-1998 IEEE Standard Interface for Hardware Description Models of Electronic Components

IECQ - IEC: Quality Assessment System for Electronic Components

QC 300301/ KR 0006-1990 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0003-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0002-1985 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0001-1984 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0004-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
QC 300301/ KR 0005-1987 Electronic Components Aluminium Electrolytic Capacitors with Non-Solid Electrolyte
PQC 39/SU 0009-1990 Detail Specification for Electronic Components Generator Tube GU-88A
PQC 39/SU 0007-1990 Detail Specification for Electronic Components Receiving Picture Tube I6LK8B
PQC 39/SU 0002-1987 Detail Specification for Electronic Components Receiving Picture Tube 31LK4B

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC TM-650 2.6.22-1995 Acoustic Microscopy for Plastic Encapsulated Electronic Components

International Electrotechnical Commission (IEC)

QC 080000-2005 IEC quality assessment system for electronic components (IECQ) - Electrical and electronic components and products hazardous substance free standard and requirements
IEC 60319:1978 Presentation of reliability data on electronic components (or parts)
QC 001004-2006 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
QC 001004-2004 IEC Quality Assessment System for Electronic Components - Specifications list
IEC 62435-8:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices
QC 001003-1998 IEC quality assessment system for electronic components (IECQ) - Guidance documents
QC 001001-1986 Basic rules of the IEC quality assessment system for electronic components (IECQ)
QC 001004-2003 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
IEC 60319:1999 Presentation and specification of reliability data for electronic components
QC 001004-2002 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
QC 001002-1986 Rules of procedure of the IEC quality assessment system for electronic components (IECQ)
QC 001001-1998 IEC quality assessment system for electronic components (IECQ) - Basic rules
QC 001004-1999 IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list
IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components

American National Standards Institute （ANSI)

ANSI/EIA 4899:2002 Standard for Preparing an Electronic Components Management Plan

PT-IPQ

NP 3092/1-1985 Electronic component. Varistor type. General specifications

Danish Standards Foundation

DS/IECQ 080000 (IECQ HSPM):2006 IEC Quality Assessment System for Electronic Components (IECQ) - Electrical and Electronic Components and Products Harzardous Substance Process Management System Requirements (HSPM)
DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices

RO-ASRO

STAS 10003-1975 PASSIVE ELECTRON COMPONENTS Method of mcasumnent of nun linearily of resistors

European Committee for Electrotechnical Standardization（CENELEC）

EN 100012:1995 Basic Specification: X-Ray Inspection of Electronic Components

Lithuanian Standards Office

LST EN 100012-2001 Basic specification: X-ray inspection of electronic components

AIA/NAS - Aerospace Industries Association of America Inc.

NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type

Aerospace Industries Association

AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded

Indonesia Standards

SNI 04-6972-2003 Presentation and specification of reliability data for electronic components

PL-PKN

PN T80240-1971 Electronic components Connec?ors tor Iow trequencies General requirement$ and tes?ing
PN T01020 ArkusZ06-1973 Electronic contact components Simple joint elements Terms and definitions