Indirect Semiconductor Computing

Indirect Semiconductor Computing, Total:229 items.

The international standard classification for "Indirect Semiconductor Computing" includes: Plug-and-socket devices. Connectors , Rectifiers. Convertors. Stabilized power supply , Integrated circuits. Microelectronics , Aircraft and space vehicles in general , Amplifiers , Testing of metals , Geology. Meteorology. Hydrology .

The Chinese standard classification for "Indirect Semiconductor Computing" includes: Thermal Measurement , Connector , Power semiconductor device and parts , Semiconductor integrated circuit , Ambient conditions , Dedicated processing equipment , Metal physical property test method , Meteorology , Technical management , Computer application .

未注明发布机构

SEMI S22-1110b-2011 SAFETY GUIDELINE FOR THE ELECTRICAL DESIGN OF SEMICONDUCTOR MANUFACTURING EQUIPMENT
SEMI E35-0307-2006 GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

National Metrological Verification Regulations of the People's Republic of China

JJG 363-1984 Semiconductor Themistor Themometer

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 3436-1996 Semiconductor integrated circuits Series and products of operational amplifier
GB/T 15872-2013 Power supply interface for semiconductor equipment
GB/T 6616-2023 Test method for resistivity of semiconductor wafers and sheet resistance of semiconductor films—Noncontact eddy-current gauge
GB/T 15873-1995 Directives for drafting semiconductor facilities interface specification
GB/T 14026-1992 Series and products of microcomputers for semiconductor integrated circuits-Products of 80C86 family
GB/T 15872-1995 Power supply interface for semiconductor equipment
GB/T 3859.4-2004 Semiconductor converter - Self-commutated semiconductor converters including direct d.c.converters
GB/T 44181-2024 Space environment—Method of single event upset rates prediction of semiconductor devices for space applications
GB/T 7677-1987 Semiconductor direct d. c. convertors

Professional Standard - Aerospace

QJ 1639-1989 Engineering Calculation Method for Aerodynamic Heating of Solid Missile
QJ 2212-1991 Semiconductor Integrated Circuit Design Guidelines
QJ 2491-1993 Test methods for operational amplifiers in semiconductor integrated circuits
QJ 1108-1987 Standard Ballistic Calculation of Solid Ballistic Missile

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 37525-2019 Calculation guideline for solar direct radiation

Military Standard of the People's Republic of China-General Armament Department

GJB/Z 42.3-1993 Military microcircuit series type spectrum semiconductor integrated circuit microcomputer and memory integrated circuit
GJB 597/5-1990 Detailed specifications for semiconductor integrated circuit operational amplifiers
GJB 597/5A-1997 Detailed specifications for semiconductor integrated circuit operational amplifiers
GJB 9147-2017 Semiconductor integrated circuit operational amplifier test methods

机械电子工业部

JB 5843-1991 Connectors for power semiconductor devices

Professional Standard - Machinery

JB/T 5843-1991 Connectors for Power Semiconductor Devices
JB/T 5843-2005 Connectors for power semiconductor devices

Group Standards of the People's Republic of China

T/CECA 95-2023 1.27mm pitch Small Computer System Interface Connector
T/ZAQ 10113-2022 Intermittent working life test equipment for semiconductor devices
T/CSTM 00825-2023 Guide for finite element calculation of welding residual stress
T/ZZB Q063-2022 Intermittent working life test equipment for semiconductor devices
T/QGCML 3970-2024 Semiconductor workshop metal dust intelligent detection and analysis system

Professional Standard - Electron

SJ 2433-1984 Bonding sheet for semiconductor tubes
SJ/T 11487-2015 Non-contact measurement method for the resistivity of semi-insulating semiconductor wafer
SJ 20301-1993 Detail specification for Type JF158 and JF158A dual operational amplifiers of semiconductor integrated circuits
SJ/T 10607-1994 Gate array design generals for semiconductor integrated circuits

Professional Standard - Aviation

HB/Z 148-1989 Calculation of space angle for computer aided clamp

Henan Provincial Standard of the People's Republic of China

DB41/T 1056-2015 Copper clad aluminum conductor plastic insulated computer cable

Shaanxi Provincial Standard of the People's Republic of China

DB61/T 1448-2021 Intermittent life test procedures for high-power semiconductor discrete devices

BELST

STB 2365-2014 Cooling radiators of semiconductor devices. Methods of calculation

GSO

BH GSO ISO 18257:2022 Space systems — Semiconductor integrated circuits for space applications — Design requirements
GSO ISO 18257:2021 Space systems — Semiconductor integrated circuits for space applications — Design requirements
OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
GSO IEC 62779-2:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
BH GSO IEC 62779-1:2022 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
OS GSO IEC 62526:2014 Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
BH GSO IEC 62526:2016 Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
OS GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
GSO IEC 62969-1:2022 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
BH GSO IEC 62969-1:2023 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
GSO IEC 62779-3:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
GSO 1517:2002 Overhead electrical conductors - Calculation methods for stranded bare conductors
GSO IEC 62526:2014 Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
BH GSO IEC 60146-2:2016 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
OS GSO IEC 60146-2:2014 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
GSO IEC 60146-2:2014 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
OS GSO 907:1997 Guide to the calculation of resistance of plain and coated copper conductors of low-frequency cables and wires
OS GSO IEC 62374-1:2013 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
GSO IEC 60191-6-17:2013 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land...
OS GSO IEC 60191-6-17:2013 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land...

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD74A-2007 Early Life Failure Rate Calculation Procedure for Semiconductor Components
JEDEC JESD30D-2006 Descriptive Designation System for Semiconductor-device Packages
JEDEC EIA-318-B-1996 Measurement of Reverse Recovery Time for Semiconductor Signal Diodes [Replaced: JEDEC 318-1]

IEEE - The Institute of Electrical and Electronics Engineers@ Inc.

IEEE 662-1992 Standard Terminology for Semiconductor Memory (IEEE Computer Society Document)
IEEE 1788.1-2017 Standard for Interval Arithmetic (Simplified) (IEEE Computer Society)
IEEE 1788-2015 Interval Arithmetic (IEEE Computer Society)
IEEE 256-1963 SEMICONDUCTOR DIODES

British Standards Institution (BSI)

BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
13/30264596 DC BS EN 60747-14-7. Semiconductor devices. Part 14-7. Semiconductor sensor. Flow meter
BS EN IEC 62969-4:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. Evaluation method of data interface for automotive vehicle sensors
BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
23/30478757 DC BS EN IEC 63287-3. Semiconductor devices. Generic semiconductor qualification guidelines - Part 3. Guidelines for reliability qualification plans for power semiconductor module
BS PD IEC TR 61597:2021 Overhead electrical conductors. Calculation methods for stranded bare conductors
BS EN 60191-6-22:2013 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch
BS IEC 62526:2007(2010) Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
PD IEC TR 61597:2021 Overhead electrical conductors. Calculation methods for stranded bare conductors
BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS EN 60191-6-5:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)
BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS IEC 62526:2007 Standard for extensions to standard test interface language (STIL) for semiconductor design environments
BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
BS EN 60191-6-12:2011 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
BS EN 62374-1:2010 Semiconductor devices. Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices

SCC

12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
CEI EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performances
CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
05/30137514 DC IEC 60747-14-4. Discrete semiconductor devices. Part 14-4. Semiconductor accelerometers
CEI 3-17:2005 Segni grafici per schemi - Semiconduttori e tubi elettronici
DIN EN 60191-6-22 E:2011 Draft Document - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball G...
CEI EN 60191-6-22:2014 Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic...
DIN IEC 60747-14-4 E:2002 Draft Document - Discrete semiconductor devices - Part 14-4: Semiconductor accelerometers (IEC 47E/220/CD:2002)
DANSK DS/EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
11/30248240 DC BS EN 60191-6-22. Mechanical standardization of semiconductor devices. Part 6-22. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages. Silicon Fine-pitch Ball G...
CEI EN IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for automotive vehicles Part 4: Evaluation method of data interface for automative vehivle sensors
DANSK DS/EN IEC 62969-1:2018 Semiconductor devices – Semiconductor interface for automotive vehicles – Part 1: General requirements of power interface for automotive vehicle sensors
CEI EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles Part 1: General requirements of power interface for automotive vehicle sensors
DANSK DS/EN IEC 62969-4:2018 Semiconductor devices – Semiconductor interface for automotive vehicles – Part 4: Evaluation method of data interface for automotive vehicle sensors
AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
AS 1955.3:1983 Semiconductor Convertors, Part 3: Semiconductor Direct D.C. Convertors (D.C. Chopper Convertors)
CEI EN 62779-3:2017 Semiconductor devices - Semiconductor interface for human body communication Part 3: Functional type and its operational conditions
UNE 20846-3:1994 SEMICONDUCTOR CONVERTORS. PART 3: SEMICONDUCTOR DIRECT D.C. CONVERTORS (D.C. CHOPPER-CONVERTORS).
DIN EN 62779-2 E:2013 Draft Document - Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (IEC 47/2153/CD:2012)
BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
CEI EN 60146-2:2001 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
DANSK DS/EN 62779-3:2016 Semiconductor devices – Semiconductor interface for human body communication – Part 3: Functional type and its operational conditions
DANSK DS/EN 60146-2:2000 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
DIN EN 62779-1 E:2013 Draft Document - Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (IEC 47/2152/CD:2012)
IEC 60344:1971 Guide to the calculation of resistance of plain and coated copper conductors of low-frequency cables and wires
DIN EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (IEC 62969-1:2017); German version EN IEC 62969-1:2018
UNE 20846-5:1994 SEMICONDUCTOR CONVERTORS. SWITCHES FOR UNINTERRUPTIBLE POWER SYSTEMS (UPS SWITCHES).
DIN EN IEC 62969-4:2019 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors (IEC 62969-4:2018); German version EN IEC 62969-4:2018
BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
BS PD ISO/TR 13086-3:2018 Gas cylinders. Guidance for design of composite cylinders-Calculation of stress ratios
DANSK DS/EN 62374-1/AC:2011 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
CEI EN 62374-1:2012 Semiconductor devices Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
IEC 60146:1973 Semiconductor convertors
CEI EN 60191-6-17:2012 Mechanical standardization of semiconductor devices Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land g...
DANSK DS/EN 62374-1:2011 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
CEI EN 60191-6-5:2002 Mechanical standardization of semiconductor devices Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Danish Standards Foundation

DS/IEC TR 61597:2021 Overhead electrical conductors – Calculation methods for stranded bare conductors
DS/EN 60146-2:2000 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
DS/EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land gr
DS/EN 60191-6-5:2002 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Institute of Electrical and Electronics Engineers (IEEE)

IEEE 1687-2014 Access and Control of Instrumentation Embedded within a Semiconductor Device (IEEE Computer Society)

International Electrotechnical Commission (IEC)

IEC TR 61597:2021 Overhead electrical conductors - Calculation methods for stranded bare conductors
IEC TR 61597:1995 Overhead electrical conductors - Calculation methods for stranded bare conductors
IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
IEC 61523-2:2002 Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries
IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
IEC 62526:2007 Standard for extensions to Standard Test Interface Language (STIL) for semiconductor design environments
IEC 60191-6-22:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 60146-2:1999 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters

KR-KS

KS C IEC TR 61597-2023 Overhead electrical conductors Calculation methods for stranded bare conductors

European Committee for Electrotechnical Standardization（CENELEC）

EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
EN IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)

CZ-CSN

CSN 34 5910-1986 Gold bonding wire for semiconductor devices
CSN 35 8736-1964 Semiconductor diodes. Measurement of interelectrode capacitanoe
CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
CSN 35 8759-1977 Semiconductor devices. Transistors. Methods of measurement of switching times
CSN 34 0415-1973 Screwless terminals for connecting copper of eonductors
CSN 35 8701 Z1-1997 Semiconductor naming

IEC - International Electrotechnical Commission

IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices (Edition 1.0)
IEC 62779-2:2016 Dispositifs à semiconducteurs – Interface à semiconducteurs pour les communications via le corps humain – Partie 2: Caractérisation des performances d'interfa?age (Edition 1.0)
IEC 62779-1:2016 Dispositifs à semiconducteurs – Interface à semiconducteurs pour les communications via le corps humain – Partie 1: Exigences générales (Edition 1.0)
IEC 62969-4:2018 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les véhicules automobiles - Partie 4: Méthode d’évaluation de l’interface de données destinée aux capteurs de véhicules automobiles (Edition 1.0)

ES-UNE

UNE-EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
UNE-EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
UNE-EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in March of 2018.)
UNE-EN IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in October of 2018.)
UNE-EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)
UNE-EN 60146-2:2000 Semiconductor converters -- Part 2: Self-commutated semiconductor converters including direct d.c. converters (Endorsed by AENOR in December of 2001.)
UNE-EN 62374-1:2010 Semiconductor devices -- Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (Endorsed by AENOR in March of 2011.)

Association Francaise de Normalisation

NF C96-779-2*NF EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2 : characterization of interfacing performances
NF EN 62779-2:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 2 : caractérisation des performances d'interfaçage
NF C82-100-2*NF EN 61523-2:2003 Delay and power calculation standards - Part 2 : pre-layout delay calculation specification for CMOS ASIC libraries
NF EN 62779-1:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 1 : exigences générales
NF C96-779-3*NF EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3 : functional type and its operational conditions
NF C96-069-4*NF EN IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4 : evaluation method of data interface for automotive vehicle sensors
NF C53-228:1989 Semiconductor convertors. Switches for uninterruptible power systems (vps switches).
NF C96-069-1*NF EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1 : general requirements of power interface for automotive vehicle sensors
NF EN IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for motor vehicles - Part 4: Method for evaluating the data interface for motor vehicle sensors
NF C96-013-6-22*NF EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic
NF EN IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Harvesting piezoelectric shock energy for automotive sensors
NF EN IEC 62969-1:2018 Semiconductor devices - Semiconductor interface for motor vehicles - Part 1: general requirements of power interface for motor vehicle sensors
NF EN 62779-3:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 3 : type fonctionnel et ses conditions d'utilisation

Korean Agency for Technology and Standards (KATS)

KS C IEC 62526-2015(2020) Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
KS C IEC 62526-2020 Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
KS C IEC 62526:2015 Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
KS C IEC 60971-2003(2008) Semiconductor convertors－Identification code for convertor connections
KS C IEC 60971-2013 Semiconductor convertors－Identification code for convertor connections

AGMA - American Gear Manufacturers Association

929-A06-2006 Calculation of Bevel Gear Top Land and Guidance on Cutter Edge Radius

Defense Logistics Agency

DLA SMD-5962-84065 REV E-2005 MICROCIRCUIT, DIGITAL, CMOS, PROGRAMMABLE INTERVAL TIMER, MONOLITHIC SILICON
DLA SMD-5962-90512-1992 MICROCIRCUIT, DIGITAL, HMOS, 8-BIT MICROCOMPUTER, MONOLITHIC SILICON
DLA MIL-S-19500/425 VALID NOTICE 2-2004 SEMICONDUCTOR DEVICE, TRANSISTOR, PN, SILICON, UNIJUNCTION JAN2N5431, AND JANTX2N5431

Standard Association of Australia （SAA）

AS 60146.2:2001/Amdt 1:2001 Semiconductor converters Self-commutated semiconductor converters include direct-to-dc converters
AS 60146.2:2001(R2013) Semiconductor converters Self-commutated semiconductor converters include direct-to-dc converters
AS 60146.2:2001 Semiconductor converters - Self-commutated semiconductor converters including direct d.c. converters

Lithuanian Standards Office

LST EN 60191-6-22-2013 Mechanical standardization of semiconductor devices -- Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic
LST EN 60191-6-17-2011 Mechanical standardization of semiconductor devices -- Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land g

RU-GOST R

GOST 18986.5-1973 Semiconductor diodes. Method for measuring transition time
GOST 8.464-1982 State system for ensuring the uniformity of measurements. Gas mass flow rate. Calculated relations of indirect methods of measurements
GOST 18986.8-1973 Semiconductor diodes. Method for measuring reverse recovery time
GOST 23900-1987 Power semiconductor devices. Overall and mounting dimensions

German Institute for Standardization

DIN EN 60191-6-22:2013-08 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
DIN EN 61523-2:2003 Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries (IEC 61523-2:2002); German version EN 61523-2:2002, text in English
DIN EN 62374-1:2011-06 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011
DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe

American Welding Society (AWS)

WRC 357:1990 Calculation of Electrical and Thermal Conductivities of Metallurgical Plasmas

SE-SIS

SIS SS IEC 344:1987 Telecommunication cables - Calculation of resistance of copper conductors

IPC - Association Connecting Electronics Industries

IPC/EIA J-STD-026 CD-1999 Semiconductor Design Standard for Flip Chip Applications
IPC/EIA J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications

WRC - Welding Research Council

BULLETIN 357-1990 CALCULATION OF ELECTRICAL AND THERMAL CONDUCTIVITIES OF METALLURGICAL PLASMAS

NEMA - National Electrical Manufacturers Association

NEMA CB-4:1989 Semiconductor Graphite

JP-JEITA

JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)

National Fire Protection Association (NFPA)

NFPA FPH SECTION 6-30-2003 Semiconductor Manufacturing

Society of Automotive Engineers (SAE)

SAE AS6294/3-2019 Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications

YU-JUS

JUS N.R1.322-1979 Terms and definitions for semiconductor ?evices. Thyristors

VDE - VDE Verlag GmbH@ Berlin@ Germany

VDE 0884-79-3-2017 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 62779-3:2016); German version EN 62779-3:2016

American Society for Testing and Materials (ASTM)

ASTM F487-88(2001) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
ASTM F487-88(2006) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding

ES-AENOR

UNE 20-700 Pt.11-1991 Semiconductor devices. Part 11:Sectional specification for discrete devices

BE-NBN

NBN C 63-158-2-1989 Low-voltage controlgear Semiconductor contactors (solid state contactors)

Others: UV Direct Indirect Semiconductor,indirect bandgap semiconductor,indirect semiconductor absorption,photocatalytic indirect semiconductor,Indirect Semiconductor Computing,indirect semiconductor photocatalysis,Measurement and calculation of effective static loads on the interface between body and drive,Overhead Calculation,Indirect semiconductor material photocatalysis,indirect semiconductor photocatalysis,Cobalt Tetroxide Indirect Semiconductor,Indirect Semiconductor Applications,indirect bandgap semiconductor bandgap,Overhead Calculation Method