Ultrasonic inspection method for sputtering target-back plate bonding quality
Ultrasonic inspection method for sputtering target-back plate bonding quality, Total:3 items.
The international standard classification for "Ultrasonic inspection method for sputtering target-back plate bonding quality" includes: Other non-ferrous metals and their alloys .
The Chinese standard classification for "Ultrasonic inspection method for sputtering target-back plate bonding quality" includes: Precious metals and their alloys .
Professional Standard - Non-ferrous Metal
- YS/T 837-2012 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies
American Society for Testing and Materials (ASTM)
- ASTM F1512-94(2003) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
- ASTM F1512-94(1999) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
