YS/T 837-2012 in English
VALIDStandard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies
- Issued on:2012-11-07
- Implemented on:2013-03-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$175.00
本标准规定了溅射用靶材-背板结合质量超声纵波脉冲反射液浸法C扫描检验技术的一般方法。内容包括一般要求、检验设备、对比试块、检验过程、缺陷评定及检验报告等。
本标准适用于用中间层材料结合方式(如软钎焊、硬钎焊和环氧树脂粘接等)的溅射靶材-背板结合面的孔洞、未结合、氧化物夹杂等缺陷的检验。其他用途的材料结合质量无损检测也可参照使用。
Scope
This standard specifies the general requirements for sputtering target-backplate combined quality inspection methods, inspection equipment, comparison test blocks, inspection processes, defect assessment and inspection reports, etc. This method uses ultrasonic longitudinal wave pulse reflection liquid immersion method C-scan inspection technology. This standard is applicable to the inspection of defects such as holes, unbonded, oxide inclusions and other defects on the sputtering target-backplate bonding surface using intermediate layer material bonding methods (such as soldering, hard brazing and epoxy resin bonding, etc.) . Materials for other uses combined with quality non-destructive testing can also be used as a reference.

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