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Database: 365,228(8 Aug 2026)
target-backing plate assemblies scopethis standard ultrasonic c-scan bond evaluation standard practice c-scan inspection technology quality inspection methods test result deviation aluminum content scopethis section unified information reporting specification
YS/T 837-2012 in English

YS/T 837-2012 in English

VALID

Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies

  • Issued on:2012-11-07
  • Implemented on:2013-03-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $180.00
$175.00
Standard No: YS/T 837-2012
Document status: VALID
Title in English: Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies
Title in Chinese: 溅射靶材-背板结合质量超声波检验方法
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2012-11-07
Implemented on: 2013-03-01
ICS Classification: 77.120.99-Other non-ferrous metals and their alloys
Chinese Classification: H68-Precious metals and their alloys
Professional Classification: YS-Non-ferrous Metal
Related Keywords: target-backing plate assemblies scopethis standard
ultrasonic c-scan bond evaluation
standard practice
c-scan inspection technology
quality inspection methods
Related Topics: ultrasound
ys/t836-2012
combine
ys/t 745.9-2012
Ultrasonic inspection method for sputtering target-back plate bonding quality
sputtering
Target type
ultrasound in english
target board english
drug target structure
target method
ys/t+3017-2012
Ultrasonic material
target wave
Backplane
Sputtering target
Target board
sputtering target
Target instrument
Ultrasound+
Ultrasound as
Infrared Target
target algorithm
targeted therapy
target lipid non-target lipid
sputtering target
Instrument target board
target non-target waveform
Microplate
target ms
Target area
ms target board
ultrasonic method
ys/t798-2012
Calibration target
Conductive target
Qualified ultrasonic
target material energy
target shooting
ultrasound
Ultrasonic extraction quality
Target back plate
Mass spectrometry targeted approach
Target back plate acceptance specification requirements
Heterogeneous combination into new methods
The target board is qualified
Targeted lipidomics detection method
ys/t 789 2012
ys/t817-2012
ys/t789-2012
ys/t858-2012

本标准规定了溅射用靶材-背板结合质量超声纵波脉冲反射液浸法C扫描检验技术的一般方法。内容包括一般要求、检验设备、对比试块、检验过程、缺陷评定及检验报告等。
本标准适用于用中间层材料结合方式(如软钎焊、硬钎焊和环氧树脂粘接等)的溅射靶材-背板结合面的孔洞、未结合、氧化物夹杂等缺陷的检验。其他用途的材料结合质量无损检测也可参照使用。


Scope

This standard specifies the general requirements for sputtering target-backplate combined quality inspection methods, inspection equipment, comparison test blocks, inspection processes, defect assessment and inspection reports, etc. This method uses ultrasonic longitudinal wave pulse reflection liquid immersion method C-scan inspection technology. This standard is applicable to the inspection of defects such as holes, unbonded, oxide inclusions and other defects on the sputtering target-backplate bonding surface using intermediate layer material bonding methods (such as soldering, hard brazing and epoxy resin bonding, etc.) . Materials for other uses combined with quality non-destructive testing can also be used as a reference.

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