sputtering target
sputtering target, Total:28 items.
The international standard classification for "sputtering target" includes: Titanium products , Other non-ferrous metals and their alloys , Copper products , Other products of non-ferrous metals , Aluminium and aluminium alloys .
The Chinese standard classification for "sputtering target" includes: Rare light metals and their alloys , Precious metals and their alloys , Heavy metals and their alloys , Rare refractory metals and their compounds , Metal physical property test method , Light metals and their alloys .
Professional Standard - Non-ferrous Metal
- YS/T 837-2012 Standard practice for ultrasonic C-scan bond evaluation of sputtering target-backing plate assemblies
- YS/T 1683-2024 Chromium-titanium alloy sputtering target for magnetic recording
- YS/T 1025-2015 High-purity tungsten and tungsten alloy sputtering target used in electronic film
- YS/T 718-2009 Flat magneting sputtering target—Niobium target for optical coating
- YS/T 1024-2015 Tantalum sputtering targets
- YS/T 719-2009 Flat magneting sputtering target—Silicon target for optical coating
- YS/T 893-2013 High-purity Sputtering Titanium Target Used in Electronic Film
- YS/T 819-2012 High-purity Sputtering Copper Target Used in Electronic Film
Group Standards of the People's Republic of China
- T/ZZB 0639-2018 Alumium doped zinc oxide magnetron sputtering targets
- T/QGCML 3081-2024 Semiconductor sputtering target high-purity titanium metal powder
- T/ICMTIA TG0011-2022 High-purity aluminum and aluminum alloy sputtering targets for integrated circuits
- T/ZZB 0093-2016 High-purity sputtering titanium target used in integrated circuit
- T/CIET 722-2024 High purity sputtering targets for semiconductors
- T/CAS 304-2018 Magnetron sputtering silicon targets and bound targets
工业和信息化部
- YS/T 1124-2016 Testing method on pass through flux of magnetic sputtering target
- YS/T 1357-2020 CrTaTi alloy sputter ing tar get used in magnetic recording
- YS/T 1358-2020 FeCoTa alloy target used in magnetic recording
- YS/T 1555-2022 Platinum-cobalt-chromium-boron alloys sputtering target
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 29658-2013 High-purity sputtering aluminium and aluminium alloy target used in electronic film
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
- GB/T 34649-2017 Magnetron sputtering ruthenium target
American Society for Testing and Materials (ASTM)
- ASTM F1709-97(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1709-97 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1512-94(2003) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
- ASTM F1512-94(1999) Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
- ASTM F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F1709-97(2002) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
- ASTM F3192-16 Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
- ASTM F3166-16 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization
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