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  1. HOME
  2. Standards for chip ion

chip ion

chip ion, Total:126 items.

The international standard classification for "chip ion" includes: Motion picture films. Cartridges , Biology. Botany. Zoology , Health care technology (Vocabularies) , Laboratory medicine , Integrated circuits. Microelectronics , Information technology (IT) in general .

The Chinese standard classification for "chip ion" includes: Photosensitive material , Basic Subject in general , Medical apparatus and devices in general , Daily-use hardware , Microcircuit in general , Social and public safety in general .

工业和信息化部

Taiwan Provincial Standard of the People's Republic of China

  • CNS 13622-1997 Fixed chip resistor for use in electronic equipment
  • CNS 13808-1997 Epitaxial Wafers for Light Emitting Diodes
  • CNS 13198-1993 Fixed Multilayer Ceramic Chip Capacitors for Use in Electronic Equipment

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

Professional Standard - Medicine

Professional Standard - Light Industry

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

未注明发布机构

  • JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

Group Standards of the People's Republic of China

Professional Standard - Public Safety Standards

  • GA 1091-2013 Evaluation specifications for environmental adaptability of integrated circuits on 13.56 MHz in electronic certificates
  • GA/T 1091-2019 Specifications for evaluation of environmental adaptability of integrated circuits on 13.56 MHz in electronic certificates
  • GA/T 1966-2021 Forensic science electronic equipment storage chip data inspection technical specification

Association Francaise de Normalisation

  • NF C93-404:1988 Electronic components. Chip carrier.
  • NF EN 61021-2:1998 Cores made from cut sheets for transformers and inductors intended for electronic and telecommunications equipment - Part 2: electrical characteristics for cores using YEE 2 sheets

IPC - Association Connecting Electronics Industries

Defense Logistics Agency

ECIA - Electronic Components Industry Association

  • 540A000-A-1990 Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment
  • 540AA00-1991 Blank Detail Specification for Chip Carrier Sockets for Leadless Type A@ B or D Chip Carriers for Use in Electronic Equipment
  • 540AC00-1991 "Blank Detail Specification for Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with ""J"" Type Leads for Use in Electronic Equipment"
  • EIA-540AAAA-1990 "Detail Specification for Chip Carrier Sockets for Leadless Type A (1.27 mm (.050"") Spacing) Chip Carriers for Use in Electronic Equipment"

U.S. Military Regulations and Norms

Electronic Components, Assemblies and Materials Association

  • ECA 540AC00-1991 Blank Detail Specification for Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with"J" Type Leads for Use in Electronic Equipment
  • ECA 580A000-1992 Sectional Specification for Fixed Chip Capacitors with Metallized Electrodes and Polyethylene-Terephthalate Dielectric for Use in Electronic Equipment
  • ECA 540A000-A-1990 Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment

Indonesia Standards

SCC

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

British Standards Institution (BSI)

  • 22/30383603 DC BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices - Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
  • BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers

CENELEC - European Committee for Electrotechnical Standardization

  • ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
  • ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

HU-MSZT

  • MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Danish Standards Foundation

  • DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
  • DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

German Institute for Standardization

  • DIN 15531:1976 Cores for motion-picture and magnetic film
  • DIN IEC 60740-2:1995 Laminations for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Specification for the minimum permeabilities of laminations made of soft magnetic metallic materials (IEC 60740-2:1993)

IEC - International Electrotechnical Commission

  • PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

Korean Agency for Technology and Standards (KATS)

  • KS C 6489-1991(2001) FIXED MULTILAYER CERAMIC CHIP CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT
  • KS C 6372-1993(1998) FIXED TANTALUM ELECTOLYTIC CHIP CAPACITORS WITH SOLID ELECTROLYTE FOR USE IN ELECTRONIC EQUIPMENT

PT-IPQ

  • NP 3081-1985 Electronic component. Semiconductor chip inspection in microelectronics scanning, basic specifications

American National Standards Institute （ANSI)

International Electrotechnical Commission (IEC)

  • IEC 61021-2:1995 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations
  • IEC 60740-2:1993 Laminations for transformers and inductors for use in telecommunication and electronic equipment; part 2: specification for the minimum permeabilities of laminations made of soft magnetic metallic materials

TIA - Telecommunications Industry Association

  • J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)

CZ-CSN

SE-SIS

U.S. Air Force

International Organization for Standardization (ISO)

  • ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions

GSO

  • BH GSO IEC 61021-2:2016 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE2 laminations
  • GSO IEC 61021-2:2015 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE2 laminations
  • BH GSO IEC/TR 62258-4:2016 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
  • OS GSO IEC 61021-2:2015 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE2 laminations
  • OS GSO IEC/TR 62258-4:2014 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

(U.S.) Telecommunications Industries Association

  • TIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028

(U.S.) Ford Automotive Standards

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