Chip-like Efficiency

Chip-like Efficiency, Total:100 items.

The international standard classification for "Chip-like Efficiency" includes: Integrated circuits. Microelectronics , Motion picture films. Cartridges , Laboratory medicine , Biology. Botany. Zoology .

The Chinese standard classification for "Chip-like Efficiency" includes: Semiconductor integrated circuit , Photosensitive material , Daily-use hardware , Medical apparatus and devices in general , Environmental Condition and General Test Method .

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Group Standards of the People's Republic of China

• T/QGCML 2041-2023 878 nm high power semiconductor laser chip
• T/ZJDJ 010-2023 High efficiency asynchronous motor Stator and rotor cores
• T/ZZB 1840-2020 High-performance spider included thin dynamic speaker unit
• T/SBX 021-2019 Operation rules for automatic scribing and splitting of laser chips
• T/CIE 071-2020 Evaluation of industrial high-reliability integrated circuits―Part 6:Bluetooth IC
• T/CSAE 222-2021 Battery electric passenger vehicle automotive grade integrated circuit general requirements

Guangdong Provincial Standard of the People's Republic of China

• DB44/T 1905-2016 UHF radio frequency identification (RFID) chip test method

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

• GB/T 6848-1986 Dimensions of the cores for motion-picture film rolls

Professional Standard - Medicine

• YY/T 1152-2009 Aldehyde slide for biochips

Professional Standard - Light Industry

• QB/T 2475-2000 Blade Cored Door Lock

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

• GB/T 33752-2017 Aldehyde slide for microarrays

国家市场监督管理总局、中国国家标准化管理委员会

• GB/T 38490-2021 Determination of high-throughput adaptive evolution for microorganisms—Microfluidic chip method

未注明发布机构

• JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

Defense Logistics Agency

• DLA SMD-5962-89805 REV A-2002 MICROCIRCUIT, LINEAR, RMS-TO-DC CONVERTER, MONOLITHIC SILICON
• DLA SMD-5962-89637 REV B-2004 MICROCIRCUIT, LINEAR, WIDEBAND RMS-TO-DC CONVERTER, MONOLITHIC SILICON
• DLA DSCC-DWG-04051-2006 CAPACITOR, FIXED, POLYMER TANTALUM CHIP
• DLA DESC-DWG-89089 REV C-2013 CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE
• DLA A-A-59697-2001 COIL, RF, CHIP, FIXED, HIGH FREQUENCY
• DLA DSCC-DWG-05001 REV D-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
• DLA DSCC-DWG-05002 REV D-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
• DLA DSCC-DWG-05001 REV B-2009 CAPACITORS, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
• DLA DSCC-DWG-05002 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
• DLA DSCC-DWG-05003 REV C-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0402, HIGH FREQUENCY, BP
• DLA DSCC-DWG-03024 REV B-2013 SHIELDING BEAD, ELECTRONIC, CHIP, FERRITE, HIGH RELIABILITY
• DLA DSCC-DWG-04052-2006 CAPACITOR, FIXED, MULTIPLE ANODE POLYMER TANTALUM CHIP
• DLA QPL-83446-37-2005 COILS, RADIO FREQUENCY, CHIP, FIXED OR VARIABLE, GENERAL SPECIFICATION FOR
• DLA A-A-59699 A-2008 COIL, RF, CHIP, FIXED, HIGH INDUCTANCE, SURFACE MOUNT
• DLA A-A-59699 B-2013 COIL, RF, CHIP, FIXED, HIGH INDUCTANCE, SURFACE MOUNT
• DLA A-A-59408 VALID NOTICE 1-2011 Coil, RF, Chip, Fixed, High Current, Surface Mount
• DLA A-A-59700 A-2008 COIL, RF, CHIP, FIXED, HIGH FREQUENCY, MINIATURE, SURFACE MOUNT
• DLA A-A-59739 A-2013 COIL, RF, CHIP, FIXED, HIGH Q, MINIATURE, SURFACE MOUNT
• DLA A-A-59416 A-2008 INDUCTOR, CHIP, FIXED, HIGH SELF RESONANT FREQUENCY, SURFACE MOUNT
• DLA QPL-83446-QPD-2010 COILS, RADIO FREQUENCY, CHIP, FIXED OR VARIABLE, GENERAL SPECIFICATION FOR
• DLA A-A-59408-2004 COIL, RF, CHIP, FIXED, HIGH CURRENT, SURFACE MOUNT
• DLA MIL-PRF-83446/21 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
• DLA QPL-83446-2011 COILS, RADIO FREQUENCY, CHIP, FIXED OR VARIABLE, GENERAL SPECIFICATION FOR
• DLA QPL-83446-37 NOTICE 1-2008 COILS, RADIO FREQUENCY, CHIP, FIXED OR VARIABLE, GENERAL SPECIFICATION FOR
• DLA MIL-PRF-83446/24 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
• DLA DSCC-DWG-04032 REV B-2011 RESISTOR, CHIP, FIXED, FILM, LOW VALUES, HIGH POWER, 1.5 WATTS, STYLE 2512
• DLA MIL-PRF-83446/20 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
• DLA SMD-5962-87742 REV D-2010 MICROCIRCUIT, LINEAR, HIGH EFFICIENCY LINEAR REGULATOR, MONOLITHIC SILICON
• DLA MIL-PRF-83446/23 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
• DLA A-A-59739-2002 COIL, RF, CHIP, FIXED, HIGH Q, MINIATURE, SURFACE MOUNT
• DLA SMD-5962-87742 REV C-2003 MICROCIRCUIT, LINEAR, HIGH EFFICIENCY LINEAR REGULATOR, MONOLITHIC SILICON
• DLA MIL-PRF-83446/25 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
• DLA MIL-PRF-83446/22 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
• DLA MIL-PRF-83446/30 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

• IPC J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028
• IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
• IPC SMC-WP-003-1993 Chip Mounting Technology (CMT)

SCC

• BS PD ES 59008-1:2000 Data requirements for semiconductor die-General requirements
• UNE-EN 1822-5:2001 High efficiency particulate air filters (HEPA and ULPA). Part 5: Determining the efficiency of filter element.
• MIL MIL-PRF-83446/32A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
• MIL MIL-PRF-83446/21A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
• MIL MIL-PRF-83446/29A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
• MIL MIL-PRF-83446/32-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
• MIL MIL-F-24666-1986 FILTER ELEMENT, SHIP FUEL SYSTEM PRE-FILTER, NON-CLEANABLE, HIGH EFFICIENCY
• AENOR UNE-EN 1822-5:2010 High efficiency air filters (EPA, HEPA and ULPA) - Part 5: Determining the efficiency of filter elements
• MIL MIL-PRF-83446/29-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
• DANSK DS/EN 1822-5:2009 High efficiency air filters (EPA, HEPA and ULPA) – Part 5: Determining the efficiency of filter elements
• BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
• MIL MIL-PRF-23419/14-2018 FUSES, INSTRUMENT TYPE, STYLE FM14 (CHIP (SURFACE MOUNT) - HIGH PERFORMANCE)
• MIL MIL-PRF-83446/28-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
• MIL MIL-PRF-83446/23A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
• MIL MIL-PRF-83446/31-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
• MIL MIL-PRF-83446/31A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
• BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
• MIL MIL-PRF-83446/33A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
• MIL MIL-PRF-83446/30A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
• MIL MIL-PRF-83446/30-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
• MIL MIL-PRF-32159-2004 RESISTORS, CHIP, FIXED, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR
• MIL MIL-PRF-83446/33-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
• MIL MIL-PRF-83446/22A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE

IPC - Association Connecting Electronics Industries

• IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
• IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
• IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
• IPC/EIA J-STD-028 CD-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
• IPC/EIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
• IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Indonesia Standards

• SNI 01-4304-1996 Pineapples chips
• SNI 01-4306-1996 Sweet potatoes chips

Association Francaise de Normalisation

• NF X44-014-5:2010 High efficiency air filters (EPA, HEPA and ULPA) - Part 5 : determining the efficiency of filter elements.

RU-GOST R

• GOST R EN 1822-5-2014 High efficiency air filters EPA, HEPA and ULPA. Part 5. Determining the efficiency of filter elements

CENELEC - European Committee for Electrotechnical Standardization

• ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
• ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

HU-MSZT

• MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Danish Standards Foundation

• DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die

German Institute for Standardization

• DIN 15531:1976 Cores for motion-picture and magnetic film

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

• JEDEC JESD22-B109-2002 Flip Chip Tensile Pull
• JEDEC JESD22-B109B-2014 Flip Chip Tensile Pull
• JEDEC JESD22-B109A-2009 Flip Chip Tensile Pull

U.S. Military Regulations and Norms

• ARMY MIL-PRF-55365 G (3)-2010 CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NONESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR
• ARMY MIL-PRF-55365 H NOTICE 1-2011 CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NONESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR
• ARMY MIL-PRF-55365 H (1)-2012 CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NONESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR
• ARMY MIL-PRF-55365 H NOTICE 2-2012 CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NONESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR
• ARMY MIL-PRF-55365 H-2011 CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NONESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR

IEC - International Electrotechnical Commission

• PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

Korean Agency for Technology and Standards (KATS)

• KS H ISO 8432-2014(2019) Essential oils — Analysis by high performance liquid chromatography — General method

American National Standards Institute （ANSI)

• ANSI/VITA 41.1-2006 VXS 4X InfiniBand Protocol

TIA - Telecommunications Industry Association

• J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)

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