Sign In |Help & Support
ALL SECTORS
  • ALL SECTORS
  • GB(National Standard)
  • CB(Shipping)
  • CECS(Engineering Construction)
  • CJ(Urban Construction)
  • CY(News and Publication)
  • DB(Provincial Standard)
  • DL(Electricity & Power)
  • DZ(Geology & Mineralogy)
  • FZ(Spinning & Textile)
  • GA(Public Security)
  • HB(Aviation)
  • HG(Chemical Industry)
  • HJ(Environmental Protection)
  • JB(Machinery)
  • JC(Building Materials)
  • JG(Building & Construction)
  • JJ(Metering)
  • JT(Highway & Transportation)
  • LY(Forestry)
  • MT(Coal)
  • NB(Energy)
  • NY(Agriculture)
  • QB(Light Industry)
  • QC(Automobile & Vehicle)
  • QJ(Aerospace)
  • SH(Petrochemical)
  • SJ(Electronics)
  • SL(Water Resources)
  • SN(Commodity Inspection)
  • SY(Oil & Gas)
  • TB(Railway & Train)
  • YB(Ferrous Metallurgy)
  • YC(Tobacco)
  • YD(Telecommunication)
  • YY(Medical Device)
Database: 365,228(8 Aug 2026)

Td thermal decomposition temperature of copper clad laminate

Td thermal decomposition temperature of copper clad laminate, Total:116 items.

The international standard classification for "Td thermal decomposition temperature of copper clad laminate" includes: Other materials for the reinforcement of composites , Temperature-measuring instruments , Protection against dangerous goods , Man-made fibres , Aerospace engines and propulsion systems , Testing of metals .

The Chinese standard classification for "Td thermal decomposition temperature of copper clad laminate" includes: Other non-metal mine product , Temperature and pressure instrument , Marking, packaging, transport and storage in general , Chemical fibre in general , Spacecraft power system , Petroleum products in general , Metal physical property test method .


General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 2904-1982 Nickel-Chromium/Gold-Iron,Copper/Gold-Iron low temperature thermocouple wires and their reference tables
  • GB/T 21613-2008 Dangerous goods - Test method for determination of the accelerating decomposition temperature
  • GB/T 30711-2014 Test method for thermogravimetry(TG)of friction materials
  • GB/T 31850-2015 Test method for thermogravimetry(TG) of no-matallic sealing materials
  • GB/T 42261-2022 Metallic and other inorganic coatings—Test method of cyclic heating for thermal-barrier coatings under temperature gradient

工业和信息化部

  • HG/T 5841-2021 Chlorinated Paraffins-Determination of Thermal Decomposition Temperature
  • SJ/T 11725-2018 Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board
  • YD/T 3320.2-2018 The high (heat) density thermal control equipment for telecommunication room-Part 2:Rear door heat exchanger

国家市场监督管理总局、中国国家标准化管理委员会

  • GB/T 37631-2019 Man-made fiber—Test method for thermal decomposition temperature

Military Standard of the People's Republic of China-General Armament Department

  • GJB 9381-2018 General specification for thermally conductive metal-based copper-clad laminates
  • GJB 2142/1-1995 Detailed specifications for heat-resistant and flame-retardant copper-clad epoxy glass cloth laminates

Professional Standard - Aerospace

  • QJ 1468-1988 Test Methods for Initial Thermal Decomposition Temperature and Off Temperature of Composite Solid Propellant

Anhui Provincial Standard of the People's Republic of China

  • DB34/T 3369-2019 Metallographic method for determination of substrate thickness of copper clad laminates for printed circuits
  • DB34/T 3371-2019 Method for determination of thermal conductivity of rigid copper-clad laminates for printed circuit boards

Professional Standard - Petrochemical Industry

  • SH/T 0561-1993 Determination method for thermal decomposition temperature of anti-oxidant and anti-corrosive additive (capillary method)

Professional Standard - Non-ferrous Metal

  • YS/T 466-2003 Test method for thermal softening resistance of copper plate, strip and foil - Hardness-testing method

未注明发布机构

  • DIN 53436-1 E:2015-03 Generation of thermal decomposition products from materials for their analytic-toxicological testing - Part 1: Decomposition apparatus and determination of test temperature

Professional Standard - Construction Industry

  • JG/T 362-2012 Heat-allocation Device Based on Temperature Determination

YU-JUS

  • JUS L.F2.009-1979 Measurement of temperature. Tabeles for thermocouple. ThermocoupleT: Copper/Copper-Nickel
  • JUS L.F2.008-1979 Measurement of temperature. Tabeles for thermocouple. Thermooouple J: Iron/Copper-Nickel
  • JUS L.F2.010-1979 Measurement of temperature. Tabelesfor thermocouple. Thermocoupk. Vrcke1 - Chromium/Copper - Nickel
  • JUS Z.C8.030-1986 Determination of fjammability of plastics. Determination ofthe temperature of evolution of flammable gases (decompositin temperature)
  • JUS N.A5.782-1994 Environmental testing - Test Td: Solderability resistance to dissolution of metallization and to soldering heat of surface mounting devices(SMD)

SCC

  • SPC GB/T 37631-2019 Man-made fiber -- Test method for thermal decomposition temperature (TEXT OF DOCUMENT IS IN CHINESE)
  • CEI EN IEC 61189-2-807:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
  • DANSK DS/ISO 6925:1985 Textile floor coverings - Burning behavior - Tablet test at ambient temperature
  • DIN EN IEC 61189-2-807:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021); German ...
  • DIN EN IEC 61189-2-807 E:2020 Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA (IEC 91/1647/CD...
  • DANSK DS/EN ISO 75-3:2004 Plastics - Determination of temperature of deflection under load - Part 3: High-strength thermosetting laminates
  • DIN 53436-1 E:2015 Draft Document - Generation of thermal decomposition products from materials for their analytic- toxicological testing - Part 1: Decomposition apparatus and determination of test temperature
  • DANSK DS/ISO 23999:2021 Resilient floor coverings – Determination of dimensional stability and curling after exposure to heat
  • UNE-EN 434:1995 RESILIENT FLOOR COVERINGS. DETERMINATION OF DIMENSIONAL STABILITY AND CURLING AFTER EXPOSURE TO HEAT
  • NS-EN 14037-2:2003 Ceiling mounted radiant panels supplied with water at temperature below 120 °C — Part 2: Test method for thermal output
  • DANSK DS/EN 60539-2/A1:2004 Directly heated negative temperature coefficient thermistors – Part 2: Sectional specification – Surface mount negative temperature coefficient thermistors
  • CEI EN IEC 60539-2:2020 Directly heated negative temperature coefficient thermistors Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors
  • DANSK DS/EN IEC 60539-2:2019 Directly heated negative temperature coefficient thermistors – Part 2: Sectional specification – Surface mount negative temperature coefficient thermistors
  • CEI EN 60539-2:2005 Directly heated negative temperature coefficient thermistors Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors

NEMA - National Electrical Manufacturers Association

  • NEMA LI 4-1965 TEST METHOD FOR HOT PEEL STRENGTH OF COPPER-CLAD INDUSTRIAL LAMINATES FOR PRINTED CIRCUITS
  • NEMA LI 5-1969 TEMPERATURE INDICES INDUSTRIAL THERMOSETTING LAMINATES
  • NEMA LI 6-1983 RELATIVE TEMPERATURE INDICES OF INDUSTRIAL THERMOSETTING LAMINATES (RESCINDED)
  • NEMA DC 10-1983 Residential Controls - Temperature Limit Controls for Electric Baseboard Heaters
  • NEMA DC 10-2009 Residential Controls–Temperature Limit Controls for Electrical Baseboard Heaters

Korean Agency for Technology and Standards (KATS)

  • KS M ISO 8130-6:2016 Coating powders-Part 6:Determination of gel time of thermosetting coating powders at a given temperature
  • KS M ISO 8130-6:2008 Coating powders-Part 6:Determination of gel time of thermosetting coating powders at a given temperature
  • KS C IEC 61249-2-2:2013 Materials for printed boards and other interconnecting structures-Part 2-2:Reinforced base materials,clad and unclad-Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
  • KS C IEC 61249-2-2:2022 Materials for printed boards and other interconnecting structures —Part 2-2: Reinforced base materials, clad and unclad —Phenolic cellulose paper reinforced laminated sheets,high electrical grade, cop
  • KS K ISO 23999-2010(2015) Resilient floor coverings-Determination of dimensional stability and curling after exposure to heat
  • KS K ISO 23999:2021 Resilient floor coverings — Determination of dimensional stability and curling after exposure to heat
  • KS C IEC 61249-2-1-2021 Materials for printed boards and other interconnecting structures-Part 2-1:Reinforced base materials,clad and unclad-Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
  • KS C IEC 61249-2-18-2011(2016) Materials for printed boards and other interconnecting structures-Part 2-18:Reinforced base materials, clad and unclad-Polyester non-woven fibreglass reinforced laminated sheet of defined flammability

RO-ASRO

  • STAS SR ISO 8130-6:1992 Coating powders - Part 6: Determination of gel time of thermosetting coating powders at a given temperature

American Society for Testing and Materials (ASTM)

  • ASTM D5109-99 Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
  • ASTM D5109-99(2004) Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
  • ASTM D5109-12 Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
  • ASTM D2879-83 Standard Test Method for Vapor Pressure-Temperature Relationship and Initial Decomposition Temperature of Liquids by Isoteniscope

Japanese Industrial Standards Committee (JISC)

  • JIS H 7851:2015 Test method of cyclic heating for thermal-barrier coatings under temperature gradient

Society of Automotive Engineers (SAE)

  • SAE AMS3601E-2011 Plastic Sheet, Copper Faced Glass Fabric Reinforced Epoxy Resin Hot Strength Retention
  • SAE AMS4530H-2010 Copper-Beryllium Alloy Sheet, Strip, and Plate, 98Cu 1.9Be, Solution Heat Treated (TB00)
  • SAE AMS4650M-2013 Copper-Beryllium Alloy, Bars, Rods, Shapes, and Forgings 98Cu 1.9Be Solution Heat Treated TB00 (A)
  • SAE AMS5512L-2007 Steel, Corrosion and Heat-Resistant, Sheet, Strip, and Plate 18Cr - 10.5Ni - 0.80Cb (SAE 30347) Solution Heat Treated UNS S34700
  • SAE AMS5507G-2012 Steel, Corrosion and Heat-Resistant, Sheet, Strip, and Plate 17Cr - 13Ni - 2.5Mo (316L) Solution Heat Treated (UNS S31603)
  • SAE AMS3601D-2004 Plastic Sheet, Copper Faced Glass Fabric Reinforced Epoxy Resin Hot Strength Retention
  • SAE AMS5870E-2012 Nickel Alloy, Corrosion and Heat Resistant, Sheet, Strip and Plate 60.5Ni 23Cr 14Fe 0.35Ti 1.4Al Solution Heat Treated
  • SAE AMS5878C-2007 Nickel Alloy, Corrosion and Heat-Resistant, Sheet, Strip, and Plate 59Ni - 22Cr - 2Mo - 14W - 0.35AI - 0.03La Solution Heat Treated UNS N06230

British Standards Institution (BSI)

  • BS 4584-13:1977 Specification for metal-clad base materials for printed circuits - Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13
  • BS 4584 Sec.103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for copper foil for use in the manufacture of copper-clad base materials
  • BS EN 1653:1998 Copper and copper alloys - Plate, sheet and circles for boilers, pressure vessels and hot water storage units
  • BS EN 10336:2007 Continuously hot-dip coated and electrolytically coated strip and sheet of multiphase steels for cold forming - Technical delivery conditions
  • BS 4584-5:1972 Specification for metal-clad base materials for printed circuits - Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality: PF-CP-Cu-5
  • 20/30409140 DC BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA
  • BS 2L 98:1971 Specification for plate of aluminium-copper-magnesium-manganese alloy (solution treated and aged at room temperature: not controlled stretched) (Cu 4.4, Mg 1.5, Mn 0.6)
  • BS 4584-6:1972 Specification for metal-clad base materials for printed circuits - Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality, flame retardant grade: PF-CP-Cu-6
  • BS EN 61249-2-2:2005 Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
  • BS EN 61249-2-2:2006 Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
  • BS EN ISO 75-3:2004 Plastics - Determination of temperature of deflection under load - High-strength thermosetting laminates and long-fibre-reinforced plastics
  • BS 4584-13:1977(1999) Specification for Metal - clad base materials for printed circuits — Part 13 : Silicone woven glass fabric copper - clad laminated sheet Si - GC - Cu - 13

SAE - SAE International

  • SAE AMS4042-1941 ALUMINUM ALLOY SHEET@ -ALUMINUM COVERED HEAT TREATED AND COLD WORKED COPPER MAGNESIUM MANGANESE (ALC24S-RT)

IPC - Association Connecting Electronics Industries

  • IPC TM-650 2.6.21B-2011 Service Temperature of Metal-Clad Flexible Laminate@ Cover Material and Adhesive Bonding Films

International Electrotechnical Commission (IEC)

  • IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

European Committee for Electrotechnical Standardization(CENELEC)

  • EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
  • EN 61249-2-1:2005 Materials for printed boards and other interconnecting structures Part 2-1: Reinforced base materials, clad and unclad Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

Association Francaise de Normalisation

  • NF C93-732-807*NF EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807 : test methods for materials for interconnection structures - Decomposition temperature ( Td) using TGA
  • NF A06-702:1967 Chemical analysis of copper and its alloys. Spectrophotometric determination of residual copper in the electrolysate.
  • NF EN 60317-50:2013 Specifications for particular types of winding wire - Part 50: circular section wires in bare or enameled copper, covered with a covering of glass fibers impregnated with silicone resin or varnish, temperature index 200
  • NF EN 60317-48:2012 Specifications for particular types of winding wires - Part 48: wire of circular section in bare or enameled copper, covered with a covering of glass fibers impregnated with resin or varnish, temperature index 155
  • NF A91-139-2*NF EN 15042-2:2006 Thickness measurement of coatings and characterization of surfaces with surface waves - Part 2 : guide to the thickness measurement of coatings by photothermic method.
  • NF EN 60317-49:2013 Specifications for particular types of winding wire - Part 49: circular section wire in bare or enameled copper, covered with a covering of high temperature glass fibers impregnated with resin or varnish, temperature index 180
  • NF EN IEC 60317-70-1:2020 Specifications for particular types of winding wires - Part 70-1: circular section wire in bare or enameled copper, covered with unvarnished fused polyester glass fibers, temperature index 155
  • NF EN 60317-31:2018 Specifications for particular types of winding wires - Part 31: rectangular section wire in bare or enameled copper covered with glass fibers impregnated with varnish or resin, temperature index 180

German Institute for Standardization

  • DIN EN 10336:2007 Continuously hot-dip coated and electrolytically coated strip and sheet of multiphase steels for cold forming - Technical delivery conditions; German version EN 10336:2007
  • DIN 54386:1994 Testing of paper, board and pulp; photometric determination of the copper content with bathocuproin; determination after decomposition with nitric acid
  • DIN 53436-1:2015 Generation of thermal decomposition products from materials for their analytic-toxicological testing - Part 1: Decomposition apparatus and determination of test temperature
  • DIN 53436-1:1981 Producing thermal decomposition products from materials in an air stream and their toxicological testing; decomposition apparatus and determination of test-temperature
  • DIN 53436-1:2015-12 Generation of thermal decomposition products from materials for their analytic-toxicological testing - Part 1: Decomposition apparatus and determination of test temperature
  • DIN EN 15042-2:2006 Thickness measurement of coatings and characterization of surfaces with surface waves - Part 2: Guide to the thickness measurement of coatings by photothermic method English version of DIN EN 15042-2:2006-06

AENOR

  • UNE 40462:1983 TEXTILE FLOOR COVERINGS. BURNING BEHAVIOUR. TABLET TES AT AMBIENT TEMPERATURE

GSO

  • GSO ISO 6925:2013 Textile floor coverings -- Burning behaviour -- Tablet test at ambient temperature

IN-BIS

  • IS 11174-1984 Specification for aromatic polyimide paper covered rectangular and square copper wire with a temperature index of 200
  • IS 12244 Pt.2-1988 Specification for calorimeter thermometers Part 2 Closed scale thermometers
  • IS 12244 Pt.1-1988 Specification for calorimeter thermometers Part 1 Solid thermometers

European Association of Aerospace Industries

  • AECMA PREN 3877-1997 Aerospace Series Metallic Materials Test Method Determination of Solidus and Liquidus Temperatures by Differential Thermal Analysis of Braze Alloys Edition P 1
  • AECMA PREN 3877-1993 Aerospace Series Test Method for Braze Alloys Determination of Solidus and Liquidus Temperatures by Differential Thermal Analysis

National Electrical Manufacturers Association(NEMA)

  • NEMA LI 6-1993 Relative Temperature Indices of Industrial Thermosetting Laminates (Reaffirm Letter)

IT-UNI

  • UNI 4818-P27-1977 Bracket covered with plastic material. experiment method. Hot plate strength measurement
  • UNI 5346-1964 Chemical and electrochemical treatment of surfaces. Determination of porosity index of tin electrolytic coatings on copper and its alloys

CH-SNV

  • VSM 15162-1969 Taper keys with or without gib head and their corresponding keyways (Dimensions in millimetres)
  • SN ISO 105/E03:1984 Plastics and ebonite-Determination of temperature of deflection under load

PL-PKN

  • PN BN 2251-06-1962 Cover-pipe heat exchange. Distribution of openings on cribriform plates

European Committee for Standardization (CEN)

  • EN 15042-2:2006 Thickness measurement of coatings and characterization of surfaces with surface waves - Part 2: Guide to the thickness measurement of coatings by photothermic method

RU-GOST R

  • GOST R 55917-2013 Nickel and copper-nickel alloys wire for extension leads for thermoelectric temperature transducers. Specifications

TH-TISI

  • TIS 703.1-2009 Materials for printed boards.part 1: reinforced base materials, clad and unclad.phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

KR-KS

  • KS C IEC 61249-2-2-2022 Materials for printed boards and other interconnecting structures —Part 2-2: Reinforced base materials, clad and unclad —Phenolic cellulose paper reinforced laminated sheets, high electrical grade, co
  • KS K ISO 23999-2021 Resilient floor coverings — Determination of dimensional stability and curling after exposure to heat

IEC - International Electrotechnical Commission

  • IEC 60317-49:2012/COR1:2013 Specifications for particular types of winding wires – Part 49: Glass-fibre wound high temperature resin or varnish impregnated@ bare or enamelled round copper wire@ temperature index 180 (Edition 2.0)

International Organization for Standardization (ISO)

  • ISO 871:1980 Plastics; Determination of temperature of evolution of flammable gases (decomposition temperature) from a small sample of pulverized material

ES-UNE

  • UNE-EN IEC 60539-2:2019 Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors (Endorsed by Asociación Española de Normalización in November of 2019.)