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Database: 365,228(8 Aug 2026)

Silicon Semiconductor

Silicon Semiconductor, Total:170 items.

The international standard classification for "Silicon Semiconductor" includes: Semiconducting materials , Services in general .

The Chinese standard classification for "Silicon Semiconductor" includes: Semimetal , Supply and Use Relation , Metal physical property test method , Semimetal and semiconductor material in general , Special electronic technology material , Power semiconductor device and parts , Electrical insulating material and its products , Light metals and their alloys , Technical management , Technical management , Technical management , Technical management .


Professional Standard - Non-ferrous Metal

  • YS/T 543-2006 Fine aluminum-1% silicon wire for semiconductor lend-bonding

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
  • GB/T 6616-1995 Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage
  • GB/T 31173-2014 Guide for national leisure education
  • GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding
  • GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge
  • GB/T 28928-2012 Guidelines for community leisure service

Group Standards of the People's Republic of China

  • T/NXCL 28-2024 Synthetic quartz crucible for semiconductor grade monocrystalline silicon growth
  • T/CASME 581-2023 Technical requirements for silicon rings for semiconductors
  • T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device
  • T/CEMIA 023-2021 Quartz crucible for semiconductor monosilicon growth
  • T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology
  • T/ICMTIA CM0038-2024 High purity quartz crucible for semiconductor silicon single crystal production
  • T/CEMIA 024-2021 Quartz crucible manufacturing practices for semiconductor monosilicon growth
  • T/ZZB 2283-2021 Ultra-high purity graphite powder for semiconductor silicon carbide crystal

Professional Standard - Machinery

  • JB/T 7622-1994 Organosilicone Lacquer Intended to Be Used in Power Semiconductor Device Production Process
  • JB/T 7061-1993 Silicon Wafers Intended to Be Used in Power Semiconductor Devices

工业和信息化部

  • YS/T 543-2015 Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding

Professional Standard - Electron

  • SJ 909-1974 Detail specification for silicon voltage regulator diodes,Type 2CW50~149
  • SJ 20067-1992 Semiconductor discrete device.Detail specification for type 2CZ30 silicon rectifier diode
  • SJ 50033/125-1997 Semiconductor discrete device - Detail specification for silicon PIN diodes for Type PIN11~15
  • SJ 20066-1992 SJ 2006 6-1992 Semiconductor discrete device - Detail specification for Type 2CL3 silicon high voltage rectifier stack
  • SJ 20274-1993 Semiconductor discrete devices Detail specificion for silicon switching diode for type 2CK84
  • SJ 20070-1992 Semiconductor discrete device.Detail specification for silicon switching diode for type 2CK105
  • SJ 50033.47-1994 Semiconductor discrete device - Detail specification for type 2CZ117 silicon rectifier diode
  • SJ 50033.40-1994 Detail specification for type GT11 semiconductor sililcon NPN photo-transistor
  • SJ 50033.46-1994 Semiconductor discrete device-Detail specification for type 2CZ59 silicon rectifier diode
  • SJ 50033.55-1994 Semiconductor discrete device - Detail specification for type 2CK82 silicon switching diode
  • SJ 910-1974 Detail specification for silicon voltage regulator diodes,Type 3DW50~202
  • SJ 20071-1992 Semiconductor discrete device.Detail specification for silicon switching diode for type 2CK4148
  • SJ 50033.45-1994 Semiconductor discrete device-Detail specification for type 2CZ58 silicon rectifier diode
  • SJ 50033.56-1994 Semiconductor discrete device-Detail specification for type 2CK85 silicon switching diode
  • SJ 20069-1992 Semiconductor discrete device.Detail specification for silicon switching diode for type 2CK76

Liaoning Provincial Standard of the People's Republic of China

Shaanxi Provincial Standard of the People's Republic of China

  • DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices

Military Standard of the People's Republic of China-General Armament Department

  • GJB 33/9-1989 Detailed specifications for semiconductor discrete devices BT32 type PN silicon single-junction transistor
  • GJB 33/10-1989 Detailed specifications for semiconductor discrete devices BT33 type PN silicon single-junction transistor

CZ-CSN

RU-GOST R

  • GOST 26239.7-1984 Semiconductor silicon. Method of oxygen, carbon and nitrogen determination
  • GOST 26239.5-1984 Semiconductor silicon and quartz. Method of impurities determination
  • GOST 26239.8-1984 Semiconductor silicon and raw materials for its production. Method of dichlorsilane, trichlorsilane and silicon tetrachloride determination
  • GOST 26239.0-1984 Semiconductor silicon, raw materials for its production and quartz. General requirements for methods of analysis
  • GOST 26239.3-1984 Semiconductor selicon, raw materials for its production and quartz. Methods of phosphorus determination
  • GOST 26239.2-1984 Semiconductor selicon, raw materials for its production and quartz. Methods of boron determination
  • GOST 26239.1-1984 Semiconductor silicon, raw materials for its production and quartz. Method of impurities determination

SCC

Defense Logistics Agency

American Society for Testing and Materials (ASTM)

  • ASTM F487-88(2001) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
  • ASTM F487-88(2006) Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding
  • ASTM F487-13 Standard Specification for Fine Aluminumndash;1???% Silicon Wire for Semiconductor Lead-Bonding
  • ASTM F487-13(2018) Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

IEC - International Electrotechnical Commission

  • PAS 62202-2000 Failure Mechanisms and Models for Silicon Semiconductor Devices (Edition 1.0)

Lithuanian Standards Office

  • LST EN 60191-6-22-2013 Mechanical standardization of semiconductor devices -- Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic

GSO

  • GSO ISO 13970:2017 Recreational diving services -- Requirements for the training of recreational snorkelling guides
  • OS GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
  • GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
  • OS GSO ISO 13970:2017 Recreational diving services -- Requirements for the training of recreational snorkelling guides

ES-UNE

  • UNE-EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...

Danish Standards Foundation

  • DS/ISO 13970:2012 Recreational diving services - Requirements for the training of recreational snorkelling guides

British Standards Institution (BSI)

  • BS ISO 13970:2011 Recreational diving services. Requirements for the training of recreational snorkelling guides
  • BS IEC 63229:2021 Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate

German Institute for Standardization

  • DIN EN 60191-6-22:2013-08 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...

U.S. Military Regulations and Norms