GB/T 8646-1998 in English

ABOLISHED

Fine aluminum-1% silicon wire for semiconductor lend-bonding

Issued on:1998-07-15
Implemented on:1999-02-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $260.00
$253.00

Standard No:	GB/T 8646-1998
Document status:	ABOLISHED
Superseded by:	YS/T 543-2006 Fine aluminum-1% silicon wire for semiconductor lend-bonding
Superseded on:	2006-10-11
Title in English:	Fine aluminum-1% silicon wire for semiconductor lend-bonding
Title in Chinese:	半导体键合铝-1%硅细丝
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1998-07-15
Implemented on:	1999-02-01
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H81-Semimetal
Professional Classification:	GB-National Standard
Related Keywords:	fine aluminum-1 % silicon wire aluminum-1 % silicon filaments semiconductor bonding lend-bonding scopethis standard a1-1 % si alloy wire
Related Topics:	Aluminum key wire Semiconducting sulfur silicon titanium bond bonder Bonded phase Semiconductors replace silicon Semiconductor paint Semiconductor Silicon Particles Semiconductor bonder Triple Bond C18 Alkyl Bonding semiconducting silane Semiconductor bonder triple bond Zirconium compound semiconductor GBT8646 GB/T 8646-1998 Bonding force bonding void test Bonding wire diameter Bonding wire diameter related Silicon Semiconductor Aluminum strip bonding tension Bonding wire industry Aluminum wire bonding wire fuse current test standard bonded aluminum wire Semiconductor bonding strength detection Gold wire bonding related standards Silane quality for semiconductors bonding wire gold wire Aluminum alloy for semiconductor equipment Aluminum silicon wire bonding standards Nanjing Aluminum Conductor Bonding wire related standards Semiconductor Bonding and Technology

本标准规定了半导体键合铝-1%硅细丝的要求、试验方法、检验规则及包装、标志、运输、贮存。本标准适用于半导体键合用圆形拉制Al-1%Si合金丝。

Scope

This standard specifies the requirements, test methods, inspection rules, packaging, marking, transportation and storage of semiconductor bonding aluminum-1% silicon filaments. This standard applies to round drawn A1-1% Si alloy wire for semiconductor bonding.

More samples: QC/T 942-2021 DL/T 5154-2012 JC/T 2453-2018

Sample only — not a preview of GB/T 8646-1998

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