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GB/T 18334-2025 in English

GB/T 18334-2025 in English

VALID

Specification for flexible multilayer printed boards

  • Issued on:2025-10-31
  • Implemented on:2026-05-01
  • File Format:PDF
  • Delivery:Via email within 8 business days
Price(USD): $690.00
$670.00
Standard No: GB/T 18334-2025
Document status: VALID
Title in English: Specification for flexible multilayer printed boards
Title in Chinese: 挠性多层印制板规范
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 8 business days
Issued on: 2025-10-31
Implemented on: 2026-05-01
Superseding: GB/T 18334-2001 Specification for flexible multiayer printed boards with through connections
ICS Classification: 31.180-Printed circuits and boards
Chinese Classification: L30-Printed circuit
Professional Classification: GB-National Standard
Related Keywords: flexible multilayer
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multilayer
boards
flexible

《GB/T 18334-2025挠性多层印制板规范》由TC47(全国印制电路标准化技术委员会)归口,主管部门为工业和信息化部(电子)。


Introduction

This standard provides detailed specifications for the production and testing of flexible multilayer printed boards. It outlines the requirements for materials, design, manufacturing processes, and quality control. The document includes guidelines for dimensional tolerances, electrical performance, and environmental resistance. It also defines the procedures for inspection and acceptance criteria to ensure consistency and reliability in the final product. The standard aims to support manufacturers in maintaining high-quality standards throughout the production lifecycle. Additionally, it covers packaging and labeling requirements to facilitate proper handling and storage. This standard is intended for use by manufacturers, designers, and quality assurance personnel involved in the production of flexible multilayer printed boards.

*** Please note: This description may not be accurate, please refer to the official documentation.

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