GB/T 19922-2005 in English

VALID

Standard test methods for measuring site flatness on silicon wafers by noncontact scanning

Issued on:2005-09-19
Implemented on:2006-04-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $150.00
$146.00

Standard No:	GB/T 19922-2005
Document status:	VALID
Title in English:	Standard test methods for measuring site flatness on silicon wafers by noncontact scanning
Title in Chinese:	硅片局部平整度非接触式标准测试方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2005-09-19
Implemented on:	2006-04-01
ICS Classification:	77.040.01-Testing of metals in general
Chinese Classification:	H17-Semimetal and semiconductor material analysis method
Professional Classification:	GB-National Standard
Related Keywords:	silicon wafers epitaxial silicon wafers standard test methods silicon wafer surface clean semiconductor silicon wafer surface
Related Topics:	silicon wafer silicon way Standard haze sheet contact test pressure silicon contact Contact angle tester standard sheet Flatness non contact Contactless contact angle standard contact angle standard Entire set of ELISA slides 7 pieces test wafer test wafer Scan silicon wafer silicon wafer for testing Silicon test piece Standard Method for Determination of Contact Angle Standard Test Strip Standard sheet for testing GBT19922 GBT19922-2005 Silicon wafer flatness SEMI Flatness detection method Non-contact metal thickness detection method The test methods for flatness include Ink flatness test method Chip contact resistance test method Flatness meter measuring standard deviation Bottle mouth flatness detection method Test method for flatness of press load plate Slide flatness Workpiece flatness detection method Epitaxial silicon wafer flatness Aluminum profile flatness test method Non-contact measurement accuracy Non-Standardized Component Testing Recommendations Silicon wafer contact angle measurement Platform flatness detection method Material flatness measurement method Methods to implement flatness detection Product flatness test method Substrate flatness detection method Leveling instrument detects flatness standard deviation Fiber flatness test method Bureau of Indian Standards Shoes Bottle mouth flatness measurement method Rice field flatness measurement method Analysis of the shortcomings of non-contact temperature measurement methods Material flatness test method Flatness test methods include

《GB/T 19922-2005硅片局部平整度非接触式标准测试方法》由339-1（工业和信息化部（电子））归口，主管部门为工业和信息化部（电子）。
本标准规定了用电容位移传感法测定硅片表面局部平整度的方法。本标准适用于无接触、非破坏性地测量干燥、洁净的半导体硅片表面的局部平整度。适用于直径100mm及以上、厚度250μm及以上腐蚀、抛光及外延硅片。

Scope

This standard specifies the method for measuring the local flatness of silicon wafer surface by capacitive displacement sensing method. This standard applies to the non-contact and non-destructive measurement of the local flatness of the dry and clean semiconductor silicon wafer surface. It is suitable for etching, polishing and epitaxial silicon wafers with a diameter of 100 mm and above and a thickness of 250 μm and above.

More samples: JGJ 94-2008 DL/T 5154-2012 JC/T 2453-2018

Sample only — not a preview of GB/T 19922-2005

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