GB/T 31352-2014 in English

VALID

Test methods for warp of sapphire substrates

Issued on:2014-12-31
Implemented on:2015-09-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $150.00
$146.00

Standard No:	GB/T 31352-2014
Document status:	VALID
Title in English:	Test methods for warp of sapphire substrates
Title in Chinese:	蓝宝石衬底片翘曲度测试方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2014-12-31
Implemented on:	2015-09-01
ICS Classification:	77.040.99-Other methods of testing of metals
Chinese Classification:	H21-Metal physical property test method
Professional Classification:	GB-National Standard
Related Keywords:	sapphire substrate discs sapphire cutting discs sapphire substrates sapphire substrates scopethis standard test methods
Related Topics:	Substrate Sapphire substrate Sapphire substrate Negative Sapphire substrate box Sapphire substrate box film rules Substrate sapphire Sapphire UV artificial sapphire Negative bending ?lining??? ?lining Warpage warping Measure warpage contrast curve How to measure warpage disc warping disc warping substrate salt Titanium sapphire sheet curve lining femtosecond titanium sapphire test substrate Lining Substrate tool Sapphire Titanium Titanium sapphire contrast measurement GBT31352 GB/T 31352-2014 Tablet Hardness Test Method Glass warpage test method Dissolution determination method: blue transfer method Warpage standard sheet Machining warpage Semiconductor silicon wafer warpage Warpage test method Warpage test table Substrate warpage measurement Optical material warpage test National standard for substrate mechanical strength testing Silicon wafer warpage industry Warpage test method Plastic warpage measurement method Plastic warpage test method Ceramic substrate warpage measurement Preparation method of trypan blue What is the standard for ceramic warpage testing method? Yaga blue test method Warpage measurement abroad Sapphire substrate card control Wafer warpage detection

《GB/T 31352-2014蓝宝石衬底片翘曲度测试方法》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。
本标准规定了蓝宝石切割片、研磨片、抛光片（以下简称蓝宝石衬底片）翘曲度的测试方法提要、干扰因素、仪器和设备、试样、测试环境、测试程序、测试结果的计算、精密度以及试验报告。
本标准适用于直径50.8mm～304.8mm，厚度为不小于200μm的蓝宝石衬底片翘曲度的测试。

Scope

This standard specifies the test method for the warpage of sapphire cutting discs, grinding discs and polishing discs (hereinafter referred to as sapphire substrate discs). This standard applies to the warpage test of sapphire substrates with a diameter of 50.8 mm to 304.8 mm and a thickness of not less than 200 μm.

More samples: DL/T 368-2010 GB 18306-2015 GB 50021-2001(2009)

Sample only — not a preview of GB/T 31352-2014

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