GB/T 39859-2021 in English
VALIDGallium-based liquid metal
- Issued on:2021-03-09
- Implemented on:2021-10-01
- File Format:PDF
- Delivery:Within 1 day
$171.00
《GB/T 39859-2021镓基液态金属》由TC243（全国有色金属标准化技术委员会）归口，TC243SC3（全国有色金属标准化技术委员会稀有金属分会）执行，主管部门为中国有色金属工业协会。
Introduction
Analysis of the core content of the standard
GB/T39859-2021 systematically standardizes the technical system of gallium-based liquid metal for the first time, and divides the products into 5 categories (MG1-MG5) according to the melting temperature. Among them, MG3 type requires thermal conductivity ≥25W/(m·K) and electrical conductivity ≥3.0×106S/m.
Comparison of key technical indicators
| Model | Melting Temperature(℃) | Thermal Conductivity Requirement | Typical Formula |
|---|---|---|---|
| MG1 | <9 | ≥20W/(m·K) | Ga25In13Sn1Zn |
| MG3 | 14≤Tm<18 | ≥25W/(m·K) | Ga14Sn |
| MG5 | 24≤Tm<30 | ≥25W/(m·K) | Ga4Zn |
Test Method Innovation
The standard innovatively adopts the DC four-probe method (Appendix A) to measure conductivity, which is calculated using the formula σ=1/ρ, requiring a constant current power supply accuracy of ±0.5%. The density test adopts the hydrostatic weighing method (Appendix B), which requires a balance with a graduation value of 0.0001g.
Application implementation suggestions
Application in the field of heat dissipation
MG3 products are recommended as chip heat dissipation media. Its 25W/(m·K) thermal conductivity can meet the heat dissipation needs of 5G base stations. Actual cases show that liquid metal heat sinks with Ga14Sn formula can reduce CPU temperature by 12°C.
Preparation of electronic pastes
MG1 type low temperature characteristics are suitable for flexible circuit printing. It should be noted that the packaging should be filled with inert gas and the storage temperature should be maintained at 0-40°C.
Standard evolution analysis
This standard fills the gap in the field of liquid metal. Its technical framework refers to the YS/T1256-1258 series thermal analysis methods. In the future, the performance requirements of nano liquid metal composite materials may be increased.
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