GB/T 41652-2022 in English
VALIDSilicon electrode and silicon ring for plasma etching machine
- Issued on:2022-07-11
- Implemented on:2023-02-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$156.00
| Standard No: | GB/T 41652-2022 |
| Document status: | VALID |
| Title in English: | Silicon electrode and silicon ring for plasma etching machine |
| Title in Chinese: | 刻蚀机用硅电极及硅环 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 2022-07-11 |
| Implemented on: | 2023-02-01 |
| ICS Classification: | 29.045-Semiconducting materials |
| Chinese Classification: | H82-Elemental semiconductor material |
| Professional Classification: | GB-National Standard |
| Related Topics: | etching
Electrode carbon content Dated etching Etching machine Motor pole pair Electrode ring cobalt etching ring disk electrode ring-disk electrode method ring electrode Ring disk electrode+ Silicon anode Silicon anode Electrode English The role of the common electrode silicon deep etch Electrode ring Molybdenum etchant Silicon Polarity GB/T 41652 GB/T 41652-2022 etched mesh Titanium silicon etching Ta2O5, etching Oxford etching machine electrode gb/t 41652-2022 |
《GB/T 41652-2022刻蚀机用硅电极及硅环》由TC203（全国半导体设备和材料标准化技术委员会）归口，TC203SC2（全国半导体设备和材料标准化技术委员会材料分会）执行，主管部门为国家标准化管理委员会。
Introduction
Technical Specification System Interpretation
Key Technical Parameter System
Electrical Performance Index System
| Parameter Category | Test Standard | Equipment Requirements | Control Index |
|---|---|---|---|
| Resistivity | GB/T1551 In-line Four-Probe Method | Four-Probe Tester | (1-5)Ω·cm |
| Radial Resistivity Variation | GB/T11073 Mapping Test | Multi-point probe system | ≤10% |
Structural reliability index
Key geometric features are controlled within ±0.1mm, the positioning holes adopt R-type anti-stress chamfer, and the process window is: 0.3±0.1mm. The chamfered surface must meet the requirements of 3D optical profiler detection
Quality standard evolution path
| Control dimension | 2015 standard | 2022 new standard | Improvement gain |
|---|---|---|---|
| Surface roughness (Ra) | 0.5μm | 0.2μm | 150% optimization |
| Oxygen content control | - | ≤24ppma | New indicators |
Technical motivation for standard formulation
With the development of advanced processes below 5nm, the plasma uniformity requirement is raised to a control level of ±2%. The newly added carbon content and micropore defect control modules in the 2022 version of the standard directly respond to the 14/16 angstrom process requirements.
Implementation Guide
Inspection Strategy Management
- AQL Sampling Plan: Geometric dimensions shall comply with GB/T2828.1 Level II standard
- Reliability Verification: It is recommended to pass 500 plasma cycle tests
Exception Handling Procedure
Failure mode analysis of excessive crystal orientation deviation should include: X-ray diffractometer phase analysis combined with EBSD grain orientation mapping.
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