Chip China

Chip China, Total:118 items.

The international standard classification for "Chip China" includes: General methods of tests and analysis for food products , Farming and forestry in general , Motion picture films. Cartridges , Optoelectronics. Laser equipment , Biology. Botany. Zoology , Photographic paper, films and cartridges , Health care technology (Vocabularies) , Laboratory medicine , Integrated circuits. Microelectronics , IT applications in banking .

The Chinese standard classification for "Chip China" includes: Basic standards and general methods , Plant quarantine, pest control , Photosensitive material , Semiconductor emitting device , Basic Subject in general , Basic standards and general methods for photosensitive material , Medical apparatus and devices in general , Basic standards and general methods , Microcircuit in general , Finance and Insurance , Daily-use hardware .

Professional Standard - Finance

JR/T 0098.2-2012 China Financial Mobile Payment-Test Specifications-Part 2:Security Chip

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 27990-2011 Fundamental terms for biochips
GB/T 31730-2015 Detection of genetically modified components in rice―Membrane-based array method
GB/T 6848-1986 Dimensions of the cores for motion-picture film rolls
GB/T 36357-2018 Technical specification for middle power light-emitting diode chips
GB/T 6848-2008 Cinematography—Cores for motion-picture and magnetic film rolls—Dimensions
GB/T 28065-2011 Biochip detection of Ceratitis capitata(Wiedemann)

Professional Standard - Commodity Inspection

SN/T 3393-2012 Rapid simultaneous screen method of five bio-terrorism bacteria at frontier port-Gene suspension array with multiple primers on genus level
SN/T 3267-2012 Detection method for Bacillus anthracis by gene suspension array at frontier ports
SN/T 2774-2011 Detection Method for Yersinia Pestis by Protein Suspension Array at Frontier Port

Group Standards of the People's Republic of China

T/CCPEF 073-2021 Chinese Ecological Quality Mulberry Leaf Bitter Gourd Sliced Candy
T/CCPEF 072-2021 China's ecological good product Natto Dilong tablet candy
T/QGCML 4122-2024 Semiconductor chip sorting machine
T/SXS 067-2024 Chip Tape-out Service Process Specification
T/CSB 0003-2024 General Terminology for Organ Chips
T/CCPEF 070-2021 China's ecological good product Ginseng Cordyceps Pressed Candy
T/BFIA 007-2021 Security technical specification of CPU for financial security chip
T/CCPEF 071-2021 Chinese Ecological Good Inulin Plum Pressed Candy
T/CASME 671-2023 Wide area oxygen sensor chip
T/SBX 021-2019 Operation rules for automatic scribing and splitting of laser chips
T/ZS 0646-2024 IC level flip chip die bonder
T/UNP 8-2022 International procurement—Silk cotton pillow core
T/QGCML 1986-2023 MLVD S driver TIA chip
T/SBX 019-2019 Storage Specifications for Optoelectronic Chips

Professional Standard - Medicine

YY/T 0692-2008 Fundamental terms for biochips
YY/T 1152-2009 Aldehyde slide for biochips

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

GB/T 35535-2017 Detection of genetically modified components in soybean and canola―Membrane-based gene-chip method
GB/T 33807-2017 Detection of genetically modified components in maize-Gene chip method
GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers
GB/T 33752-2017 Aldehyde slide for microarrays

中国人民银行

JR/T 0025.18-2018 China financial integrated circuit card specifications - Part 18: The technical specification of online payment based on secure chip

未注明发布机构

JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

Professional Standard - Light Industry

QB/T 2475-2000 Blade Cored Door Lock

Taiwan Provincial Standard of the People's Republic of China

CNS 13808-1997 Epitaxial Wafers for Light Emitting Diodes

工业和信息化部

JB/T 14231-2022 Lamination stacker for lithium-ion battery series

IPC - Association Connecting Electronics Industries

IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
IPC/EIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC/EIA J-STD-028 CD-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Indonesia Standards

SNI 01-4304-1996 Pineapples chips
SNI 01-4306-1996 Sweet potatoes chips

SCC

MIL MIL-PRF-83446/21A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/32A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
MIL MIL-PRF-83446/32-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/28-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/23A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
MIL MIL-PRF-83446/30A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/30-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/22A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/14B-2014 Coils, Radio Frequency, Chip, Fixed
MIL MIL-PRF-83446/16B-2014 Coils, Radio Frequency, Chip, Variable
MIL MIL-PRF-83446/6F-2013 Coils, Radio Frequency, Chip, Fixed
MIL MIL-PRF-83446/13C-2014 Coils, Radio Frequency, Chip, Fixed
MIL MIL-PRF-83446/34-2000 COILS, RADIO FREQUENCY, CHIP, MAGNETICALLY SHIELDED, IRON CORE-IRON SLEEVE, AND IRON CORE-FERRITE SLEEVE
CEI CLC/TR 62258-4:2013 Semiconductor die products Part 4: Questionnaire for die users and suppliers
DANSK DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

Defense Logistics Agency

DLA MIL-PRF-83446/24 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/21 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/23 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/20 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/22 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/30 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/25 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/7 D VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Variable
DLA MIL-PRF-83446/4 D VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed
DLA MIL-PRF-83446/9 E VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Variable
DLA MIL-PRF-83446/5 E VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed
DLA MIL-PRF-83446/10 C VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed
DLA MIL-PRF-83446/6 E VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed
DLA MIL-PRF-83446/8 E VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed
DLA DSCC-DWG-02006 REV B-2007 CAPACITORS, FIXED, TANTALUM, CHIP
DLA MIL-PRF-83446/13 B VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed
DLA MIL-PRF-83446/6 F-2013 COILS, RADIO FREQUENCY, CHIP, FIXED

HU-MSZT

MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Danish Standards Foundation

DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC SMC-WP-003-1993 Chip Mounting Technology (CMT)
IPC TM-650 5.5.3.8-1998 "Y" Pattern for Chip Component Cleanliness
IPC J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028
IPC D-330 SECTION 9-1992 Section Nine Multichip Modules

German Institute for Standardization

DIN 15531:1976 Cores for motion-picture and magnetic film

CENELEC - European Committee for Electrotechnical Standardization

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD22-B109B-2014 Flip Chip Tensile Pull
JEDEC JESD22-B109A-2009 Flip Chip Tensile Pull
JEDEC JESD22-B109-2002 Flip Chip Tensile Pull
JEDEC JESD22-B109C-2021 Flip Chip Tensile Pull
JEDEC JESD51-4-1997 Thermal Test Chip Guideline (Wire Bond Type Chip) Errata - September 1997; Replaces JEP129: 1997

IEC - International Electrotechnical Commission

PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

TIA - Telecommunications Industry Association

J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)

American National Standards Institute （ANSI)

ANSI/VITA 41.1-2006 VXS 4X InfiniBand Protocol

CZ-CSN

CSN 67 3219-1983 Oil varnísh for chips O 1109

U.S. Air Force

AIR FORCE MS27550-1967 STANDARD DATA BASE CHIP

British Standards Institution (BSI)

BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers

International Organization for Standardization (ISO)

ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions

TN-INNORPI

NT AB 020-1970 Kabels in tweedraads-,driedraads-,vierdraads-en vijfdraadsgroepen voor telefonische en tele-grafische centrales

(U.S.) Telecommunications Industries Association

TIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028

RO-ASRO

STAS R 11682-1983 Mrtals chip removing process RESTS, CENTRING ELEMENTS CLAMPINGS Symbolization

International Electrotechnical Commission (IEC)

IEC 62317-5:2015 Ferrite cores - Dimensions - Part 5: EP-cores and associated parts for use in inductors and transformers

KR-KS

KS C IEC 62317-5-2019 Ferrite cores — Dimensions — Part 5: EP-cores and associated parts for use in inductors and transformers

Korean Agency for Technology and Standards (KATS)

KS C IEC 62317-5:2019 Ferrite cores — Dimensions — Part 5: EP-cores and associated parts for use in inductors and transformers

Association Francaise de Normalisation

NF C93-404:1988 Electronic components. Chip carrier.

GSO

OS GSO IEC/TR 62258-4:2014 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
BH GSO IEC/TR 62258-4:2016 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

(U.S.) Ford Automotive Standards

FORD WSS-M8G252-A2-1995 GASKET, STEEL CORE, FPM

European Committee for Electrotechnical Standardization（CENELEC）

CLC/TR 62258-4-2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers