Semiconductor devices. Micromechanical devices. Part 7:

Semiconductor devices. Micromechanical devices. Part 7:, Total:204 items.

The international standard classification for "Semiconductor devices. Micromechanical devices. Part 7:" includes: Integrated circuits. Microelectronics , Other semiconductor devices , Semiconductor devices in general , Transistors .

The Chinese standard classification for "Semiconductor devices. Micromechanical devices. Part 7:" includes: Semiconductor discrete devices in general , Microcircuit in general .

未注明发布机构

DIN EN 62047-19 E:2011-11 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
DIN EN 62047-1 E:2014-05 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
DIN EN 62047-18 E:2011-06 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 42709.19-2023 Semiconductor devices―Micro-electromechanical devices―Part 19:Electronic compasses
GB/T 20516-2006 Semiconductor devices - Discrete devices - Part 4: Microwave devices
GB/T 4587-2023 Semiconductor devices—Discrete devices—Part 7:Bipolar transistors
GB/T 42709.5-2023 Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches
GB/T 32817-2016 Semiconductor devices - Micro-electromechanical devices - Generic specification for MEMS

International Electrotechnical Commission (IEC)

IEC 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
IEC 62435-7:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
IEC 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
IEC 62047-5:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches; Corrigendum 1
IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
IEC 62047-4:2008 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specifications for MEMS
IEC 62047-40:2021 Semiconductor devices - Micro-electromechanical devices - Part 40: Test methods of micro-electromechanical inertial shock switch threshold
IEC 62047-1:2005 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 60747-16-7:2022 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators
IEC 62047-35:2019 Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
IEC 60747-7:2000 Semiconductor devices - Part 7: Bipolar transistors
IEC 62047-33:2019 Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
IEC 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
IEC 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
IEC 62047-11:2013 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
IEC 62047-10:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials; Corrigendum 1
IEC 62047-41:2021 Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
IEC 60747-16-3:2002/AMD1:2009 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters; Amendment 1
IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 60747-4:2007/AMD1:2017 Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
IEC 60747-4:2001 Semiconductor devices - Discrete devices - Part 4: Microwave devices
IEC 60747-7:1988 Semiconductor discrete devices and integrated circuits; part 7: bipolar transistors
IEC 60747-4:2007 Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
IEC 60747-7:2010+AMD1:2019 CSV Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
IEC 60747-7:2010/AMD1:2019 Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
IEC 60747-7:2010 Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
IEC 60747-7:2019 Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
IEC 62047-6:2009 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
IEC 60747-5-5:2007 Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
IEC 62047-9:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Japanese Industrial Standards Committee (JISC)

JIS C 5630-20:2015 Semiconductor devices -- Micro-electromechanical devices -- Part 20: Gyroscopes
JIS C 5630-19:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 19: Electronic compasses
JIS C 5630-1:2017 Semiconductor devices -- Micro-electromechanical devices -- Part 1: Terms and definitions
JIS C 5630-1:2008 Semiconductor devices -- Micro-electromechanical devices -- Part 1: Terms and definitions
JIS C 5630-18:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials
JIS C 5630-6:2011 Semiconductor devices -- Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials

Association Francaise de Normalisation

NF C96-050-20*NF EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20 : gyroscopes
NF C96-050-19*NF EN 62047-19:2014 Semiconductor devices - Micro-electromechanical devices - Part 19 : electronic compasses
NF C96-050-5*NF EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5 : RF MEMS switches.
NF EN IEC 62435-7:2021 Electronic components - Long-term storage of semiconductor electronic devices - Part 7: microelectromechanical devices
NF C96-050-4*NF EN 62047-4:2011 Semiconductor devices - Micro-electromechanical devices - Part 4 : generic specifications for MEMS.
NF C96-435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7 : micro-electromechanical devices
NF C96-050-1*NF EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
NF C96-050-1:2006 Semiconductor devices - Micro- electromechanical devices - Part 1 : terms and definitions.
NF EN IEC 60747-16-7:2023 Dispositifs à semiconducteurs - Partie 16-7 : circuits intégrés hyperfréquences - Atténuateurs
NF EN 62047-19:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 19 : compas électroniques
NF EN 62047-20:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 20 : gyroscopes
NF EN 62047-5:2012 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 5 : commutateurs MEMS-RF
NF C96-050-9*NF EN 62047-9:2012 Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS.
NF C96-050-18*NF EN 62047-18:2014 Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials
NF C96-050-22*NF EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates
NF EN 62047-12:2012 Semiconductor devices - Microelectromechanical devices - Part 12: method of testing bending fatigue of thin-film materials using resonance vibrations of microelectromechanical system structures (M...
NF C96-050-7*NF EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7 : MEMS BAW filter and duplexer for radio frequency control and selection
NF EN 62047-4:2011 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 4 : spécification générique pour les MEMS
NF C96-016-1*NF EN 60747-16-1:2003 Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
NF EN 62047-1:2016 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 1 : termes et définitions
NF C96-050-26*NF EN 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures
NF C96-016-3*NF EN 60747-16-3:2003 Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters.
NF C96-050-21*NF EN 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21 : test method for Poisson's ratio of thin film MEMS materials
NF C96-050-11*NF EN 62047-11:2014 Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
NF C96-016-3/A1*NF EN 60747-16-3/A1:2013 Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
NF C96-050-2*NF EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2 : tensile testing methods of thin film materials.
NF C96-050-10*NF EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
NF C96-016-4/A1*NF EN 60747-16-4/A1:2012 Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
NF C96-050-6*NF EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials
NF EN 62047-7:2011 Semiconductor devices - Microelectromechanical devices - Part 7: BAW MEMS filter and duplexer for radio frequency control and selection
NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices

British Standards Institution (BSI)

BS EN 62047-20:2014 Semiconductor devices. Micro-electromechanical devices. Gyroscopes
BS EN 62047-19:2013 Semiconductor devices. Micro-electromechanical devices. Electronic compasses
BS EN 62047-5:2011 Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
23/30481371 DC BS EN IEC 62047-4 Semiconductor devices. Micro-electromechanical devices. Part 4. Generic specification for MEMS
BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
BS EN 62047-5:2011(2012) Semiconductor devices — Micro - electromechanical devices Part 5 : RF MEMS switches
20/30404574 DC BS EN IEC 62047-41. Semiconductor devices. Micro-electromechanical devices. Part 41. RF MEMS Circulators and Isolators
20/30414411 DC BS EN 60747-16-7. Semiconductor devices. Part 16-7. Microwave integrated circuits. Attenuators
BS EN 62047-4:2010 Semiconductor devices. Micro-electromechanical devices. Generic specification for MEMS
BS EN 62047-1:2006 Semiconductor devices - Micro-electromechanical devices - Terms and definitions
BS EN 62047-1:2016 Semiconductor devices. Micro-electromechanical devices. Terms and definitions
20/30431959 DC BS EN IEC 60747-16-7. Semiconductor devices. Part 16-7. Microwave integrated circuits. Attenuators
20/30405217 DC BS EN IEC 62047-40. Semiconductor devices. Micro-electromechanical devices. Part 40. Test methods of Micro-electromechanical inertial shock switch threshold
BS EN 60747-16-4:2004+A1:2011 Semiconductor devices. Microwave integrated circuits. Switches
BS EN 60747-16-5:2013 Semiconductor devices. Microwave integrated circuits. Oscillators
BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
13/30264596 DC BS EN 60747-14-7. Semiconductor devices. Part 14-7. Semiconductor sensor. Flow meter
BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
19/30364443 DC BS EN IEC 62047-35. Semiconductor devices. Micro-electromechanical devices. Part 35. Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices
BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
BS EN 62047-26:2016 Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
BS EN 62047-11:2013 Semiconductor devices. Micro-electromechanical devices. Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
21/30432242 DC BS IEC 62047-42. Semiconductor devices. Micro-electromechanical devices. Part 42. Measurement methods of electromechanical conversion characteristics of piezoelectric MEMS cantilever

Danish Standards Foundation

DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
DS/EN 62047-1:2006 Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and definitions
DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
DS/IEC 747-7:1990 International Electrotechnical Commission IEC Publication No. 747-7:1988 Semiconductor devices - Discrete devices -Part 7: Bipolar transistors
DS/IEC 747-1:1993 Semiconductor devices. Discrete devices and integrated circuits. Part 1: General

ES-UNE

UNE-EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 60747-16-7:2023 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (Endorsed by Asociación Española de Normalización in February of 2023.)
UNE-EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (Endorsed by AENOR in November of 2014.)
UNE-EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (Endorsed by AENOR in November of 2013.)
UNE-EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (Endorsed by AENOR in November of 2011.)
UNE-EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (Endorsed by AENOR in February of 2011.)
UNE-EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)
UNE-EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)
UNE-EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (Endorsed by AENOR in November of 2011.)

SCC

DANSK DS/EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices – Part 7: Micro-electromechanical devices
CEI EN IEC 62435-7:2021 Electronic components – Long-term storage of electronic semiconductor devices Part 7: Micro-electromechanical devices
DIN EN IEC 62435-7:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020); German version EN IEC 62435-7:2021
DANSK DS/EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
DANSK DS/EN IEC 60747-16-7:2023 Semiconductor devices – Part 16-7: Microwave integrated circuits – Attenuators
CEI EN IEC 60747-16-7:2023 Semiconductor devices Part 16-7: Microwave integrated circuits - Attenuators
DANSK DS/EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
CEI EN 62047-19:2014 Semiconductor devices - Micro-electromechanical devices Part 19: Electronic compasses
CEI EN 62047-20:2016 Semiconductor devices - Micro-electromechanical devices Part 20: Gyroscopes
08/30172394 DC BS EN 62047-7. Semiconductor devices. Micro-electromechanical devices. P art 7. MEMS FBAR Filter & Duplexer
CEI EN 62047-5:2015 Semiconductor devices - Micro-electromechanical devices Part 5: RF MEMS switches
DANSK DS/EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
DANSK DS/EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
DIN EN IEC 60747-16-7:2024 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022); German version EN IEC 60747-16-7:2023
CEI EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
CEI EN 62047-4:2011 Semiconductor devices - Micro-electromechanical devices Part 4: Generic specification for MEMS
DANSK DS/EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
DANSK DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
CEI EN 62047-10:2012 Semiconductor devices - Microelectromechanical devices Part 10: Micro-pillar compression test for MEMS materials
DIN IEC 62047-7 E:2008 Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS FBAR Filter & Duplexer (IEC 47/1969/CD:2008)
IEC 60747-4:1991+AMD1:1993+AMD2:1999 CSV Semiconductor devices - Discrete devices - Part 4: Microwave devices
DANSK DS/EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
07/30164950 DC IEC 60747-7. Semiconductor devices. Discrete devices. Part 7. Bipolar transistors (BTRs)
IEC 60117-7:1971 Recommended graphical symbols - Part 7: Semiconductor devices, capacitors
IEC 60117-7:1966 Recommended graphical symbols - Part 7: Semiconductor devices, capacitors
DIN EN 62047-19 E:2011 Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 47F/88/CD:2011)

PH-BPS

PNS IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
PNS IEC 62047-28:2021 Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

PL-PKN

PN-EN IEC 62435-7-2021-08 E Electronic components -- Long-term storage of electronic semiconductor devices -- Part 7: Micro-electromechanical devices (IEC 62435-7:2020)

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

Lithuanian Standards Office

LST EN IEC 62435-7:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices (IEC 62435-7:2020)
LST EN 62047-7-2011 Semiconductor devices - Micro-electromechanical devices -- Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011)
LST EN 62047-4-2011 Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (IEC 62047-4:2008)

KR-KS

KS C IEC 62047-22-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 60747-7-2017 Semiconductor devices－Discrete devices－Part 7：Bipolar transistors
KS C IEC 60747-7-2022 Semiconductor devices — Discrete devices — Part 7: Bipolar transistors

GSO

GSO IEC 62047-19:2021 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
BH GSO IEC 62047-19:2022 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
GSO IEC 62047-20:2021 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
BH GSO IEC 62047-20:2022 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
GSO IEC 62047-5:2014 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
OS GSO IEC 62047-5:2014 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
BH GSO IEC 62047-5:2016 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
GSO IEC 62047-4:2013 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
GSO IEC 62047-1:2014 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
BH GSO IEC 62047-4:2016 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
OS GSO IEC 62047-4:2013 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
OS GSO IEC 62047-1:2014 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
GSO IEC 62047-7:2014 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
OS GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
BH GSO IEC 62047-10:2016 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
GSO IEC 62047-41:2023 Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
BH GSO IEC 62047-41:2023 Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
BH GSO IEC 62047-40:2023 Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
GSO IEC 62047-40:2023 Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
BH GSO IEC 60747-7:2016 Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
OS GSO IEC 62047-7:2014 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
BH GSO IEC 62047-7:2016 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
GSO IEC 62047-9:2014 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

German Institute for Standardization

DIN EN 62047-19:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
DIN EN 62047-5:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
DIN EN IEC 60747-16-7:2024-04 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022); German version EN IEC 60747-16-7:2023
DIN EN 62047-1:2016-12 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016 / Note: DIN EN 62047-1 (2006-10) remains valid alongside this standard until 2019-02-10.
DIN EN 62047-4:2011-03 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
DIN EN 62047-1:2006 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2005); German version EN 62047-1:2006
DIN EN 62047-10:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-20:2015-04 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
DIN EN 62047-19:2014 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
DIN EN IEC 60747-16-7:2021-07 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 47E/734/CD:2020); Text in English / Note: Date of issue 2021-06-04
DIN EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
DIN EN 62047-7:2012-02 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011

IEC - International Electrotechnical Commission

IEC 62047-19:2013 Dispositifs à semiconducteurs – Dispositifs microélectromécaniques – Partie 19: Compas électroniques (Edition 1.0)
IEC 62047-10:2011 Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials (Edition 1.0)
IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)

Korean Agency for Technology and Standards (KATS)

KS C IEC 62047-7-2015(2020) SEMICONDUCTOR DEVICES ― MICRO-ELECTROMECHANICAL DEVICES ― Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
KS C IEC 60747-7:2017 Semiconductor devices－Discrete devices－Part 7：Bipolar transistors
KS C IEC 60747-7:2006 Semiconductor devices－Discrete devices－Part 7：Bipolar transistors
KS C IEC 60747-7:2022 Semiconductor devices — Discrete devices — Part 7: Bipolar transistors
KS C IEC 62047-7:2015 SEMICONDUCTOR DEVICES ― MICRO-ELECTROMECHANICAL DEVICES ― Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
KS C IEC 62047-7-2020 SEMICONDUCTOR DEVICES ― MICRO-ELECTROMECHANICAL DEVICES ― Part 7: MEMS BAW filter and duplexer for radio frequency control and selection

IN-BIS

IS 1885 Pt.7/Sec.6-1984 Electrical Vocabulary Part 7 Semiconductor Devices Section 6: Optoelectronic Devices

RO-ASRO

STAS SR CEI 747-4-1995 Semiconductor devices Discrete devices Part 4: Microwave diodes and transistors

TH-TISI

TIS 1864-2009 Semiconductor devices.part 7: bipolar transistors

Others: Semiconductor devices. Micromechanical devices. Part 7: