chip strength

chip strength, Total:18 items.

The international standard classification for "chip strength" includes: Semiconductor devices in general , Other materials for the reinforcement of composites .

The Chinese standard classification for "chip strength" includes: Semiconductor discrete devices in general , Fibre reinforced composites .

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国家市场监督管理总局、中国国家标准化管理委员会

• GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength

Professional Standard - Electron

• SJ/T 11486-2015 Technical specification for low power light. emitting diode chips

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

• GB/T 31294-2014 The core to wind turbine blade―Test method for facing cleavage of sandwich panels

Fujian Provincial Standard of the People's Republic of China

• DB35/T 1193-2011 Semiconductor LED chip

German Institute for Standardization

• DIN EN 60749-19:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 / Note: DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.

AENOR

• UNE-EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
• UNE-EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

Danish Standards Foundation

• DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

SCC

• DANSK DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• CEI EN 60749-19/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• DANSK DS/EN 60749-19/A1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• DIN EN 60749-19/A1 E:2009 Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009

IEC - International Electrotechnical Commission

• IEC 60749-19:2003 Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength (Edition 1.0)

Lithuanian Standards Office

• LST EN 60749-19+AC-2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2002)
• LST EN 60749-19+AC-2003/A1-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2003/A1:2010)

DIN

• DIN EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003); German version EN 60749-19:2003 + Corrigendum 2003-06

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

• IPC TM-650 2.4.42-1988 Torsional Strength of Chip Adhesives

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