Lao chips

Lao chips, Total:85 items.

The international standard classification for "Lao chips" includes: Motion picture films. Cartridges , Tea , Laboratory medicine .

The Chinese standard classification for "Lao chips" includes: Photosensitive material , Tea products , Daily-use hardware , Medical apparatus and devices in general .

Group Standards of the People's Republic of China

T/QDCYH 004-2020 Laoshan dark tea
T/QLCWY 001.1-2020 LaoshanConfucian tea Part I: Product requirements
T/QDAS 073-2021 Tea tasting - Laoshan Jasmine tea
T/QDLSTI 001-2021 Laoshan White tea storage specification
T/QDLSTI 002-2022 Tea Tasting Laoshan Longxu
T/QDCYH 015-2022 Laoshan Longzhu Storage Specification
T/SBX 021-2019 Operation rules for automatic scribing and splitting of laser chips
T/QDCYH 010-2022 Tea tasting - Laoshan Longxu
T/QDCYH 003-2020 Laoshan oolong tea
T/CTSS 69-2023 Technical specification for brewing of Laoshan black tea
T/QDCYH 012-2022 Tea tasting - Laoshan JinLuo
T/CTSS 68-2023 Technical specification for brewing of Laoshan green tea
T/QDCYH 009-2022 Laoshan Jinluo
T/QDCYH 019-2024 Laoshan Fengyu black tea
T/QDAS 029-2019 Laoshan white tea
T/QDCYH 002-2020 Laoshan yellow tea
T/QDTS 002-2021 Laoshan Jasmine White Tea
T/QDTS 004.2-2024 Laoshan Green Snail Tea Part 2: Processing Technical Regulations
T/QDCYH 008-2022 Laoshan Longzhu
T/QDCYH 014-2022 Laoshan Longxu Storage Specification
T/SDAS 513-2022 Laoshan Black Tea Laoshan Fengyu Processing Technical Regulations
T/QDLSTI 003-2022 Tea Tasting Laoshan Yellow Tea
T/SDAS 517-2022 Technical specifications for the construction of Laoshan tea ecological tea garden
T/QDCYH 011-2022 Tea tasting - Laoshan Longzhu
T/QDCYH 016-2022 Laoshan Jinluo Storage Specification
T/QDCYH 007-2022 Laoshan Longxu
T/QDTS 003-2022 Tea Tasting Laoshan Dark Tea

Shandong Provincial Standard of the People's Republic of China

DB37/T 589-2005 Laoshan Dairy Goat Feeding and Management Technical Specifications
DB37/T 071-1984 Laoshan Milk Goat
DB37/T 071-2020 Technical specifications for breeding and feeding of Laoshan dairy goats

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 6848-1986 Dimensions of the cores for motion-picture film rolls
GB/T 26530-2011 Product of geographical indication—Laoshan green tea

Professional Standard - Medicine

YY/T 1152-2009 Aldehyde slide for biochips

Professional Standard - Light Industry

QB/T 2475-2000 Blade Cored Door Lock

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

GB/T 33752-2017 Aldehyde slide for microarrays

未注明发布机构

JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

IPC - Association Connecting Electronics Industries

IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
IPC/EIA J-STD-028 CD-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC/EIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Indonesia Standards

SNI 01-4306-1996 Sweet potatoes chips
SNI 01-4304-1996 Pineapples chips

SCC

MIL MIL-PRF-83446/32A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/21A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/32-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
MIL MIL-PRF-83446/28-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/23A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
MIL MIL-PRF-83446/33A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/30A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/30-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/22A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE

Defense Logistics Agency

DLA MIL-PRF-83446/21 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/24 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/20 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/23 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/25 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/30 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/22 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core

CENELEC - European Committee for Electrotechnical Standardization

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC SMC-WP-003-1993 Chip Mounting Technology (CMT)
IPC J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028

HU-MSZT

MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Danish Standards Foundation

DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die

German Institute for Standardization

DIN 15531:1976 Cores for motion-picture and magnetic film

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD22-B109-2002 Flip Chip Tensile Pull
JEDEC JESD22-B109B-2014 Flip Chip Tensile Pull
JEDEC JESD22-B109A-2009 Flip Chip Tensile Pull

IEC - International Electrotechnical Commission

PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

American National Standards Institute （ANSI)

ANSI/VITA 41.1-2006 VXS 4X InfiniBand Protocol

TIA - Telecommunications Industry Association

J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)

U.S. Air Force

AIR FORCE MS27550-1967 STANDARD DATA BASE CHIP

CZ-CSN

CSN 67 3219-1983 Oil varnísh for chips O 1109

British Standards Institution (BSI)

BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers

International Organization for Standardization (ISO)

ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions