Plastic packaged device
Plastic packaged device, Total:18 items.
The international standard classification for "Plastic packaged device" includes: Semiconductor devices in general , Semiconductor devices , Moulding equipment , Electronic components in general .
The Chinese standard classification for "Plastic packaged device" includes: Semiconductor discrete devices in general , Electrical insulating material and its products .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 4937.26-2023 Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM）
- GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
- GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）
- GB/T 14663-1993 Specification of plastic packaging mould
- GB/T 4937.2-2006 Semiconductor devices - Mechanical and climatic test methods - Part 2 : Low air pressure
- GB/T 42706.2-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 2：Deterioration mechanisms
- GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling
- GB/T 4937.3-2012 Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination
- GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）
- GB/T 4937.1-2006 Semiconductor devices - Mechanical and climatic test methods - Part 1 : General
- GB/T 4937.4-2012 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- IPC TM-650 2.6.22-1995 Acoustic Microscopy for Plastic Encapsulated Electronic Components
British Standards Institution (BSI)
- BS EN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components
- BS EN 60749-32:2003 Semiconductor devices - Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (externally induced)
- BS EN 60749-31:2003 Semiconductor devices - Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced)
- BS EN 60749-32:2003+A1:2010 Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (externally induced)
German Institute for Standardization
- DIN EN 60749-32:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 60749-32:2002 + Cor. :2003 + A1:2010); German version EN 60749-32:2003 + Cor. :2003 + A1:2010 / Note: DIN EN ...
- DIN EN 60749-31:2003-12 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003 / Note: Under certain conditions, DIN EN 60749...
thin film device,Fiber optic device,Device profile,RF device,Device Oxidation,magnetic field device,Integrated device,laser device,gas device,logic device,Spectral device,optical instrument,Acoustic device,plastic mold,plastic packaging,Plastic compound,epoxy molding compound,Plastic packaged device,Plastic parts
