Silicon wafer multi-wire cutting
Silicon wafer multi-wire cutting, Total:29 items.
The international standard classification for "Silicon wafer multi-wire cutting" includes: Semiconducting materials , Testing of metals .
The Chinese standard classification for "Silicon wafer multi-wire cutting" includes: Elemental semiconductor material , Semimetal and semiconductor material in general , Semimetal , Compound semiconductor material , Metal physical property test method .
Group Standards of the People's Republic of China
- T/SBX 073-2023 Multi-wire cutting machine safety operating procedures
- T/CMES 41001-2025 Stone Machinery Multi-wire Saw
- T/CPIA 0057-2024 Technical requirements for photovoltaic silicon wafer multi-wire cutting machines
- T/CPIA 0038-2022 Electroplated diamond wire for photovoltaic silicon wafer cutting
- T/CNIA 0174-2022 Silicon wafer cutting waste recycling silicon
- T/ZZB 0594-2018 Electroplated diamond wire for silicon chips
- T/SBX 072-2023 Multi-wire cutting machine for rare earth materials
- T/QGCML 3974-2024 Silicon wafer cutting fluid
- T/CIET 942-2024 Photovoltaic Diamond Wire Multicutter
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 12965-1996 Monocrystalline silicon as cut slices and lapped slices
- GB/T 11072-1989 Indium antimonide polycrystal, single crystals and as-cut slices
- GB/T 29508-2013 300 mm monocrystalline silicon as cut slices and grinded slices
- GB/T 11072-2009 Indium antimonide polycrystal,single crystals and as-cut slices
- GB/T 26071-2010 Mono-crystalline silicon as cut slices for photovoltaic solar cells
- GB/T 30860-2014 Test methods for surface roughness and saw mark of silicon wafers for solar cells
- GB/T 12965-2005 Monocrystalline silicon as cut slices and lapped slices
- GB/T 12965-2018 Monocrystalline silicon as cut wafers and lapped wafers
Professional Standard - Ferrous Metallurgy
- YB 1603-1983 Monocrystalline silicon as cut slices and lapped slices
- YB 1603-83 Silicon single crystal cutting discs and grinding discs
- YB/T 4397-2014 Brass plating steel sawing wire for sillcon chip
Hebei Provincial Standard of the People's Republic of China
- DB13/T 2002-2014 Multi-wire cutting machine
Professional Standard - Chemical Industry
- HG/T 5962-2021 Treatment and disposal method for waste liquid of silicon cutting
Professional Standard - Electron
- SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
Korean Agency for Technology and Standards (KATS)
- KS D 0262-2002 Visual inspection for sliced and lapped silicon wafers
Ente Nazionale Italiano di Unificazione
- UNI 8284:1981 Fishing nets. Cutting netting to shape. Determination of the cutting rate.
- UNI 4649:1961 Multiple thread cutters. Whitworth and gas thread cutting.
National Standardisation Body (ASRO)
- STAS 6767-1984 Agricultural harvesters COUNTERKNIFE SECTIONS FOR CUTTER BARS
Instituto Colombiano de Normas Técnicas y Certificación
- ICONTEC 1492-1979 Combine harvester: cutting iron rods and cutting blades
German Institute for Standardization
- DIN V VDE V 0126-18-3:2007-06 Solar wafers - Part 3: Alkaline corrosion damage of crystalline silicon wafers - Method of determining the corrosion rate of mono and multi crystalline silicon wafers (as cut)
