GB/T 29508-2013 in English

VALID

300 mm monocrystalline silicon as cut slices and grinded slices

Issued on:2013-05-09
Implemented on:2014-02-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $140.00
$136.00

Standard No:	GB/T 29508-2013
Document status:	VALID
Title in English:	300 mm monocrystalline silicon as cut slices and grinded slices
Title in Chinese:	300mm 硅单晶切割片和磨削片
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2013-05-09
Implemented on:	2014-02-01
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H82-Elemental semiconductor material
Professional Classification:	GB-National Standard
Related Keywords:	silicon wafers circular silicon wafers silicon single crystal cutting mm monocrystalline silicon cut slices
Related Topics:	standard silicon wafer fabric slice Detection of single crystal silicon Single crystal silicon inspection slice box Slicing Freehand Slicing Single crystal silicon peak Wafer cutting machine micro cutting disc Wafer cutting machine Three-chip board machine How to detect single crystal silicon three chips Wafer CNC Cutting Wafer CNC Cutting Wafer analysis Wafer analysis ptt slice slicing Mill-like twins semi-thin sliced slices capacitor slice cutting piece Wave Plate Cutting Small cutting discs Silicon Single Wafer Orienter capacitor slice single chain single crystal crystal cutting platelet cluster Single crystal silicon target pole piece cutting GBT29508 GB/T 29508-2013 Crystal silicon cutting fluid FIB slicer leica3050s slicer disco wafer cutting machine Cutting machine cutting disc parameters Cut slice execution Silicon wafer multi-wire cutting Silicon wafer cutting fluid products Electronic silicon single crystal Monocrystalline Silicon International Single crystal silicon seed crystal standard project establishment Monocrystalline silicon quality Monocrystalline silicon Japan Single wafer preparation method slicer place Pathology microtome

《GB/T 29508-2013300mm 硅单晶切割片和磨削片》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。

Scope

This standard specifies the terms, definitions and technical requirements for silicon single crystal cutting and grinding wafers (referred to as silicon wafers) with a diameter of 300 mm, p-type, <100> crystal orientation, and a resistivity of 0.5Ω·cm~20Ω·cm. , test methods, inspection rules and signs, packaging, transportation, storage, etc. This standard is applicable to circular silicon wafers prepared by cutting and grinding Czochralski single crystals with a diameter of 300 mm. The products will be further processed into polished wafers for the production of substrate wafers for integrated circuit ICs with a line width of 90 nm.

More samples: QC/T 942-2021 JC/T 2453-2018 DL/T 5154-2012

Sample only — not a preview of GB/T 29508-2013

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