Sign In |Help & Support
ALL SECTORS
  • ALL SECTORS
  • GB(National Standard)
  • CB(Shipping)
  • CECS(Engineering Construction)
  • CJ(Urban Construction)
  • CY(News and Publication)
  • DB(Provincial Standard)
  • DL(Electricity & Power)
  • DZ(Geology & Mineralogy)
  • FZ(Spinning & Textile)
  • GA(Public Security)
  • HB(Aviation)
  • HG(Chemical Industry)
  • HJ(Environmental Protection)
  • JB(Machinery)
  • JC(Building Materials)
  • JG(Building & Construction)
  • JJ(Metering)
  • JT(Highway & Transportation)
  • LY(Forestry)
  • MT(Coal)
  • NB(Energy)
  • NY(Agriculture)
  • QB(Light Industry)
  • QC(Automobile & Vehicle)
  • QJ(Aerospace)
  • SH(Petrochemical)
  • SJ(Electronics)
  • SL(Water Resources)
  • SN(Commodity Inspection)
  • SY(Oil & Gas)
  • TB(Railway & Train)
  • YB(Ferrous Metallurgy)
  • YC(Tobacco)
  • YD(Telecommunication)
  • YY(Medical Device)
Database: 365,228(8 Aug 2026)

Wafer CNC Cutting

Wafer CNC Cutting, Total:54 items.

The international standard classification for "Wafer CNC Cutting" includes: Semiconducting materials , Powder metallurgy , Forging equipment. Presses. Shears , Welding equipment .

The Chinese standard classification for "Wafer CNC Cutting" includes: Dedicated processing equipment , Elemental semiconductor material , Compound semiconductor material , Semimetal , Semimetal and semiconductor material in general , Metal forming machinery , Welding and cutting equipment .


Professional Standard - Electron

  • SJ/T 31092-1994 Requirements of Readiness and Methods of Inspection and Assessment for NC Wafer Cutting (Scribing) Machines

Professional Standard - Ferrous Metallurgy

  • YB 1603-1983 Monocrystalline silicon as cut slices and lapped slices

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 12965-2005 Monocrystalline silicon as cut slices and lapped slices
  • GB/T 11094-1989 Boat-grown gallium arsenide single crystals and As-cut slices
  • GB/T 12965-1996 Monocrystalline silicon as cut slices and lapped slices
  • GB/T 11072-2009 Indium antimonide polycrystal,single crystals and as-cut slices
  • GB/T 11093-2007 Liquid encapsulated czochralski-grown gallium arsenide single crystals and as-cut slices
  • GB/T 34380-2017 CNC laser cutting machine
  • GB/T 11093-1989 Liquid encapaulated czochralski-grouwn gallium arsenide single crystals and As-cut slices
  • GB/T 39745-2021 CNC punching and laser cutting composite machines
  • GB/T 11094-2020 Gallium arsenide single crystal and cutting wafer grown by horizontal bridgman method
  • GB/T 26071-2010 Mono-crystalline silicon as cut slices for photovoltaic solar cells
  • GB/T 11072-1989 Indium antimonide polycrystal, single crystals and as-cut slices
  • GB/T 12965-2018 Monocrystalline silicon as cut wafers and lapped wafers
  • GB/T 11094-2007 Horizontal bridgman grown gallium arsenide single crystal and cutting wafer
  • GB/T 29508-2013 300 mm monocrystalline silicon as cut slices and grinded slices

Group Standards of the People's Republic of China

Professional Standard - Machinery

  • JB/T 3720-1993 Parameters of Guide Wheel of CNC Wire Cutting Machine

UNKNOWN

  • YB 1603-83 Silicon single crystal cutting discs and grinding discs

German Institute for Standardization

  • DIN V VDE V 0126-18-3:2007-06 Solar wafers - Part 3: Alkaline corrosion damage of crystalline silicon wafers - Method of determining the corrosion rate of mono and multi crystalline silicon wafers (as cut)

TR-TSE

  • TS 2497-1977 COMBINE HARVESTERS — WIDTH OF CUT AND NUMBER OF KNIFE

Spanish Association for Standardization (UNE)

CO-ICONTEC

Ente Nazionale Italiano di Unificazione

  • UNI 8284:1981 Fishing nets. Cutting netting to shape. Determination of the cutting rate.

RO-ASRO

  • STAS 6767-1984 Agricultural harvesters COUNTERKNIFE SECTIONS FOR CUTTER BARS

JP-WES

  • WES 6601-2006 Accuracy Inspection for Numerically Controlled Cutting Machine

CZ-CSN

Magyar Szabványügyi Testület