GB/T 12965-2005 in English

《GB/T 12965-2005硅单晶切割片和研磨片》由610（中国有色金属工业协会）归口，主管部门为中国有色金属工业协会。
本标准规定了硅单晶切割片和研磨石的产品分类、术语、技术要求、试验方法、检验规则以及标志、包装、运输、贮存等。本标准适用于由直接、悬浮区熔和中子嬗变掺杂硅单晶经切割、双面研磨制备的圆形硅片。产品主要用于制作晶体管、整流器件等半导体器件，或进一步加工成抛光片。

Scope

This standard specifies the product classification, terminology, technical requirements, test methods, inspection rules, signs, packaging, transportation, storage, etc. of silicon single crystal cutting and grinding wafers (silicon wafers for short). This standard applies to circular silicon wafers prepared by cutting and double-sided grinding from Czochralski, suspension zone melting and neutron transmutation doped silicon single crystals. The products are mainly used to make semiconductor devices such as transistors and rectifier devices, or to be further processed into polished wafers.