super chip
super chip, Total:41 items.
The international standard classification for "super chip" includes: Semiconducting materials , Rectifiers. Convertors. Stabilized power supply , Other non-ferrous metals and their alloys , Insulating gases .
The Chinese standard classification for "super chip" includes: Semimetal and semiconductor material in general , Elemental semiconductor material , Power semiconductor device and parts , Rare scattered metals and their alloys , Semimetal , Compound semiconductor material , Dedicated processing equipment , Technical Management .
Hebei Provincial Standard of the People's Republic of China
- DB13/T 1633-2012 Solar Grade Polysilicon Wafer
- DB13/T 1828-2013 Solar grade monocrystalline silicon wafer
- DB13/T 1314-2010 Solar grade monocrystalline silicon square rod, monocrystalline silicon wafer
Professional Standard - Labor and Labor Safety
- LD/T 94-1996 Honeycomb type overpressure rupture disc equipment for crystal kettle
Group Standards of the People's Republic of China
- T/SZBX 018-2021 Products of Wafer Level Chip Scale Package
- T/GDBCA 001-2021 Ultra-nanocrystals and kits
- T/JSSIA 0003-2017 Series Programs for Wafer Level Chip Scale Package
- T/ZZB 2283-2021 Ultra-high purity graphite powder for semiconductor silicon carbide crystal
- T/JSSIA 0004-2017 Outline Dimensions of Wafer Level Chip Scale Package
- T/CECA 48-2021 Quartz Crystal Microbalance Element
- T/ZZB 0497-2018 Single crystal wafers for surface acoustic wave device applications
劳动部
- LD/T 0094-1996 Screw plug type ultra-high pressure bursting disc device for crystal kettle
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 12964-2018 Monocrystalline silicon polished wafers
- GB/T 12965-2018 Monocrystalline silicon as cut wafers and lapped wafers
- GB/T 26069-2022 Annealed monocrystalline silicon wafers
- GB/T 5238-2019 Monocrystalline germanium and monocrystalline germanium slices
- GB/T 37051-2018 Test method for determination of crystal defect density in PV silicon ingot and wafer
Military Standard of the People's Republic of China-General Armament Department
- GJB 2918A-2017 Specification for polished wafers of molten silicon single crystal in detector grade high resistance zone
- GJB 2918-1997 Specification for detector grade high resistance zone fused silicon monoliths
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 5238-2009(英文版) Monocrystalline germanium and monocrystalline germanium slices
- GB/T 11072-1989 Indium antimonide polycrystal, single crystals and as-cut slices
- GB/T 5238-2009e Monocrystalline germanium and monocrystalline germanium slices
- GB/T 11072-2009 Indium antimonide polycrystal,single crystals and as-cut slices
- GB/T 13840-1992 Wafer carriers
- GB/T 12965-1996 Monocrystalline silicon as cut slices and lapped slices
- GB/T 5238-2009 Monocrystalline germanium and monocrystalline germanium slices
- GB/T 15713-1995 Monocrystalline germanium slices
- GB/T 32516-2016 Thyristor valves of multistage controlled shunt reactors in extra high-voltage transmission systems
- GB/T 12965-2005 Monocrystalline silicon as cut slices and lapped slices
Yunnan Provincial Standard of the People's Republic of China
- DB53/T 419-2012 Ultrasonic testing rules for in-use ultra-high pressure crystal kettles
Professional Standard - Electron
- SJ 3118-1988 Wafer holder
Inner Mongolia Provincial Standard of the People's Republic of China
- DB15/T 1100-2017 Super (ultra-fine and extra-long) goat cashmere
未注明发布机构
- SEMI M55-0308-2008 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON CARBIDE WAFERS
Professional Standard - Ferrous Metallurgy
- YB 1603-1983 Monocrystalline silicon as cut slices and lapped slices
Professional Standard - Machinery
- JB/T 11375-2013 Ultra-micro Crystal Projection Screen
Korean Agency for Technology and Standards (KATS)
- KS D 3532-2002(2017) Corrosion－resisting and heat－resisting superalloy plates and sheets
International Electrotechnical Commission (IEC)
- IEC PAS 62084:1998 Implementation of Flip Chip and Chip Scale technology
Defense Logistics Agency
- DLA DSCC-DWG-07016-2007 CAPACITOR, FIXED, TANTALUM CHIP, WEIBULL GRADED, LOW ESR
- DLA SMD-5962-07218 REV A-2008 MICROCIRCUIT, LINEAR, RADIATION HARDENED, ULTRA HIGH FREQUENCY, NPN-PNP COMBINATION TRANSISTOR ARRAY, MONOLITHIC SILICON
UNKNOWN
- YB 1603-83 Silicon single crystal cutting discs and grinding discs
International Organization for Standardization (ISO)
- ISO 22278:2020 Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for crystalline quality of single-crystal thin film (wafer) using XRD method with parallel X-ray beam
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