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Database: 365,228(8 Aug 2026)
crystal defect density test method determination method crystal defect density precision requirements repeatability deviation international alignment main innovations test method chemical polishing photographic chemical cd-4 dispersive x-ray fluorescence spectrometry introductionthis document contacting
GB/T 37051-2018 in English

GB/T 37051-2018 in English

VALID

Test method for determination of crystal defect density in PV silicon ingot and wafer

  • Issued on:2018-12-28
  • Implemented on:2019-04-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $160.00
$156.00
Standard No: GB/T 37051-2018
Document status: VALID
Title in English: Test method for determination of crystal defect density in PV silicon ingot and wafer
Title in Chinese: 太阳能级多晶硅锭、硅片晶体缺陷密度测定方法
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2018-12-28
Implemented on: 2019-04-01
ICS Classification: 29.045-Semiconducting materials
Chinese Classification: H80-Semimetal and semiconductor material in general
Professional Classification: GB-National Standard
Related Keywords: crystal defect density
test method
determination method
crystal defect density precision requirements repeatability deviation
international alignment main innovations test method chemical polishing
Related Topics: Density determination method
Density measurement standard
standard silicon wafer
m2 polycrystalline
crystal
silicon wafer
crystallization, degree
Crystal density
Silicon Wafer Inspection Method
crystallinity crystal
Spectrum of crystalline silicon
Wafer Diversity
method of producing crystals
How much crystallinity
Three-chip board machine
Polycrystalline and Amorphous
Silicon crystallization peak
method of making crystals
Density is too high
Amorphous and Polycrystalline
Bismuth Telluride Crystal Defects
Amorphous and polycrystalline
silicon transistor
defect density
defect density
What is the approximate defect density
Polysilicon Ingot Composition
Multi-directional
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not too dense
Silicon Single Wafer Orienter
Crystalline silicon material
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crystal structure defect
platelet cluster
How about solar panels
solar grade
GBT37051
GB/T 37051-2018
polycrystal analysis
Lattice density
How to determine single crystal and polycrystalline
Characterization methods of lattice defects
Crystal defect representation method
Solar wafer factory
Lattice defect characterization methods
Polycrystalline
Determination method of crystalline and amorphous
Silicon powder for polycrystalline silicon
Lens curvature detection method
A common way to distinguish crystals from amorphous is
Crystallinity test method
Polycrystalline silicon atmospheric emissions
Polysilicon purity
Polycrystalline silicon powder
Crystalline silicon detection method
Crystal bulk density detection method
Single crystal and polycrystalline analysis methods
How to distinguish single crystals from polycrystalline
Silicon wafer

《GB/T 37051-2018太阳能级多晶硅锭、硅片晶体缺陷密度测定方法》由TC203(全国半导体设备和材料标准化技术委员会)归口,主管部门为国家标准化管理委员会。


Introduction

1. Background of standard formulation and analysis of technological evolution

GB/T 37051-2018 is formulated based on the technological development needs in the field of semiconductor equipment and materials, and aims to standardize the determination method of crystal defect density of solar-grade multicrystalline silicon ingots and silicon wafers. The standard is under the jurisdiction of the National Technical Committee for Semiconductor Equipment and Materials Standardization, and was drafted with the joint efforts of many companies.

2. Comparative analysis of standard frameworks

Standard dimensions GB/T 37051—2018 International alignment Main innovations
Test method Chemical polishing and etching solution combined with microscope observation Aligned with international standards to meet the needs of the photovoltaic industry Optimized the etching solution ratio (1:4)
Scope of application Solar-grade multicrystalline silicon ingots and wafers Conforms to ISO international standard framework Added a new method for characterizing crystal defect density
Precision requirements Repeatability deviation is controlled within 5% Consistent with international precision standards Introduce statistical analysis methods (GB/T 6379.2-2004)

3. Implementation suggestions

Laboratory condition suggestions:

  • Equipped with a microscope with electronic image acquisition function (magnification ≥20 times)
  • Ambient air cleanliness reaches ISO Class 6 or higher
  • Equipped with an ultrasonic cleaning machine and a container resistant to hydrofluoric acid

Operational process suggestions:

  1. Sample preparation: Select silicon blocks and silicon wafers according to the standard and ensure that the surface treatment meets the requirements
  2. Chemical polishing: carried out in a fume hood, with strict control of time and temperature
  3. Defect observation: using the 9-point average method to ensure the representativeness of the test results

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