GB/T 32279-2015 in English
VALIDpecification for order entry format of silicon wafers
- Issued on:2015-12-10
- Implemented on:2017-01-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$262.00
| Standard No: | GB/T 32279-2015 |
| Document status: | VALID |
| Title in English: | pecification for order entry format of silicon wafers |
| Title in Chinese: | 硅片订货单格式输入规范 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 2015-12-10 |
| Implemented on: | 2017-01-01 |
| ICS Classification: | 29.045-Semiconducting materials |
| Chinese Classification: | H80-Semimetal and semiconductor material in general |
| Professional Classification: | GB-National Standard |
| Related Keywords: | silicon wafer order forms
silicon wafer order form input specification silicon wafer order form input specification gb/t32279-2015 silicon wafers silicon wafer |
| Related Topics: | silicon form
piece goods silicon wafer silicon way grid implantable chip Implantable Positioning Chip Silicon steel specification GBT32279 GB/T 32279-2015 Soldering lug specifications |
《GB/T 32279-2015硅片订货单格式输入规范》由TC203(全国半导体设备和材料标准化技术委员会)归口,主管部门为国家标准化管理委员会。
本标准规定了硅片订货单的格式要求和使用。?本标准适用于硅单晶研磨片、硅单晶抛光片、硅单晶外延片、太阳能电池用硅单晶切割片、太阳能电池用多晶硅片的订货单格式,其他半导体材料的订货单可参照本标准执行。
Introduction
In-depth interpretation of the silicon wafer order form input specification
GB/T32279-2015 "Silicon Wafer Order Form Input Specification" is an important standard in China's semiconductor material field, which aims to unify the format and content of silicon wafer order forms and ensure that the information of both supply and demand parties is accurate and transparent during the transaction process. This article will provide a detailed interpretation from four aspects: the background of standard formulation, technology evolution analysis, framework comparison and implementation suggestions.
Background and significance of standard formulation
With the rapid development of the semiconductor industry, silicon wafers are core materials, and their quality and technical parameters directly affect the performance of downstream products. However, in the actual transaction process, problems such as inconsistent order form and unclear information expression have seriously affected the efficiency of the supply chain.
The formulation of GB/T32279-2015 fills this gap in the industry. By standardizing the content and format of order forms, it ensures that both supply and demand parties have a consistent understanding of technical parameters and reduces quality disputes caused by information asymmetry.
Comparative Analysis of Standard Frameworks
| Characteristic Type | Project Content | Test Method | Scope of Application |
|---|---|---|---|
| Physical Performance Parameters | Growth Method, Crystal Orientation, Conductive Type, Resistivity, etc. | GB/T1550, GB/T1551, etc. | Applicable to all silicon wafer types |
| Crystal Integrity | Dislocation Density, Oxidation Induced Defects, etc. | GB/T1554, GB/T4058, etc. | Focus on High-tech Products |
| Geometric parameters | Diameter, thickness, curvature, etc. | GB/T14140, GB/T6618, etc. | General requirements, applicable to all silicon wafers |
Explanation of professional terms and practical application cases
Laser marking: Using laser to engrave supplier codes or other information on the wafer, common in high-end silicon wafer manufacturing. For example, in epitaxial wafer production, laser marking is used to ensure the traceability of each silicon wafer.
Radial resistivity variation: An important indicator to measure the consistency of the lateral resistivity of silicon wafers, widely used in the quality control of silicon wafers for solar cells.

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