GB/T 8756-2018 in English

VALID

Collection of metallographs on defects of germanium crystal

Issued on:2018-12-28
Implemented on:2019-07-01
File Format:PDF
Delivery:Via email within 5 business days

Price(USD)： $610.00
$592.00

Standard No:	GB/T 8756-2018
Document status:	VALID
Title in English:	Collection of metallographs on defects of germanium crystal
Title in Chinese:	锗晶体缺陷图谱
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 5 business days
Issued on:	2018-12-28
Implemented on:	2019-07-01
Superseding:	GB/T 8756-1988 Collection of metallographs on defects of crystalline germanium
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H80-Semimetal and semiconductor material in general
Professional Classification:	GB-National Standard
Related Topics:	Germanene the crystal crystal diagram Germanene+ crystal Exosome defect Sapphire Crystal Defect Map Phosphorus deficiency spectral distribution diagram Germanium Oxide Spectrum Statutory Atlas Level 1 Atlas Germanium Crystal Defect Map Spectrum of crystalline silicon Put the spectrogram chromosomal defect nature of the defect Test Spectrum Press defect nature Regulatory flaws defect nature Rotagram graft defect base body diagram genetic defect Bismuth Telluride Crystal Defects dna defect dna defect Crystals and grains defect time spin-coating defects Germanene Organic Atlas genetic defect crystal defect fetal defects Organic germanium Crystal diagram Twin pole figure fetal defects genetic defect laboratory defect twin map defective dna defective dna germanium sensor defect Distribution map polarographic defects Oxygen deficiency graphs and spectra level map germanium transistor Phosphorus deficiency Crystals and grains Primary Spectrum and Secondary Spectrum Broad Spectrum Distribution Map Propyl germanium Spectrum Primary Spectrum Secondary Spectrum Primary Spectrum Secondary Spectrum pole figure crystal Crystal grain All-in-one map time defect laboratory defect trap trap five cell defect Enzyme deficiency Germanium map Liquid Chromatography crystal structure defect Crystal Pole Figure Principle sample defect Forging defects GBT8756 GB/T 8756-1988 GB/T 8756-2018 Antispectral Nyquist plot AARS defects gs115 defective type PUC18 plasmid map xrd pattern Chromatogram range requirements XRD pattern and AAS pattern Mass spectrum animation sp3 carbon defect Germanium powder Crystal defect representation method Spin coating defects gb/t 8756-1988

《GB/T 8756-2018锗晶体缺陷图谱》由TC203（全国半导体设备和材料标准化技术委员会）、全国有色金属标准化技术委员会联合归口，TC203SC2（全国半导体设备和材料标准化技术委员会材料分会）执行，主管部门为国家标准化管理委员会。

Introduction

Technical Evolution and Core Changes of Standards

Technical Dimensions	GB/T 8756-1988	GB/T 8756-2018	Technical Improvement Points
Number of Atlases	34 defect atlases	44 newly added atlases	Increase of 29.4% of typical defect cases
Detection Methods	Basic Corrosion Method Only	Three new detection technologies including pulse plating	Detection sensitivity increased by 5-10 times
Defect classification	2 major categories and 12 minor categories	3 major categories and 18 minor categories	Newly added machining defect system

Technical analysis of key defect types

4.1 Typical defects of germanium polycrystal

Oxide defects: When a colored oxide film appears on the surface of the zone melting germanium ingot (see Figure 1), it indicates high-temperature oxidation or organic contamination. It is recommended to use the inert gas protection process, and the oxygen content needs to be controlled at <1ppm.

Void defects: They are divided into surface holes (Figures 3-4) and internal holes (Figure 5), and the main cause is the poor gas discharge during melt solidification. The standard recommends using a step cooling process (cooling rate <5℃/min) to reduce voids by more than 80%.

4.2 Core defects of germanium single crystal

Defect type	Crystal plane characteristics	Density control index	Elimination method
Vacancy cluster	(111) plane triangular pit, (100) plane square pit	<10³/cm²	Gradient cooling + dislocation introduction
Dislocation arrangement	Linear arrangement in [110] crystal direction	<100/cm²	Thermal field symmetry optimization
Impurity pipeline	Longitudinal stripes + arc section	Prohibited	Small plane effect control

Implementation and application suggestions

Production process optimization

For the scratch defects of germanium polishing sheet (Figure 105-106), it is recommended to:

Use diamond grinding liquid with particle size ≤0.5μm
Polishing pressure is controlled at 20-30kPa
Add online ultrasonic cleaning process

Detection technology selection

For PN junction detection (Figure 76), the priority is:

Barium titanate method: resolution of 1μm
Electrolytic corrosion method: suitable for batch testing

Technical value of the standard

The new version of the standard establishes a visual judgment system for germanium crystal defects through the digital representation of 44 typical defect maps, providing technical support for improving the qualified rate of germanium materials used in semiconductor devices. Among them, the systematic classification of mechanical processing defects (Chapter 4.3) fills the gap in international standards.

More samples: DL/T 368-2010 GB 18306-2015 DL/T 5154-2012

Sample only — not a preview of GB/T 8756-2018

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