GB/T 1554-2009 in English
VALIDTesting method for crystallographic perfection of silicon by preferential etch techniques
- Issued on:2009-10-30
- Implemented on:2010-06-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
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《GB/T 1554-2009硅晶体完整性化学择优腐蚀检验方法》由TC203(全国半导体设备和材料标准化技术委员会)归口,主管部门为国家标准化管理委员会。
本标准规定了用择优腐蚀技术检验硅晶体完整性的方法。
本标准适用于晶向为、或、电阻率为10-3 Ω・cm~104 Ω・cm、位错密度在0cm-2~105cm-2之间的硅单晶锭或硅片中原生缺陷的检验。
Scope
This standard specifies the method for testing the integrity of silicon crystals by preferential etching techniques. This standard applies to primary defects in silicon single crystal ingots or wafers with crystal orientation <111>, <100> or <110>, resistivity 10Ω•m~10Ω•m, and dislocation density between 0cm~10cm inspection. This method is also applicable to silicon single wafers.

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