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preferential etch techniques scopethis standard silicon crystals crystallographic perfection silicon techniques minimum energy storage scopethis standard genital chlamydia trachomatis infection
GB/T 1554-2009 in English

GB/T 1554-2009 in English

VALID

Testing method for crystallographic perfection of silicon by preferential etch techniques

  • Issued on:2009-10-30
  • Implemented on:2010-06-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $360.00
$350.00
Standard No: GB/T 1554-2009
Document status: VALID
Title in English: Testing method for crystallographic perfection of silicon by preferential etch techniques
Title in Chinese: 硅晶体完整性化学择优腐蚀检验方法
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2009-10-30
Implemented on: 2010-06-01
Superseding: GB/T 1554-1995 Test method for crystallographic perfection of silicon by preferential etch techniques
ICS Classification: 29.045-Semiconducting materials
Chinese Classification: H80-Semimetal and semiconductor material in general
Professional Classification: GB-National Standard
Related Keywords: preferential etch techniques scopethis standard
silicon crystals
crystallographic perfection
silicon
techniques
Related Topics: the crystal
High-quality chemical detection
integrity
Corrosive by Polarization
silicon crystal
overall experiment
method of producing crystals
silicon crystal
integrity detection method
Integrity testing + sterility
method of making crystals
integrity detection method
eutectic properties
choose the best
Crystal etch instrument
Excellent Qing of Chemistry Department
Excellent Qing of Chemistry Department
Silicon crystal
crystal integrity
GBT1554
GBT1554-1995
GB/T 1554-2009
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《GB/T 1554-2009硅晶体完整性化学择优腐蚀检验方法》由TC203(全国半导体设备和材料标准化技术委员会)归口,主管部门为国家标准化管理委员会。
本标准规定了用择优腐蚀技术检验硅晶体完整性的方法。
本标准适用于晶向为、或、电阻率为10-3 Ω・cm~104 Ω・cm、位错密度在0cm-2~105cm-2之间的硅单晶锭或硅片中原生缺陷的检验。


Scope

This standard specifies the method for testing the integrity of silicon crystals by preferential etching techniques. This standard applies to primary defects in silicon single crystal ingots or wafers with crystal orientation <111>, <100> or <110>, resistivity 10Ω•m~10Ω•m, and dislocation density between 0cm~10cm inspection. This method is also applicable to silicon single wafers.

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