GB/T 26066-2010 in English

VALID

Practice for shallow etch pit detection on silicon

Issued on:2011-01-01
Implemented on:2011-10-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $120.00
$117.00

Standard No:	GB/T 26066-2010
Document status:	VALID
Title in English:	Practice for shallow etch pit detection on silicon
Title in Chinese:	硅晶片上浅腐蚀坑检测的测试方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2011-01-01
Implemented on:	2011-10-01
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H80-Semimetal and semiconductor material in general
Professional Classification:	GB-National Standard
Related Keywords:	shallow etch pit detection shallow corrosion pits silicon scopethis standard n-type polished wafers shallow
Related Topics:	chip Crystalline detection Crystal orientation detection Silicon detection silicon wafer Corrosion detector pit Corrosion test piece carbon steel Detection test method Crystal form detection method Single crystal silicon inspection Detection of single crystal silicon Wafer inspection Electrode pad test method Silicon Block Inspection Silicon Wafer Inspection Method Self-corrosion potential test method Crystallization detection method Crystal orientation detection Single crystal silicon inspection Buried Inspection Corrosion Rate Test Method Crystallization detection method Jingbai detection Corrosion detector Corrosion test piece installation How to install the corrosion test piece How to detect single crystal silicon detection pit Crystal phase detection Silicone detection method Specimen Corrosion Apparatus Crystal etch instrument Corrosion detection Standard corrosion test piece corrosion Corrosion detection Twin detection method Crystal Form Detection silicon wafer for testing Silicon test piece pit detection Nickel Corrosion Test Method Detection method of silicon in water silicon detector Corrosion sheet measurement GBT26066 GB/T 26066-2010 corrosion pit Crystal image detection Silica gel detection method Chemical testing of silicon Crystal oscillator detection methods and techniques Shrapnel overcurrent detection method Crystalline silicon detection method Corrosion product chromium detection Tablet testing methods Crystallization tank liquid level detection method Crystal water detection method

《GB/T 26066-2010硅晶片上浅腐蚀坑检测的测试方法》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。

Scope

This standard specifies the inspection method for shallow corrosion pits caused by contamination on polished wafers or epitaxial surfaces by thermal oxidation and chemical preferential etching techniques. This standard is suitable for testing p-type or n-type polished wafers or epitaxial wafers with <111> or <100> crystal orientation, and the resistivity is greater than 0.001Ω·cm.

More samples: GB 50021-2001(2009) JGJ 94-2008 JJG 21-2008

Sample only — not a preview of GB/T 26066-2010

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