GB/T 16595-2019 in English
VALIDSpecification for a universal wafer grid
- Issued on:2019-03-25
- Implemented on:2020-02-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
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《GB/T 16595-2019晶片通用网格规范》由TC203（全国半导体设备和材料标准化技术委员会）归口，TC203SC2（全国半导体设备和材料标准化技术委员会材料分会）执行，主管部门为国家标准化管理委员会。
Introduction
In-depth interpretation of GB/T 16595—2019 Wafer General Grid Specification
1. Background and significance of the standard
GB/T 16595—2019 Wafer General Grid Specification is an important standard in the semiconductor industry, mainly used to quantitatively describe the grid pattern of surface defects of circular semiconductor wafers. This standard replaces the previous GB/T16595—1996 version. The main technical changes include:
- The scope of application has been increased, and it is clearly applicable to silicon wafers and other semiconductor material wafers with a nominal diameter of $100\mathrm{mm}{\sim}200\mathrm{mm}$.
- The relevant content of the grid unit plan view has been modified, and Table 2 has been added to clarify the grid circle diameter under different wafer specifications.
- Some normative references have been deleted, and GB/T 30453 has been added.
2. Comparison of standard frameworks
| Standard content | 1996 edition | 2019 edition |
|---|---|---|
| Scope of application | Nominal diameter range is not specified | Applicable to silicon wafers and other semiconductor material wafers with a diameter of $100\mathrm{mm}{\sim}200\mathrm{mm}$ |
| Grid unit plan view | Calculation method of grid circle diameter is not specified | Added Table 2 to clarify the grid circle diameters under different wafer specifications |
| Normative references | Including GB/T1554, YS/T209, etc. | Delete the above files and add GB/T 30453 |
3. Standard Implementation Suggestions
3.1 Implementation Steps
- Determine the scope of application:Select the appropriate grid specification according to the nominal diameter of the wafer.
- Prepare tools and materials:Including transparent grid covering film, defect observation equipment and related software.
- Apply grid for defect detection:Cover the grid on the wafer surface and quantitatively evaluate the defect area by counting the number of grid cells containing defects.
3.2 Application Examples
For example, when applying this standard to a silicon wafer with a diameter of 150 mm, it is necessary to refer to Table 2 to select an appropriate mesh outer diameter. By superimposing the mesh on the wafer defect pattern, counting the number of mesh cells containing defects, and dividing it by 10, the percentage of defect area can be obtained.
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