Wafer Diversity

Wafer Diversity, Total:87 items.

The international standard classification for "Wafer Diversity" includes: Semiconducting materials , Diagnostic equipment , Other non-ferrous metals and their alloys , Insulating gases , Motion picture films. Cartridges , Semiconductor devices , Electricity. Magnetism. Electrical and magnetic measurements , Measurement of electrical and magnetic quantities , Laboratory ware and related apparatus .

The Chinese standard classification for "Wafer Diversity" includes: Compound semiconductor material , Semimetal , Elemental semiconductor material , Medical apparatus and devices in general , Rare scattered metals and their alloys , Photosensitive material , Semiconductor discrete devices in general , Radio Measurement , Semimetal and semiconductor material in general , Metal physical property test method .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 11072-1989 Indium antimonide polycrystal, single crystals and as-cut slices
GB/T 29055-2012 Multi-crystalline silicon wafer for solar cell
GB/T 42706.5-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 5：Die and wafer devices
GB/T 5238-2009(英文版) Monocrystalline germanium and monocrystalline germanium slices
GB/T 12963-1996 Polycrystalline silicon
GB/T 15713-1995 Monocrystalline germanium slices
GB/T 12963-2009 Specification for Polycrystalline Silicon
GB/T 29889-2013 DNA microarray for disease susceptibility DNA polymorphisms
GB/T 29055-2019(英文版) Multi crystalline silicon wafers for photovoltaic solar cell
GB/T 5238-2009e Monocrystalline germanium and monocrystalline germanium slices
GB/T 5238-2009 Monocrystalline germanium and monocrystalline germanium slices
GB/T 11072-2009 Indium antimonide polycrystal,single crystals and as-cut slices
GB/T 6848-1986 Dimensions of the cores for motion-picture film rolls

Group Standards of the People's Republic of China

T/JSSIA 0003-2017 Series Programs for Wafer Level Chip Scale Package
T/GDBX 036-2020 Polychromatic integrated Polyethylene spirally enwound solid-wall pipes
T/SZBX 018-2021 Products of Wafer Level Chip Scale Package
T/CECA 48-2021 Quartz Crystal Microbalance Element
T/CBCSA 36-2021 Corundum polycrystalline slab
T/JSSIA 0004-2017 Outline Dimensions of Wafer Level Chip Scale Package

Hebei Provincial Standard of the People's Republic of China

DB13/T 1633-2012 Solar Grade Polysilicon Wafer

Professional Standard - Non-ferrous Metal

YS/T 1061-2015 Silicon core for polysilicon by improved siemens method

National Metrological Verification Regulations of the People's Republic of China

JJG 48-2004 Verification Regulation of Standard Slice of Single Crystal Silicon Resistivity
JJG 48-1990 Verification Regulation of Standard Slice of Single Crystal Silicon Resistivity

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 5238-2019 Monocrystalline germanium and monocrystalline germanium slices
GB/T 37051-2018 Test method for determination of crystal defect density in PV silicon ingot and wafer
GB/T 29055-2019 Multicrystalline silicon wafers for photovoltaic solar cell
GB/T 19346.3-2021 Methods of measurement of amorphous and nanocrystalline alloys-Part 3:AC magnetic properties of Fe-based amorphous strip using a single sheet specimen

工业和信息化部

SJ/T 11758-2020 Test method for determining the aspect ratio of solar cell's grid line electrode by confocal laser scanning microscope

Fujian Provincial Standard of the People's Republic of China

DB35/T 1403-2013 Multi-chip integrated package LED downlight for lighting

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

GB/T 34324-2017 Technical requirement of microarray biochip spotter

未注明发布机构

DIN ISO 16463 E:2014-11 Polycrystalline diamond inserts, tipped - Dimensions, types

National Metrological Technical Specifications of the People's Republic of China

JJF 1760-2019 Calibration Specification for Standard Slices of Single Crystal Silicon Resistivity

Taiwan Provincial Standard of the People's Republic of China

CNS 13198-1993 Fixed Multilayer Ceramic Chip Capacitors for Use in Electronic Equipment

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC D-330 SECTION 9-1992 Section Nine Multichip Modules
IPC MC-790-1992 Guidelines for Multichip Module Technology Utilization
IPC DD-135-1995 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

(U.S.) Ford Automotive Standards

FORD WSK-M8G251-A-1997 GASKET, MULTI PLY, STEEL CORE, FPM

Korean Agency for Technology and Standards (KATS)

KS D 2715-2006 Tensile specimen of single- and poly-crystal nano/micro thin film materials
KS D 2715-2017 Tensile specimen of single- and poly-crystal nano/micro thin film materials
KS D 0070-2002(2022) Method of test for magnetic properties of amorphous metals using single sheet specimen
KS D 2715-2006(2011) Tensile specimen of single- and poly-crystal nano/micro thin film materials
KS D 0070-2002(2017) Method of test for magnetic properties of amorphous metals using single sheet specimen
KS C 6489-1991(2001) FIXED MULTILAYER CERAMIC CHIP CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT
KS D 0070-2022 Method of test for magnetic properties of amorphous metals using single sheet specimen

U.S. Military Regulations and Norms

ARMY MIL-M-48646 VALID NOTICE 2-2013 Microcircuit, Digital, SCO/DLA Multichip CMOS
ARMY QPL-55681-QPD-2010 Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric

SCC

MIL MIL-M-48646-1986 MICROCIRCUIT, DIGITAL,SCO/DLA MULTICHIP CMOS
UNE 20703:1992 MULTIFIBER OPTICAL CABLES.
MIL MIL-M-38510/121B-2004 MICROCIRCUITS, LINEAR MONOLITHIC AND MULTICHIP, SILICON 12 BIT DIGITAL-TO-ANALOG CONVERTERS (SUPERSEDING MIL-M-38510/121A)

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD51-50-2012 Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs)
JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection
JEDEC JEP160-2011 Long-Term Storage for Electronic Solid-State Wafers, Dice, and Devices
JEDEC JESD51-32-2010 EXTENSION TO JESD51 THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
JEDEC JEP133B-2005 Guide for the Production and Acquisition of Radiation-Hardness- Assured Multichip Modules and Hybrid Microcircuits

IPC - Association Connecting Electronics Industries

IPC MC-790 CD-1992 Guidelines for Multichip Module Technology Utilization
IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
IPC/EIA J-STD-028 CD-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC/EIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps

German Institute for Standardization

DIN V VDE V 0126-18-3:2007 Solar wafers - Part 3: Alkaline corrosion damage of crystalline silicon wafers - Method of determining the corrosion rate of mono and multi crystalline silicon wafers (as cut)
DIN ISO 16463:2005 Polycrystalline diamond inserts, tipped - Dimensions, types (ISO 16463:2004);English version of DIN ISO 16463:2005
DIN ISO 16463:2015 Polycrystalline diamond inserts, tipped - Dimensions, types (ISO 16463:2014)

Association Francaise de Normalisation

NF E66-314:2004 Polycrystalline diamond inserts, tipped - Dimensions, types.
NF E66-314*NF ISO 16463:2014 Polycristalline diamond inserts, tipped - Dimensions, types

Defense Logistics Agency

DLA SMD-5962-94667-1995 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON
DLA SMD-5962-81008 REV B-2008 MICROCIRCUIT, LINEAR, MONOLITHIC AND MULTICHIP, 12-BIT DIGITAL-TO-ANALOG CONVERTERS
DLA DSCC-DWG-04052-2006 CAPACITOR, FIXED, MULTIPLE ANODE POLYMER TANTALUM CHIP
DLA MIL-M-38510/111 A VALID NOTICE 1-2008 Microcircuits, Analog Switch with Driver, Monolithic and Multi- Chip Silicon
DLA SMD-5962-96847 REV B-2005 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON
DLA MIL-M-38510/111 A VALID NOTICE 2-2008 Microcircuits, Analog Switch with Driver, Monolithic and Multi- Chip Silicon
DLA DSCC-DWG-13008-2013 CAPACITORS, FIXED, MULTIPLE ANODE TANTALUM, CHIP, CONFORMAL COATED CASE
DLA SMD-5962-92061 REV G-2008 MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER

International Organization for Standardization (ISO)

ISO 16463:2014 Polycristalline diamond inserts, tipped - Dimensions, types
ISO 16463:2004 Polycristalline diamond inserts, tipped - Dimensions, types

GSO

BH GSO ISO 16463:2016 Polycristalline diamond inserts, tipped -- Dimensions, types

CZ-CSN

CSN 34 9018-1969 Straight winded up multicore jointing box with three lead inserts type SVN
CSN 34 5911-1986 Polycrystalline silicion
CSN 42 4991-1970 Polycristallinic germanium